Abstract: A heat exchanger assembly having an inlet header, an outlet header spaced from the inlet header, a plurality of refrigerant tubes hydraulically connecting the inlet header with the outlet header. A distributor tube having a plurality of orifices disposed in the inlet header, wherein the orifices are arranged along the distributor tube such that at least one orifice is oriented in the liquid phase of the refrigerant pressed against the internal surface of the distributor tube regardless of orientation of the evaporator. The orifices may be arranged in a random order about the distributor tube, positioned in groups of at least two at predetermined locations, or spiraled along the distributor tube.

Abstract: An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.

Abstract: The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.

Abstract: A heat exchanger having a plurality of tubes that define refrigerant passages extending vertically from a lower end to an upper end. A bottom header is in fluid communication with the passage at the lower end of the tube, and a top header is in fluid communication with the passage at the upper end of the tube. A plurality of plates extends rearwardly from the tubes to a distal edge. Adjacent plates extending from adjacent tubes are closed off at the distal edges by a connector, and adjacent plates extending from the same tube have a rear opening between the distal edges for receiving air into the assembly. A plurality of orifices is disposed along the plates to allow air from the rear opening to flow downstream between the tubes. A water tank and wicking material are provided for wetting the plates.

Abstract: The invention provides a heat exchanger assembly having a housing which defines a boiling chamber extending along an axis between opposite ends. A plurality of first condensing tubes extend axially and downwardly in one direction at a first predetermined angle to and below the axis (A) from the housing and a plurality of second condensing tubes extend axially and upwardly in the opposite direction at the same predetermined angle to and above the axis (A) from the housing. The volume of refrigerant in the housing is greater than the volume of the second condensing tubes and the volume of the boiling chamber.

Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.

Abstract: The invention provides an assembly for desalinating water comprising a cold air duct open to the dry channels of the evaporative cooler and extending around a humidification chamber disposed between the evaporative cooler and the condenser. The invention provides for a film valve including a flexible sheet intersecting the cold air duct for controlling air flow along the cold air duct to the condenser. The film valve allows for a fraction, or all of the cool air in the cold air duct to be utilized for comfort cooling.

Abstract: An evaporative heat exchanger for cooling a hot refrigerant having a core of alternatively stacked dry and wet plates. Each dry plate includes a dry side defining a plurality of dry channels in a first direction, a series of ports distributed along the dry channels, a wet side, and a refrigerant cooling section. Each wet plate includes a wet side adjacent to and cooperates with the wet side of the dry plate to define a plurality of wet channels in a second direction. The dry channels, ports, and wet channels define a labyrinth for the air flow, which evaporates the liquid contained in the wet channels resulting in a cooling of the refrigerant. The refrigerant cooling section is integral with the outboard of the dry plate and adjacent to an end section of the wet channels to provide enhanced refrigerant cooling.

Abstract: The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a second sector of each coil disposed above the liquid surface whereby said tube runs into and out of said liquid refrigerant.

Abstract: A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element.

Abstract: A system for generating electric power by utilizing solar heat flux. The system comprises a heating sub system and a cooling loop. The cooling loop circulates a coolant through a heat exchanger with an expanded second refrigerant which has been heated by the heating sub system thereby heating the coolant. The cooling loop includes a pipe buried in the ground at depth, D. A soil surrounds the length, L, of the pipe and a wrapping material defines and maintains a radial soil annulus width, ?s, extending radially from the pipe to an outer periphery at a peripheral radius, r?, measured radially from its axis, A. The radial soil annulus width, ?s, can be maintained at k s h s - r o . The length, L, of the pipe can be equal to mc p 2 ? ? ? ? { 0.5469 k f + 1 k p ? ln ? ( r o r i ) + 1 k s ? [ 1 + ln ? ( r ? r o ) ] } wherein r ? = k s h s .

Abstract: A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).

Abstract: The invention provides for an orientation insensitive heat exchanger assembly for cooling an electronic device comprising a hermetically sealed housing defining a boiling chamber and two condensing chambers. A partition is disposed in the boiling chamber and defines two sets of alternating channels extending in overlapping relationship to one another and with one set of alternating channels open to one of the condensing chambers and the other set of alternating channels open to the other condensing chamber for sealing the condensing chambers from one another. Coolant is maintained in each of the condensing chambers. In operation, if the thermosiphon is tilted with one side lower than the other, the channels open to the lower side are empty of coolant into the lower condensing chamber while the channels open to the opposite upper side hold the coolant over the entire boiling chamber aligning with an electronic device to continue cooling.

Abstract: A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes.

Abstract: A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to remove heat from an electronic device regardless of the orientation of the heat exchanger assembly. A plurality of side fins are disposed on the outer wall of the housing, and a plurality of top fins extend radially from a central axis (A) and are disposed on top of the housing. A wicking material is disposed on the interior of each chamber. A fan assembly is disposed on top of the top fins to blow air radially down into the fins.

Abstract: A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzle. The assembly is distinguished by air bearings supporting the shaft in the casing on a thin film of air, thereby maintaining a contaminate free housing.

Abstract: An air conditioning system includes an evaporator assembly and a condenser assembly. A first portion of the exhaust airstream leaves the condenser and enters a primary channel of an evaporative cooler assembly. Water evaporates from the evaporative cooler tubes and creates a moisture-laden airstream. A plurality of apertures in the evaporative cooler tubes bleeds the moisture-laden airstream into a secondary channel defined within the evaporative cooler tubes. The heat drawn from the air in the primary channel produces an evaporatively cooled airstream that enters a desiccant wheel. A solid desiccant material within the desiccant wheel absorbs moisture from the evaporatively cooled airstream to produce a dehumidified airstream that enters the evaporator assembly. A second portion of the exhaust airstream is directed through a heater and then into the desiccant wheel to provide heat for regeneration of the solid desiccant material.

Abstract: An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for removing heat produced by the electronic devices. The evaporative cooler removes heat from the flow of air by absorbing heat from the flow of air and then dissipating the heat by evaporating a liquid into a secondary airflow, which is directed out of the cabinet. The cabinet includes a cold air plenum having an actuator for adjusting a cross-sectional area of the cold air plenum to control the airflow through each of the supports.

Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.

Abstract: A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes.