Patents by Inventor Shou-Kuo Hsu

Shou-Kuo Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120241232
    Abstract: An actuating mechanism includes first and second hollow outer shafts, two rotating wheels located between the first and second outer shafts, and an inner shaft received in the second outer shaft. Each of the first and second outer shafts forms a connecting portion at one end thereof. Each connecting portion defines two receiving holes. Each rotating wheel includes a body and a rod extending through the body. The bodies of the rotating wheels are in contact with each other. Two ends of the rod of each rotating wheel are correspondingly received in the receiving holes of the first and second outer shafts to connect the first and second outer shafts together. One end of the inner shaft contacts the rod of one rotating wheel. The inner shaft is rotatable in the second outer shaft to drive the two rotating wheels to rotate.
    Type: Application
    Filed: June 30, 2011
    Publication date: September 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHEN-CHUN LI, HSIEN-CHUAN LIANG, SHOU-KUO HSU
  • Publication number: 20120245900
    Abstract: A design method generates a plurality of groups of experimental conditions, each of the groups of experimental conditions includes performance variables for an electronic product with nonlinear performance. The method simulates values to the groups of experimental conditions, computes an average value, and divides the groups of experimental conditions into a first part and a second part. The values in the first part is greater than the average value and the values in the second part is less than the average value. The method computes nonlinear boundary values of a refining mechanism based on the values, and determines a threshold value of the refiner. After refining the groups of experimental conditions, the method calculates the deviation of each value from the threshold value, and determines the groups of experimental conditions with the greatest deviations as optimal groups of experimental conditions.
    Type: Application
    Filed: December 23, 2011
    Publication date: September 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-HSIEN LEE, HSIAO-YUN SU, SHOU-KUO HSU
  • Publication number: 20120241201
    Abstract: A circuit board includes a substrate and a copper layer positioned on the substrate. The copper layer includes a BGA area and a non-BGA area, and includes traces. The widths of the traces in the BGA area are smaller than the widths of the traces in the non-BGA area, the dielectric coefficient of the substrate in the BGA area is greater than the dielectric coefficient of the substrate in the non-BGA area for keeping the impedance of the traces consistent in the BGA area and in the non-BGA area.
    Type: Application
    Filed: May 15, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HUA-LI ZHOU, CHIA-NAN PAI, SHOU-KUO HSU
  • Publication number: 20120243193
    Abstract: A motherboard interconnection method includes positioning a first and a third electronic elements on a top layer of a motherboard interconnection device, and positioning a second and a fourth electronic elements on a bottom layer of the motherboard interconnection device. The method connects a first end of the first electronic element on the top layer to the first end of the second electronic element on the bottom layer with a first via hole, and connects the first end of the third electronic element on the top layer to the first end of the fourth electronic element on the bottom layer with a second via hole. The method further connects a second ends of the two electronic elements on the top layer to a first part, and connects the second ends of the two electronic elements on the bottom layer to a second part.
    Type: Application
    Filed: June 7, 2012
    Publication date: September 27, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8275369
    Abstract: A method of automatically testing a mobile communication terminal selects a communication frequency band for testing the mobile communication terminal. The mobile communication terminal switches to the selected communication frequency band. One or more service modes, of the mobile communication terminal, which need to be tested under the selected communication frequency band are selected, and a test sequence of the one or more service modes is set. The mobile communication terminal using one of the service modes. Test data of the mobile communication terminal is obtained according to a preset use duration, a test frequency and the test interval of each service mode. A report is generated using the test data.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: September 25, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Hsien-Chuan Liang, Chun-Neng Liao, Shou-Kuo Hsu
  • Patent number: 8272141
    Abstract: An exemplary probe apparatus includes a fixture, a first probe assembly, a motor, a lead screw, two guide members, a second probe, and a reduction gear unit. The first probe assembly is fixedly attached to the fixture and includes a first probe. The motor has a drive shaft attached to the fixture. The lead screw is coupled to the fixture. The two guide members are attached to the fixture and parallel to the lead screw. The second probe assembly is moveably attached to the lead screw and the at least one guide member, and includes a second probe. The reduction gear unit is coupled to the drive shaft and the lead screw to transmit power from the motor to the second probe assembly through the lead screw. The second probe assembly is configured for moving the second probe towards or away from the first probe along the two guide members.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: September 25, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Shou-Kuo Hsu, Hsien-Chuan Liang, Ying-Tso Lai
  • Publication number: 20120234590
    Abstract: A printed circuit board includes first to sixth layers, and first to third traces. The first trace is arranged on the first layer. The second trace is arranged on the third layer. The third trace is arranged on the sixth layer. The second trace is electrically connected to the first trace through a first vertical interconnection access (via). The second trace is electrically connected to the third trace through a second via.
    Type: Application
    Filed: April 28, 2011
    Publication date: September 20, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: MING WEI, NING LI, CHIA-NAN PAI, SHOU-KUO HSU
  • Patent number: 8270180
    Abstract: A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: September 18, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Hung Liu, Shou-Kuo Hsu, Yu-Chang Pai, Po-Chuan Hsieh
  • Patent number: 8269506
    Abstract: A signal integrity test system and method uses an oscilloscope to test a signal on each test point of a transmission line, obtains test parameter values of the signal on each test point, and compares the test parameter values with preset standard values. If any test parameter value does not match a corresponding preset standard value, a time-domain reflectometer is used to test an impedance value of the test point. If the impedance value matches a standard impedance value of the transmission line, the system and method determines the signal on the test point satisfies integrity requirements.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: September 18, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsien-Chuan Liang, Shen-Chun Li, Shou-Kuo Hsu
  • Patent number: 8263877
    Abstract: A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: September 11, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chien-Hung Liu, Po-Chuan Hsieh, Yu-Chang Pai, Shou-Kuo Hsu
  • Publication number: 20120221989
    Abstract: An electronic device and method of automatically testing the transmission lines of a PCB. Design requirements of transmission lines are predetermined and a wiring diagram is acquired according to a designated wiring diagram storage path. Some basic parameters of each transmission line of the diagram are applied in excluding one or more transmission lines which may not meet the design requirements, then, the excluded transmission lines are marked and/or highlighted. A report of the transmission lines is generated using a report template.
