Patents by Inventor Shu Kuan

Shu Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus with temperature self-compensation and method thereof
    Patent number: 8419271
    Abstract: A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 16, 2013
    Assignee: National Taiwan University
    Inventors: Long-Sun Huang, Yu-Fu Ku, Yi-Kuang Yen, Shu Kuan, Kuang-Chong Wu, Shiming Lin, Ping-Yen Lin
  • Apparatus With Temperature Self-Compensation And Method Thereof
    Publication number: 20110158288
    Abstract: A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 30, 2011
    Applicant: National Taiwan University
    Inventors: Long-Sun Huang, Yu-Fu Ku, Yi-Kuang Yen, Shu Kuan, Kuang-Chong Wu, Shiming Lin, Ping-Yen Lin