Patents by Inventor SHU-SHENG PENG

SHU-SHENG PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140027158
    Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.
    Type: Application
    Filed: December 6, 2012
    Publication date: January 30, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (Shenzhen) CO., LTD.
    Inventors: SHIN-WEN CHEN, WEN-HSIUNG CHEN, YU-TSAN CHENG, WEN-CHANG CHEN, SHU-SHENG PENG
  • Publication number: 20140020934
    Abstract: A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.
    Type: Application
    Filed: December 6, 2012
    Publication date: January 23, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHIN-WEN CHEN, SHU-SHENG PENG, WEN-CHANG CHEN, WEN-HSIUNG CHEN, LI-MIN LIU, YU-TSAN CHENG, YONG LI
  • Publication number: 20130278924
    Abstract: A lens module testing device includes a base substrate, a supporting assembly, a bearing assembly, a receiving element, and an operation element. The supporting assembly is positioned on the base substrate and includes two supporting plates parallel with each other. One of the supporting plates defines an arc shaped slot. The bearing assembly is rotatably received between the two supporting plates. The receiving element is positioned on the bearing assembly and configured for receiving a lens module. The operation element penetrates the slot and connects to the bearing assembly; the bearing assembly is driven by the operation element to move along the slot and thereby adjusting the angle of the lens module which is presented to a light source.
    Type: Application
    Filed: October 26, 2012
    Publication date: October 24, 2013
    Inventors: SHU-SHENG PENG, YONG LI
  • Publication number: 20130243994
    Abstract: A protection film includes a base film, a layer of adhesive, and a partition film. The base film includes a main portion and a handle portion extending from a periphery of the main portion. The main portion and the handle portion include a pair of opposite first surfaces. The adhesive is uniformly coated on one of the first surfaces. The adhesive is continuously coated on the main portion and the handle portion. The partition film includes a pair of opposite second surfaces. One of the second surfaces is adhered to a portion of the adhesive coated on the handle portion.
    Type: Application
    Filed: June 27, 2012
    Publication date: September 19, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHU-SHENG PENG, YONG LI
  • Publication number: 20120161036
    Abstract: A testing device includes a testing platform, a testing light source, a cover plate, a control circuit board, a probe and an adapter circuit board. The testing platform defines a receiving portion. The testing light source is positioned on the testing platform and opposite to the receiving portion. The cover plate is rotatably connected to the testing platform. The control circuit board is positioned on the testing platform. The probe and the adapter circuit board are positioned on the cover plate. The adapter circuit board is electrically connecting the probe to the control circuit board.
    Type: Application
    Filed: August 19, 2011
    Publication date: June 28, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: SHU-SHENG PENG, JIAN LI, LI-JUN SHEN, HUI-HUA ZHAO