    Type: Application
    Filed: December 15, 2011
    Publication date: August 30, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIEN-CHUAN LIANG, SHEN-CHUN LI, SHIN-TING YEN, CHUN-NENG LIAO, SHOU-KUO HSU
  • Patent number: 8255424
    Abstract: A system, storage medium, and method for structuring data are provided. The system connects to a storage device that stores original data. The method obtains the original data from the storage device, and stores the original data in the form of character strings into a buffer memory according to end of file-line (EOF) tags. The method further constructs data arrays to store the character strings, and arranges each of the data arrays into a data matrix. In addition, the method classifies each of the data arrays in the data matrix according to properties of the character strings, arranges the classified data arrays into a data file, and stores the data file into the buffer memory.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Yung-Chieh Chen, Shou-Kuo Hsu
  • Patent number: 8255862
    Abstract: A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsung-Sheng Huang, Chun-Jen Chen, Duen-Yi Ho, Wei-Chieh Chou, Hsien-Chuan Liang, Shou-Kuo Hsu
  • Patent number: 8253031
    Abstract: A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yung-Chieh Chen, Cheng-Hsien Lee, Shou-Kuo Hsu, Shen-Chun Li, Hsien-Chuan Liang, Shin-Ting Yen
  • Patent number: 8255177
    Abstract: A system and method for calibrating oscillograph channels assigns the same value to a drawing parameter of each channel. Each channel receives a signal sent by a signal generator. The oscillograph calculates a voltage difference between a standard signal voltage of a standard channel defined by a user and a signal voltage of each of the other channels. A sequence relationship between each of the other channels and the standard channel is determined. The oscillograph adjusts a deskew value of each of the other channels until each voltage difference is in an allowable range according to the sequence relationship.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsien-Chuan Liang, Shen-Chun Li, Shou-Kuo Hsu
  • Patent number: 8251195
    Abstract: A bearing includes a main body, a plurality of first magnetic members, a plurality of second magnetic members, and a plurality of friction members. The main body defines a pivot hole, and a plurality of first receiving portions and a plurality of second receiving portions around the pivot hole. Each of the second receiving portions defines a cutout. The first magnetic members are received in the first receiving portions. The second magnetic members together with the friction members are received in the second receiving portions, thus generating a repelling force between the first magnetic members and the second magnetic members to impel the friction members to partially extend out of the cutouts.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang, Shin-Ting Yen, Hung Chao
  • Patent number: 8253038
    Abstract: An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Chang Pai, Chien-Hung Liu, Po-Chuan Hsieh, Shou-Kuo Hsu
  • Patent number: 8255864
    Abstract: A computing device and a method selects a signal transmission line from a circuit board, computes an actual length of each line segment of the selected signal transmission line, and computes an actual distance between each line segment of the selected signal transmission line and a corresponding line segment of each neighboring signal transmission line. If each actual length is less than or equal to a corresponding reference length and each actual distance is more than or equal to a corresponding reference distance, the device and method determines a design of the selected signal transmission line satisfies the design standards. Otherwise, if any actual length is more than a corresponding reference length, or if any actual distance is less than a corresponding reference distance, the device and method determines the design of the signal transmission line does not satisfy the design standards.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: August 28, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jia-Lu Ye, Shi-Piao Luo, Chia-Nan Pai, Shou-Kuo Hsu
  • Patent number: 8255866
    Abstract: A computing device and a method involves selection of one or more transmission lines from a printed circuit board (PCB) layout file, reading a transmission line from the one or more selected transmission lines, and determining neighboring anti-pads of the read transmission line in the PCB layout file. The computing device and method further determine an actual distance between the read transmission line and a neighboring anti-pad. If the actual distance is less than a preset standard distance, the computing device and method determine that the read transmission line and the neighboring anti-pad do not satisfy design requirements, and highlight the read transmission line and the neighboring anti-pad, to prompt a user to amend design of the read transmission line and the neighboring anti-pad.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: August 28, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Han-Long Chen, Shi-Piao Luo, Cheng-Hsien Lee, Chia-Nan Pai, Shou-Kuo Hsu
  • Publication number: 20120214473
    Abstract: A method of automatically testing a mobile communication terminal selects a communication frequency band for testing the mobile communication terminal. The mobile communication terminal switches to the selected communication frequency band. One or more service modes, of the mobile communication terminal, which need to be tested under the selected communication frequency band are selected, and a test sequence of the one or more service modes is set. The mobile communication terminal using one of the service modes. Test data of the mobile communication terminal is obtained according to a preset use duration, a test frequency and the test interval of each service mode. A report is generated using the test data.
    Type: Application
    Filed: November 10, 2011
    Publication date: August 23, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHEN-CHUN LI, HSIEN-CHUAN LIANG, CHUN-NENG LIAO, SHOU-KUO HSU