Abstract: A method for testing a characteristic impedance of a signal path routing of a printed circuit board (PCB) controls the test device to test a characteristic impedance of the signal path routing of the PCB to get test data of the signal path routing of the PCB. The method further analyzes the test data of the signal path routing of the PCB get analysis results, generate a test report for storing the test data of each signal path routing of the PCB and the analysis results if all signal path routings of the PCB have been tested.

Abstract: An electronic device includes a wiring unit. The wiring unit creates one or more circuit diagrams for a design of a first circuit board, and setting electrical rules for components of the first circuit board in each of the one or more diagrams. Based on the one or more diagrams having the electrical rules, the wiring unit generates a wiring diagram for the design of the first circuit board by executing a wiring application. If a second circuit board desires to use a circuit diagram of the first circuit board, the wiring unit copies the circuit diagram having the electrical rules into the wiring application. Then, based on the copied circuit diagram having the electrical rules and particular circuit diagrams of the second circuit board, and the wiring unit creates a wiring diagram for the design of the second circuit board by executing the wiring application.

Abstract: In a method for regulating a mechanical arm using a control computer. The method obtains a first position and a second position of a center of an image plane of an image capturing device on the mechanical arm by controlling movements of the mechanical arm, and calculates a movement vector from the first position to the second position. The method further calculates a regulating angle according to the movement vector and an axial vector of the mechanical arm, and moves the mechanical arm according to the regulating angle such that the axial vector is perpendicular to a measurement plane determined by the first object and the second object.

Abstract: A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.

Abstract: A robot arm includes a support arm, an adjusting rod and a detecting unit. The adjusting rod rotatably extends through the support arm. The detecting unit is attached to the adjusting rod. The detecting unit includes an image capture device and a probe device. The image capture device captures images of a workpiece. The probe device includes a driving device and a probe. The driving device may drive the probe to move between a first position where the probe does not visually prevent images of the workpiece being captured by the image capture device, and a second position where the probe does block the images of the workpiece being captured by the image capture device.

Abstract: In a method for inspecting the layout of a printed circuit board (PCB), a component to be checked is determined from an electronic layout diagram of the PCB, and a power transmission line which may be serving that component is selected. The layout diagram is checked to determine whether the component is connected to the power transmission line, and further checked to determine whether more than one ground pins of the component is connected to the power transmission line. Vias that are shared by two or more ground pins of the component are determined if more than one ground pin is connected to the power transmission line. Shared vias are marked on the layout diagram.

Abstract: A printed circuit board (PCB) includes a top layer, a memory controller, two gaps, and two connectors. The memory controller is located on the top layer. A number of golden fingers are respectively set on the top layer near each gap and electrically connected to the memory controller. Each connector includes a first slot to hold the gold fingers near a corresponding one of the gaps and a second slot to hold a number of gold fingers of a corresponding one of two memory chips. The first slot is electrically connected to the second slot. Each memory chip and the PCB are coplanar.

Abstract: An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

Abstract: A pad includes a first mating section and a second mating section. The first mating section includes a first horizontal plane and a first inclined plane. The second mating section includes a second horizontal plane and a second inclined plane. The first mating section is a copper foil capable of being connected to a wire. The second mating section is made of insulating material. The first inclined plane and the second inclined plane are bonded together.

Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.

Abstract: In a method for checking layout of a printed circuit board (PCB) using an electronic device, a power line is selected from a layout diagram of the PCB. The method searches for one or more signal lines which are overlapping with the selected power line from the layout diagram of the PCB. The method further locates attribute data of the searched signal lines and the selected power line in the layout diagram of the PCB, and displays the attribute data of the searched signal lines and the selected power line on a display device of the electronic device.

Abstract: A system and method uses a measurement control device and a measurement machine to measure pin voltages of electronic components installed in an electronic device. The measurement control device controls a mechanical arm of the measurement machine to move to the pins of the electronic components according to coordinates of the pins. A voltage probe installed on the end of the mechanical arm can measure voltages of the pins automatically.

Abstract: An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.

Abstract: An exemplary guideway mechanism includes two branches, a group of connecting blocks, and a supporting bracket. The group of connecting blocks includes four connecting blocks arranged at four corners of an imaginary square and connecting the supporting bracket. Each branch includes two parallel rails. Adjacent ends of the rails of each branch respectively connect two adjacent connecting blocks.

Abstract: A circuit board includes a current balancing unit that receives a number of current values from ammeters. A minimum current value between the current values is determined by the current balancing unit. Resistance of one or more variable resistors of the current balancing unit is adjusted by the current balancing unit to make the current value from one or more the ammeters serially connected to the one or more the variable resistors to be substantially equal to the minimum current value.

Abstract: A system and method for testing derating performance of a component obtains a component list, a pin list, and a standard derating list of the electronic device from a storage. The system and method further receives parameters of each component, the parameters of each component comprising voltages of two pins of the component and a working temperature of the component, calculates a working voltage and a derating ratio of the component according to the parameters. The system and method also analyzes the working voltage and the derating ratio of the component to get analysis result, generates a test report comprising the derating ratio, the working temperature, the analysis results of each component in the component list, and storing the test report in the storage.

Abstract: A test probe includes a filtering unit and a contact unit. The filtering unit includes an inductive component, a capacitive component, and an insulation component insulates the inductive component from the capacitive component. The contact unit contacts a test point to get a test signal. The filtering unit filters noise from the test signal. The test probe can be assembled and disassembled easily, and parameters of the filtering unit can be changed by changing structure of each component.

Abstract: A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.

Abstract: A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

Abstract: A printed circuit board (PCB) includes a top signal layer, a bottom signal layer, a ground layer, a plurality of vias, and at least two ground vias. Both the top signal layer and the bottom signal layer include at least one protection line. The ground layer is located between the top signal layer and the bottom signal layer. The at least two ground vias extend through the PCB and are located adjacent to the vias on the PCB. The at least two ground vias are electrically connected to the ground layer to conduct noise signals, and the at least two ground vias are electrically connected by the protection lines to insulate noise signals.