Abstract: A fingerprint sensing device includes an insulating package, an image-sensing die, a light-emitting element, and a conductive component. The insulating package has a bottom surface and a top surface formed with first and second recesses. The image-sensing die is disposed in the first recess and has an outer surface exposed therefrom. The light-emitting element is disposed in the second recess and has an outer surface exposed from the second recess, and an electrode unit. The conductive component is formed in the insulating package, has top and bottom ends exposed from the top and bottom surfaces of the insulating package, and is electrically coupled to the image-sensing die and the electrode unit.

Abstract: The invention includes compositions, devices, and methods for analyzing a polymer and/or polymer unit. The polymer may be a homo or hetero-polymer such as DNA, RNA, a polysaccharide, or a peptide. The device includes electrodes that form a tunnel gap through which the polymer can pass. The electrodes are functionalized with a reagent attached thereto, and the reagent is capable of forming a transient bond to a polymer unit. When the transient bond forms between the reagent and the unit, a detectable signal is generated and used to analyze the polymer.

Abstract: A fingerprint sensing device includes an insulating package, an image-sensing die, a light-emitting element, and a conductive component. The insulating package has a bottom surface and a top surface formed with first and second recesses. The image-sensing die is disposed in the first recess and has an outer surface exposed therefrom. The light-emitting element is disposed in the second recess and has an outer surface exposed from the second recess, and an electrode unit. The conductive component is formed in the insulating package, has top and bottom ends exposed from the top and bottom surfaces of the insulating package, and is electrically coupled to the image-sensing die and the electrode unit.

Abstract: The invention includes compositions, devices, and methods for analyzing a polymer and/or polymer unit. The polymer may be a homo or hetero-polymer such as DNA, RNA, a polysaccharide, or a peptide. The device includes electrodes that form a tunnel gap through which the polymer can pass. The electrodes are functionalized with a reagent attached thereto, and the reagent is capable of forming a transient bond to a polymer unit. When the transient bond forms between the reagent and the unit, a detectable signal is generated and used to analyze the polymer.

Abstract: The invention includes compositions, devices, and methods for analyzing a polymer and/or polymer unit. The polymer may be a homo or hetero-polymer such as DNA, RNA, a polysaccharide, or a peptide. The device includes electrodes that form a tunnel gap through which the polymer can pass. The electrodes are functionalized with a reagent attached thereto, and the reagent is capable of forming a transient bond to a polymer unit. When the transient bond forms between the reagent and the unit, a detectable signal is generated and used to analyze the polymer.

Abstract: Some embodiments of the present disclosure provide methods, devices, and systems for sequencing nucleic acid polymers that utilize palladium (Pd), for example, at least in part, as an electrode material that is (i) functionalized with one or more adaptor molecules and (ii) capable for use to sense one or more chemical compositions.

Abstract: The invention includes compositions, devices, and methods for analyzing a polymer and/or polymer unit. The polymer may be a homo- or hetero-polymer such as DNA, RNA, a polysaccharide, or a peptide. The device includes electrodes that form a tunnel gap through which the polymer can pass. The electrodes are functionalized with a reagent attached thereto, and the reagent is capable of forming a transient bond to a polymer unit. When the transient bond forms between the reagent and the unit, a detectable signal is generated and used to analyze the polymer.

Abstract: An assembly for an image sensing chip to reduce the entire thickness and an assembling method thereof are disclosed. Meanwhile, the electro-optical assembly includes an image sensing chip; and a multi-layer printed circuit board having a recess to accommodate the image sensing chip, thereby decreasing the entire electro-optical assembly in thickness. The image sensing chip further includes a holder mounted on the multi-layer printed circuit board for protecting the image sensing chip and a lens mounted on the holder for being pervious to light.

Abstract: A plurality of half-wave bridge type oscillators are operated in a time-sharing method and connected through primary windings of a transformer to make the reverse bias hold time of each thyristor long. Therefore, it is possible to stably output a frequency and power which are several times as high as those in a conventional power supply.

Abstract: An image sensing module and a method for packaging the same are disclosed. Meanwhile, the packaging method includes the steps of a) providing a substrate; b) forming plural passive devices on the substrate; c) adhering a chip on the substrate and bonding thereon; d) providing a ring frame, wherein the ring frame includes an opening window and plural pillars for contacting with the substrate; e) adhering a glass piece on the opening window to form a lid assembly; f) covering the lid assembly on the substrate, wherein the plural pillars contacting with the substrate, the plural passive devices and the chip are covered by the lid assembly, and plural gaps are formed between the ring frame and edges of the substrate; and g) filling a filler into the plural gaps to seal the plural passive devices and the chip in the lid assembly and the substrate.

Abstract: An image sensing module includes: a substrate provided with at least two holes at corners and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at corners and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to

Abstract: An image sensing module and a method for packaging the same are disclosed. Meanwhile, the packaging method includes the steps of a) providing a substrate; b) forming plural passive devices on the substrate; c) adhering a chip on the substrate and bonding thereon; d) providing a ring frame, wherein the ring frame includes an opening window and plural pillars for contacting with the substrate; e) adhering a glass piece on the opening window to form a lid assembly; f) covering the lid assembly on the substrate, wherein the plural pillars contacting with the substrate, the plural passive devices and the chip are covered by the lid assembly, and plural gaps are formed between the ring frame and edges of the substrate; and g) filling a filler into the plural gaps to seal the plural passive devices and the chip in the lid assembly and the substrate.

Abstract: A chip package and a chip packaging method for use in optical applications are disclosed. The packaging method includes the steps of: a) providing a substrate having a first surface and a second surface; b) bonding first passive devices on the first surface; c) adhering a first chip to the first surface; d) forming a protection cover over the first surface for covering the first passive devices and the first chip; e) bonding second passive devices on the second surface; f) adhering a second chip to the second surface; g) providing a lid assembly having a frame with an opening window and pillars for contacting with the second surface; h) laminating the lid assembly on the second passive devices and the second chip such that gaps are formed between the frame and edges of the second surface; and i) filling a filler into the gaps to seal the second passive devices and the second chip in the lid assembly.

Abstract: An image sensing module includes: a substrate provided with at least two holes at comers and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at comers and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to t