Abstract: Camera module with switchable light filters includes a lens, a body, a movable tray, a first filter, a second filter, a gear and a protective cover. The lens is disposed in the body. The body defines a first through hole corresponding to the lens and includes a first surface. The movable tray is positioned on the first surface and is used for receiving the first filter and the second filter. The gear is arranged on the first surface by a rotating shaft, the gear is configured to engage with the movable tray to switch the first filter and the second filter. The protective cover is disposed on the body and partially covers the gear.

Abstract: A camera module includes a voice coil motor, a lens module, a substrate, an imagine sensor, a circuit board and a conductive adhesive tape. The voice coil motor includes a conductive housing defining a first hole. The lens module is received in the first hole. The substrate supports the voice coil motor and defines a second hole. The circuit board includes a grounding area. The image sensor is supported by the circuit board, and is received in the second hole, and aligned with the lens module. The conductive adhesive tape covers the substrate and electrically connects the conductive housing to the grounding area.

Abstract: A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.

Abstract: Camera module with switchable light filters includes a lens module, a bearing rotating device, a visible light filter, and an infrared light filter. The bearing rotating device includes a rotating shaft, at least one guiding stick, and a bearing plate. The rotating bearing plate holds the two filters and defines an arcuated guiding slot. The circle center of the arcuated guiding slot is the rotating shaft. A visible light filter and an infrared light filter are switchable, their movement being governed by the guiding stick and the guiding slot, to respective alignment with an optical axis of the lens module. The camera module can rotate the bearing plate to switch the infrared filter for the visible filter where the acquisition of infrared light is required.

Abstract: Camera module with switchable light filters includes a lens, a body, a movable tray, a first filter, a second filter, a gear and a protective cover. The lens is disposed in the body. The body defines a first through hole corresponding to the lens and includes a first surface. The movable tray is positioned on the first surface and is used for receiving the first filter and the second filter. The gear is arranged on the first surface by a rotating shaft, the gear is configured to engage with the movable tray to switch the first filter and the second filter. The protective cover is disposed on the body and partially covers the gear.

Abstract: Camera module with switchable light filters includes a lens module, a bearing rotating device, a visible light filter, and an infrared light filter. The bearing rotating device includes a rotating shaft, at least one guiding stick, and a bearing plate. The rotating bearing plate holds the two filters and defines an arcuated guiding slot. The circle center of the arcuated guiding slot is the rotating shaft. A visible light filter and an infrared light filter are switchable, their movement being governed by the guiding stick and the guiding slot, to respective alignment with an optical axis of the lens module. The camera module can rotate the bearing plate to switch the infrared filter for the visible filter where the acquisition of infrared light is required.

Abstract: A digital camera able to filter out infrared light or receive infrared light as user requires includes a sensor and a base. The base includes a first receiving groove, the first receiving groove includes a bottom surface defining a first through slot, the first through slot being used for receiving the sensor. A filter bracket is set on the bottom surface, the filter bracket includes a first through hole and a second through hole corresponding to the first through slot. A visible light filter is set on the filter bracket and covers the first through hole and an infrared light filter covers the second through hole. A driver device moves the filter bracket from a first position to a second position as the user requires.

Abstract: A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Abstract: A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.

Abstract: A camera module includes a voice coil motor, a lens module, a substrate, an imagine sensor, a circuit board and a conductive adhesive tape. The voice coil motor includes a conductive housing defining a first hole. The lens module is received in the first hole. The substrate supports the voice coil motor and defines a second hole. The circuit board includes a grounding area. The image sensor is supported by the circuit board, and is received in the second hole, and aligned with the lens module. The conductive adhesive tape covers the substrate and electrically connects the conductive housing to the grounding area.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Abstract: A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.

Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.

Abstract: A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.

Abstract: A lens module testing device includes a base substrate, a supporting assembly, a bearing assembly, a receiving element, and an operation element. The supporting assembly is positioned on the base substrate and includes two supporting plates parallel with each other. One of the supporting plates defines an arc shaped slot. The bearing assembly is rotatably received between the two supporting plates. The receiving element is positioned on the bearing assembly and configured for receiving a lens module. The operation element penetrates the slot and connects to the bearing assembly; the bearing assembly is driven by the operation element to move along the slot and thereby adjusting the angle of the lens module which is presented to a light source.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.