Patents by Inventor Shou-sung Chang
Shou-sung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109163Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.Type: ApplicationFiled: December 12, 2023Publication date: April 4, 2024Inventors: Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Jianshe Tang, Hui Chen, Hari Soundararajan, Brian J. Brown
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Patent number: 11919123Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.Type: GrantFiled: June 29, 2021Date of Patent: March 5, 2024Assignee: Applied Materials, Inc.Inventors: Surajit Kumar, Hari Soundararajan, Hui Chen, Shou-Sung Chang
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Publication number: 20240066664Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.Type: ApplicationFiled: August 1, 2023Publication date: February 29, 2024Inventors: Shou-Sung CHANG, Hui CHEN, Haosheng WU, Jianshe TANG, Sidney P. HUEY, Jeonghoon OH, Chad POLLARD, Chih Chung CHOU, Sameer A. DESHPANDE
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Publication number: 20240066660Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Patent number: 11897079Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.Type: GrantFiled: March 26, 2020Date of Patent: February 13, 2024Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
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Publication number: 20240042570Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.Type: ApplicationFiled: July 25, 2023Publication date: February 8, 2024Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Jonathan P. Domin, Shuchivrat Datar, Yasuhiro Hori, Sameer Deshpande, Chad Pollard, Sih-Ling Yeh, Priscilla Diep, Ningzhuo Cui, Brian J. Brown, Hui Chen
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Publication number: 20240042571Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.Type: ApplicationFiled: October 18, 2023Publication date: February 8, 2024Applicant: Applied Materials, Inc.Inventors: Chih Chung CHOU, Anand Nilakantan IYER, Ekaterina A. MIKHAYLICHENKO, Christopher Heung-Gyun LEE, Erik RONDUM, Tiffany Yu-nung CHEUNG, Shou-Sung CHANG
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Publication number: 20240025006Abstract: A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to control a temperature of the polishing pad, and a control system. The control system is configured to obtain a baseline removal rate, a baseline temperature and a baseline polishing liquid flow rate. A function is stored relating removal rate to polishing liquid flow rate and temperature. The function is used to determine a reduced polishing liquid flow rate and an adjusted temperature such that a resulting removal rate is not below the baseline removal rate. The liquid flow controller is controlled to dispense the polishing liquid at the reduced polishing liquid flow rate and control the temperature control system so that the polishing process reaches the adjusted temperature.Type: ApplicationFiled: September 29, 2023Publication date: January 25, 2024Inventors: Haosheng Wu, Jianshe Tang, Brian J. Brown, Shih-Haur Shen, Shou-Sung Chang, Hari Soundararajan
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Patent number: 11865671Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.Type: GrantFiled: April 15, 2020Date of Patent: January 9, 2024Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan, Benjamin Cherian
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Publication number: 20230415297Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.Type: ApplicationFiled: September 12, 2023Publication date: December 28, 2023Inventors: Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu
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Publication number: 20230415296Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.Type: ApplicationFiled: August 18, 2023Publication date: December 28, 2023Inventors: Shou-Sung Chang, Hari Soundararajan, Haosheng Wu, Jianshe Tang
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Publication number: 20230390895Abstract: A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.Type: ApplicationFiled: October 17, 2022Publication date: December 7, 2023Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Jeonghoon Oh, Chad Pollard, Chih Chung Chou, Ningzhuo Cui, Hui Chen
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Patent number: 11833637Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.Type: GrantFiled: June 28, 2021Date of Patent: December 5, 2023Assignee: Applied Materials, Inc.Inventors: Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu
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Publication number: 20230381922Abstract: A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.Type: ApplicationFiled: October 26, 2022Publication date: November 30, 2023Inventors: Chad Pollard, Shou-Sung Chang, Haosheng Wu
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Publication number: 20230387625Abstract: A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.Type: ApplicationFiled: October 26, 2022Publication date: November 30, 2023Inventors: Chad Pollard, Shou-Sung Chang, Haosheng Wu
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Patent number: 11826872Abstract: A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to control a temperature of the polishing pad, and a control system. The control system is configured to obtain a baseline removal rate, a baseline temperature and a baseline polishing liquid flow rate. A function is stored relating removal rate to polishing liquid flow rate and temperature. The function is used to determine a reduced polishing liquid flow rate and an adjusted temperature such that a resulting removal rate is not below the baseline removal rate. The liquid flow controller is controlled to dispense the polishing liquid at the reduced polishing liquid flow rate and control the temperature control system so that the polishing process reaches the adjusted temperature.Type: GrantFiled: June 24, 2021Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Jianshe Tang, Brian J. Brown, Shih-Haur Shen, Shou-Sung Chang, Hari Soundararajan
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Patent number: 11819976Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.Type: GrantFiled: June 25, 2021Date of Patent: November 21, 2023Assignee: Applied Materials, Inc.Inventors: Chih Chung Chou, Anand Nilakantan Iyer, Ekaterina Mikhaylichenko, Christopher Heung-Gyun Lee, Erik Rondum, Tiffany Yu-Nung Cheung, Shou-Sung Chang
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Publication number: 20230356351Abstract: A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.Type: ApplicationFiled: July 21, 2023Publication date: November 9, 2023Inventors: Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang
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Patent number: 11806835Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.Type: GrantFiled: March 22, 2021Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield, Alexander John Fisher, Bum Jick Kim
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Patent number: 11801582Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.Type: GrantFiled: June 28, 2021Date of Patent: October 31, 2023Assignee: Applied Materials, Inc.Inventors: Hari Soundararajan, Shou-Sung Chang, Calvin Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar, Paul D. Butterfield, Chad Pollard, Haosheng Wu