Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Abstract: A liquid-cooled heat sink for use in combination with a heat exchanger to cool electronic or electrical devices attached to said heat sink comprises a metal block having a plurality of circular passageways therethrough defined by cylindrical walls. An inlet is in fluid communication with one end of the passageways for receiving a cooling liquid, and an outlet is in fluid communication with an opposite end of the passageways for outputting the cooling liquid. At least one tape insert is mounted within at least one of the circular passageways, wherein the tape insert longitudinally bisects the circular passageway and further wherein edges of the tape insert abut cylindrical wall.

Abstract: A liquid-cooled heat sink for use in combination with a heat exchanger to cool electronic or electrical devices attached to said heat sink comprises a metal block having a plurality of circular passageways therethrough defined by cylindrical walls. An inlet is in fluid communication with one end of the passageways for receiving a cooling liquid, and an outlet is in fluid communication with an opposite end of the passageways for outputting the cooling liquid. At least one tape insert is mounted within at least one of the circular passageways, wherein the tape insert longitudinally bisects the circular passageway and further wherein edges of the tape insert abut cylindrical wall.

Abstract: A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle. Each planar portion has a plurality of louvers formed therein wherein the louvers are substantially parallel one to the other and perpendicular to the base plate.

Abstract: A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle. Each planar portion has a plurality of louvers formed therein wherein the louvers are substantially parallel one to the other and perpendicular to the base plate.

Abstract: A heat sink for electronic devices comprises a spreader plate having a top surface and having a bottom surface wherein a portion thereof is defined for affixing an electronic device to be cooled thereto. A plurality of columnar pins are spaced apart one from the other in a non-uniform manner and affixed to the top surface of the spreader plate substantially perpendicular thereto. A highly porous heat conducting reticulated foam block substantially fills a space defined by said spaced apart columnar pins.

Abstract: A thermosiphon for cooling an electronic device having a mean width of dimension “b” comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.

Abstract: An evaporator (10) with opposed pairs of generally vertically oriented flow tube surfaces (14) has corrugated air fins in which the tube surface spacing c, the interior radius r of a crest (20) joining adjacent pairs of fin walls (18), the fin pitch p separating adjacent crests (20), and the length l of louvers (22) cut out of the fin walls (18) bear the following relationship: 0≦r/c≦0.057, 0.89≦l/c≦1.01, and 0.29≦p/c≦0.43. This has been found to substantially improve condensate drainage, while not significantly penalizing heat transfer or air side pressure drop.

Abstract: An evaporator (10) with opposed pairs of generally vertically oriented flow tube surfaces (14) has corrugated air fins in which the tube surface spacing c, the interior radius r of a crest (20) joining adjacent pairs of fin walls (18), the fin pitch p separating adjacent crests (20), and the length l of louvers (22) cut out of the fin walls (18) bear the following relationship: 0≦r/c≦0.057, 0.89≦l/c≦1.01, and 0.29≦p/c≦0.43. This has been found to substantially improve condensate drainage, while not significantly penalizing heat transfer or air side pressure drop.

Abstract: The aluminum plate oil cooler includes a plurality of pairs of plates that are secured along their perimeter to define an oil flow path. The plates include embossed regions that are formed to provide inlet and outlet ports for the oil. Top and bottom reinforcement plates are positioned at the top and bottom of the plurality of pairs of plates. An internal center is positioned between the plates to increase the heat transfer area and turbulate the oil within the oil cooler. An external center is positioned between each of the plurality of pairs to increase the thermal transfer area on the coolant side of the oil cooler. The external center covers the entire surface of the plates and includes holes formed to correspond with the embossed regions on the plates.

Abstract: An automotive heat exchanger manifold (56) is formed entirely integrally by starting with a cylindrical blank (10) and integrally forming its ends variously into lower end closures or upper end connectors. Specifically, the lower end of blank (10) is impact extruded into a reduced diameter pin (30) which is not only leak tight and seamless, but inserts into a lower resilient mount (16). The upper end of the blank (10) is cold headed into a line connector (54).