Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a light penetrating substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the light penetrating substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is ranging from substantially 1 to substantially 4. The adhesive layer is sandwiched between the surface of the light penetrating substrate and the second surface of the optical layer.

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: Various embodiments relate to data packet compensation in multi-device media systems. A primary headphone device may include one or more communication interfaces configured to communicate with an audio source and a secondary headphone device. The primary headphone device may further include communication logic configured to transmit information to the secondary headphone device identifying one or more data packets received by the primary headphone device. The communication logic may also be configured to receive reporting information identifying one or more data packets missed by the secondary headphone device. Also, the communication logic may be configured to transmit compensation information for the one or more data packets missed by the secondary headphone device.

Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.

Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.

Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

Abstract: Various embodiments relate to data packet compensation in multi-device media systems. A primary headphone device may include one or more communication interfaces configured to communicate with an audio source and a secondary headphone device. The primary headphone device may further include communication logic configured to transmit information to the secondary headphone device identifying one or more data packets received by the primary headphone device. The communication logic may also be configured to receive reporting information identifying one or more data packets missed by the secondary headphone device. Also, the communication logic may be configured to transmit compensation information for the one or more data packets missed by the secondary headphone device.

Abstract: Various embodiments relate to data packet compensation in multi-device media systems. A secondary headphone device may include one or more communication interfaces configured to communicate with a primary headphone device over a first wireless communication link. The secondary headphone device may also include a sniffer configured to capture one or more data packets communicated from a media source to the primary headphone device over a second wireless communication link. Further, the secondary headphone device may include communication logic configured to provide reporting information about the captured one or more data packets to the primary headphone device. The communication logic may also receive one or more reply messages from the primary headphone device via the first wireless communication link. The at least one reply message of the one or more reply messages indicating whether or not the sniffer captured each data packet communicated from the media source to the primary headphone device.

Abstract: Various embodiments relate to data packet compensation in multi-device media systems. A secondary headphone device may include one or more communication interfaces configured to communicate with a primary headphone device over a first wireless communication link. The secondary headphone device may also include a sniffer configured to capture one or more data packets communicated from a media source to the primary headphone device over a second wireless communication link. Further, the secondary headphone device may include communication logic configured to provide reporting information about the captured one or more data packets to the primary headphone device. The communication logic may also receive one or more reply messages from the primary headphone device via the first wireless communication link. The at least one reply message of the one or more reply messages indicating whether or not the sniffer captured each data packet communicated from the media source to the primary headphone device.

Abstract: A projection system and a method for calibrating display image are provided. The method includes: setting a correction image having identification patterns, and establishing first coordinate information of the identification patterns; using a projection device to project the correction image on a display screen; performing an image capturing operation to the correction image and the display screen to obtain a captured image; calculating second coordinate information of the identification patterns in the captured image, and calculating coordinate translation information according to the first coordinate information and the second coordinate information; calculating boundary information of the display screen according to a plurality of boundary coordinate values of the display screen in the captured image and the coordinate translation information, such that the projection device adjusts a size of a projection image for corresponding to the display screen according to the boundary information.

Abstract: The present invention provides a method for fabricating a high sag lens array a high sag lens array fabricated by a semiconductor process. The method comprises: individually jetting an optical glue material into a plurality of lens mold cavities of a mold to form a plurality of lens parts independently; exposing the lens parts to harden the optical glue material in the lens mold cavities; jetting an optical glue layer on the lens parts; forming a transparent substrate on the optical glue layer; exposing the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts; and removing the mold to form the high sag lens array.

Abstract: A projection system and a method for calibrating display image are provided. The method includes: setting a correction image having identification patterns, and establishing first coordinate information of the identification patterns; using a projection device to project the correction image on a display screen; performing an image capturing operation to the correction image and the display screen to obtain a captured image; calculating second coordinate information of the identification patterns in the captured image, and calculating coordinate translation information according to the first coordinate information and the second coordinate information; calculating boundary information of the display screen according to a plurality of boundary coordinate values of the display screen in the captured image and the coordinate translation information, such that the projection device adjusts a size of a projection image for corresponding to the display screen according to the boundary information.

Abstract: A projector includes a laser module for generating a laser beam and a wafer-level optics. The wafer-level optics includes a first substrate, a first collimator lens and a diffractive optical element, wherein the first collimator lens is manufactured on a first surface of the first substrate, and is arranged for receiving the laser beam from the laser module to generate a collimated laser beam; and the collimated laser beam directly passes through the diffractive optical element to generate a projected image of the projector.

Abstract: A memory mapping method for coupling a plurality of servers with a PCI express bus is disclosed. The method comprises: configuring an extended memory address on a management host having a memory address; mapping the extended memory address of the management host corresponding to each of the servers to memory addresses of each of the servers respectively by a plurality of non-transparent bridges of the PCI express bus; configuring an extended memory address on each of the servers; and mapping the extended memory address of each of the servers to the memory address and the extended memory address of the management host by the non-transparent bridges, the extended memory address of each of the servers corresponding to the servers and the management host.

Abstract: A projector includes a laser module for generating a laser beam and a wafer-level optics. The wafer-level optics includes a first substrate, a first collimator lens and a diffractive optical element, wherein the first collimator lens is manufactured on a first surface of the first substrate, and is arranged for receiving the laser beam from the laser module to generate a collimated laser beam; and the collimated laser beam directly passes through the diffractive optical element to generate a projected image of the projector.

Abstract: A method for forming a pattern includes steps of forming a patterned core layer on a substrate, conformally forming a spacer layer on the patterned core layer to form first concave portions, performing an etch back process to expose the patterned core layer, removing the exposed patterned core layer to form second concave portions, filling up the first concave portions and the second concave portions with a directed self-assembly material, and activating a directed self-assembly process, so that the directed self-assembly material is diffused to the perimeter of the concave portions to form a hole surrounding by the directed self-assembly material in each concave portions.

Abstract: A method for forming a pattern includes steps of forming a patterned core layer on a substrate, conformally forming a spacer layer on the patterned core layer to form first concave portions, performing an etch back process to expose the patterned core layer, removing the exposed patterned core layer to form second concave portions, filling up the first concave portions and the second concave portions with a directed self-assembly material, and activating a directed self-assembly process, so that the directed self-assembly material is diffused to the perimeter of the concave portions to form a hole surrounding by the directed self-assembly material in each concave portions.