Abstract: A method of forming semiconductor device uses non-implant process to form doped layers, and thus is applicable for large-size display panel. The method of forming semiconductor device uses annealing process to reduce the resistance of the doped layers, which improves the electrical property of the semiconductor device. A first dielectric layer of the semiconductor device is able to protect a semiconductor layer disposed in a first region of the substrate from being damaged during the process, and an etching stop layer of the semiconductor device is able to protect the semiconductor layer disposed in a second region of the substrate from being damaged when defining second doped layers. The first dielectric layer and the etching stop layer are formed by the same patterned dielectric layer, thus no extra process is required, fabrication cost is reduced, and yield is increased.

Abstract: A semiconductor device and method of making the same are provided. The method of forming semiconductor device uses non-implant process to form doped layers, and thus is applicable for large-size display panel. The method of forming semiconductor device uses annealing process to reduce the resistance of the doped layers, which improves the electrical property of the semiconductor device. A first dielectric layer of the semiconductor device is able to protect a semiconductor layer disposed in a first region of the substrate from being damaged during the process, and an etching stop layer of the semiconductor device is able to protect the semiconductor layer disposed in a second region of the substrate from being damaged when defining second doped layers. The first dielectric layer and the etching stop layer are formed by the same patterned dielectric layer, thus no extra process is required, fabrication cost is reduced, and yield is increased.

Abstract: A thin film transistor device includes a first conductivity type thin film transistor and a second conductivity type thin film transistor. The first conductivity type thin film transistor includes a first patterned doped layer, a first gate electrode, a first source electrode, a first drain electrode and a first semiconductor pattern. The second conductivity type thin film transistor includes a second patterned doped layer, a second gate electrode, a second source electrode, a second drain electrode and a second semiconductor pattern. The first semiconductor pattern and the second semiconductor pattern form a patterned semiconductor layer. The first patterned doped layer is disposed under the first semiconductor pattern, and the second patterned doped layer is disposed on the second semiconductor pattern.

Abstract: A semiconductor device and method of making the same are provided. The method of forming semiconductor device uses non-implant process to form doped layers, and thus is applicable for large-size display panel. The method of forming semiconductor device uses annealing process to reduce the resistance of the doped layers, which improves the electrical property of the semiconductor device. A first dielectric layer of the semiconductor device is able to protect a semiconductor layer disposed in a first region of the substrate from being damaged during the process, and an etching stop layer of the semiconductor device is able to protect the semiconductor layer disposed in a second region of the substrate from being damaged when defining second doped layers. The first dielectric layer and the etching stop layer are formed by the same patterned dielectric layer, thus no extra process is required, fabrication cost is reduced, and yield is increased.

Abstract: A thin film transistor device includes a first conductivity type thin film transistor and a second conductivity type thin film transistor. The first conductivity type thin film transistor includes a first patterned doped layer, a first gate electrode, a first source electrode, a first drain electrode and a first semiconductor pattern. The second conductivity type thin film transistor includes a second patterned doped layer, a second gate electrode, a second source electrode, a second drain electrode and a second semiconductor pattern. The first semiconductor pattern and the second semiconductor pattern form a patterned semiconductor layer. The first patterned doped layer is disposed under the first semiconductor pattern, and the second patterned doped layer is disposed on the second semiconductor pattern.