Abstract: Reversibly adaptive rough structures, comprising: a substrate; a plurality of raised elements on the substrate, the raised elements mutually spaced apart by channel regions on the substrate, each of the raised elements having a lateral surface and a distal end; the lateral surface, the distal end and the channel regions having hydrophobic molecules thereon; and the distal end having reversibly adaptive bristles thereon, the reversibly adaptive bristles being convertible between relatively hydrophilic and hydrophobic states by the application of an external stimulus. Techniques for making reversibly adaptive rough structures.

Abstract: A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.

Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Abstract: A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.

Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.

Abstract: An apparatus includes a planar substrate and an array of substantially transparent spherical micro-lenses forming a pattern. The pattern has an internal two-dimensional lattice symmetry on the planar substrate. Each micro-lens includes a convex bulge or a concave depression in a surface of the planar substrate. The micro-lenses and substrate include hydrogel that swells and contracts in a manner that is responsive to an environmental condition.

Abstract: An apparatus includes a planar substrate and an array of substantially transparent spherical micro-lenses forming a pattern. The pattern has an internal two-dimensional lattice symmetry on the planar substrate. Each micro-lens includes a convex bulge or a concave depression in a surface of the planar substrate. The micro-lenses and substrate include hydrogel that swells and contracts in a manner that is responsive to an environmental condition.

Abstract: The present invention discloses a method of implementing traversal of multimedia protocols through Network Address Translation device, wherein the Network Address Translation (NAT) device establishes a mapping relationship between address of a terminal in a private network and address of a terminal in a public network, and enables the terminal in the private network to access the public network with a common address, so as to implement the interaction of media streams between the terminal in the private network and the terminal in the public network, in which the common address is a address of the private network for accessing the public network.

Abstract: Techniques for producing a glass structure having interconnected macroscopic pores, including providing a polymeric structure having interconnected macroscopic pores; providing polymerizable glass precursors; filling pores in the polymeric structure with the polymerizable glass precursors; polymerizing the polymerizable glass precursors to yield a filled polymeric structure; and decomposing the filled polymeric structure to produce a glass structure having interconnected macroscopic pores. Techniques for filling pores of such glass structure with a material having a high refractive index, and for then removing the glass structure. Structures can be produced having interconnected macroscopic pores and high refractive index contrasts, which can be used, for example, as photonic band gaps.

Abstract: Techniques for producing a glass structure having interconnected macroscopic pores, employing steps of filling polymerizable glass precursors into pores in a polymeric structure having interconnected macroscopic pores; polymerizing the precursors; and decomposing the polymers to produce a glass oxide structure having interconnected macroscopic pores. Further techniques employ steps of exposing portions of a photosensitive medium including glass precursors to an optical interference pattern; polymerizing or photodeprotecting the exposed portions and removing unpolymerized or deprotected portions; and decomposing the polymerized or deprotected portions to produce a glass structure having interconnected macroscopic pores. Techniques for filling pores of such glass structure with a material having a high refractive index, and for then removing the glass structure.

Abstract: A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.

Abstract: The present invention provides a radiation curable conductive ink and a manufacturing method for conductive substrate using the conductive ink, wherein components of the radiation curable conductive ink contain at least conductive powder having a covering layer and a photosensitive binder. The radiation curable conductive ink is printed on surface of a substrate using a screen printing method, and a chemical crosslinking reaction is achieved by irradiating the conductive ink with ultraviolet ray, visible light or electron beam, thereby forming a conductive substrate. The conductive substrate is particularly applicable for use in laminate type electronic devices, including radio frequency identification (RFID) antenna, printed-circuit boards, smart cards (non-contact chip cards) components, smart labels, printed electronics, anti-electromagnetic interference (EMI) and anti-electrostatic materials.

Abstract: A integrated circuit device made using LCD-COG (liquid crystal display-chip on glass) technique is disclosed. The integrated circuit device comprises a substrate, a plurality of dies having surfaces with a plurality of compliant bumps thereon. The compliant bumps are rearranged in any area of the dies for electrically connecting the dies and the substrate. The joint area of the bumps after rearrangement is smaller than the joint area of the bumps on the center. An adhesive is daubed on the joint area of the substrate and the dies for the purpose of jointing the substrate and the dies. By changing the position of the compliant bumps so that they are centrally corresponded on the dies without changing the electrical characteristics and the wiring arrangement of the dies, costs are lowered, reliability is increased and the glass substrate is less easily bent.

Abstract: An apparatus includes a planar substrate and an array of substantially transparent spherical micro-lenses forming a pattern. The pattern has an internal two-dimensional lattice symmetry on the planar substrate. Each micro-lens includes a convex bulge or a concave depression in a surface of the planar substrate. The micro-lenses and substrate include hydrogel that swells and contracts in a manner that is responsive to an environmental condition.

Abstract: An apparatus includes a planar substrate and an array of substantially transparent spherical micro-lenses forming a pattern. The pattern has an internal two-dimensional lattice symmetry on the planar substrate. Each micro-lens includes a convex bulge or a concave depression in a surface of the planar substrate. The micro-lenses and substrate include hydrogel that swells and contracts in a manner that is responsive to an environmental condition.

Abstract: An apparatus includes a planar substrate and an array of substantially transparent spherical micro-lenses forming a pattern. The pattern has an internal two-dimensional lattice symmetry on the planar substrate. Each micro-lens includes a convex bulge or a concave depression in a surface of the planar substrate. The micro-lenses and substrate include hydrogel that swells and contracts in a manner that is responsive to an environmental condition.

Abstract: A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, a plurality of chips having surfaces with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chips for electrically connecting the chips and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By changing the position of the compliant bumps so that they are centrally disposed on the chips without changing the electrical characteristics and the wiring arrangement of the chips, costs are lowered, reliability is increased and the glass substrate is less easily bent.

Abstract: A solid includes crosslinked amphiphilic organosilicate precursors. The amphiphilic organosilicate precursors form a matrix with an array of micro-structures dispersed in the matrix.