Abstract: Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.

Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

Abstract: A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.

Abstract: A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.

Abstract: Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.

Abstract: A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk across the polishing surface in a sweep pattern that includes at least a portion of the conditioning disk extending over a peripheral edge of the polishing surface, and maintaining a substantially uniform pressure to the polishing surface from the conditioning disk across the sweep pattern.

Abstract: Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck.

Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: A polishing system includes a polishing pad having a polishing surface and a conditioner apparatus. The conditioner apparatus includes a conditioner head constructed to receive a conditioning disk for conditioning a surface of the polishing pad, an arm that supports the conditioner head, a base that supports the arm, the arm pivotally connected to the base such that the arm is pivotable about a pivot point to change an angle of inclination of the arm, wherein the pivot point is positioned below the polishing surface of the polishing pad.

Abstract: Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.

Abstract: A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.