Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

Abstract: A method is disclosed for capturing an image using an electronic device having a camera. The method comprises starting the camera in response to a first user input, displaying a first preview interface including a first preview image captured by a default lens of the camera, displaying a second preview interface in response to a second user input for increasing a zooming ratio in the first preview frame and when the zooming ratio in the first preview interface is greater than or equal to a threshold value, the second preview interface including a first frame and a second frame, and adjusting a zoom ratio of the second preview image in the second frame in response to a third user input for changing the zoom ratio.

Abstract: A lead frame includes a die pad having a surface, a first lead post, a first lead, a second lead post, and a second lead. The first lead post has a surface coplanar with the surface of the die pad and is in a first plane. The first lead is coupled to the first lead post. The second lead post is in a second plane different from the first plane. The second lead is coupled to the second lead post.

Abstract: The system disclosed implements a secure method for facilitating secure exchange of health information among various stakeholders, including data owners or contributors, data requestors or miners, and medical providers, including hospitals, clinics, and research laboratories. Additional aspects of the system provide means for conducting secure research on health data collected from data contributors. Health information is exchanged using a decentralized system that incentivizes data contributors to provide health data to data miners. The data miners, which may be pharmaceutical companies, medical laboratories, or hospitals, use various methods in order to perform research on aggregated contributor data, while maintaining contributor privacy.

Abstract: This is a whole-lifecycle encrypted big data analysis method and system for the data from the different sources. The method performs unified local modeling of data from multiple data sources and transmitting them to a secure computing server after encryption. This secure computing server then processes and analyzes the data, including feature extraction, model training and model validation. The system includes multiple data sources corresponding to the described method and a secure computing server, for providing data, analyzing and processing the data. By processing and encrypting the data locally, and by supporting secure data sharing and federated learning of multiple data sources, this invention achieves protection of the data sources and addresses the privacy and security issues of the raw data for cross-institution big data collaborative analysis.

Abstract: A package includes a package body with a package top side, package footprint side and package sidewalls extending from the package footprint side to the package top side; power semiconductor chips electrically connected in parallel and each having first and second load terminals and being configured to block a blocking voltage and conduct a chip load current between the load terminals; a lead frame structure configured to electrically and mechanically couple the package to a carrier with the package footprint side facing the carrier, the lead frame structure including first outside terminals extending out of the package body for interfacing with the carrier. Each first load terminal is electrically connected, at least by one package body internal connection member, to at least two of the first outside terminals. A horizontally extending conduction layer at the package top side or footprint side is electrically connected with each second load terminal.

Abstract: A semiconductor package is disclosed. In one example, the semiconductor package includes a chip carrier, a semiconductor chip attached to the chip carrier, an encapsulation body encapsulating the semiconductor chip, and a mounting hole configured to receive a screw for screw mounting a heatsink onto a first side of the semiconductor package. A second side of the semiconductor package opposite the first side is configured to be surface mounted to an application board.

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

Abstract: A lead frame includes a die pad having a surface, a first lead post, a first lead, a second lead post, and a second lead. The first lead post has a surface coplanar with the surface of the die pad and is in a first plane. The first lead is coupled to the first lead post. The second lead post is in a second plane different from the first plane. The second lead is coupled to the second lead post.

Abstract: A packaging member for cleaning blades each having a blade main body and a holder part comprises at least one set of packaging member main bodies for supporting, respectively, opposite ends and of the holder parts of the cleaning blades. A first packaging member main body which is one of the set of packaging member main bodies has a plurality of first support parts disposed at predetermined intervals along the longitudinal direction of the packaging member main body. The first support parts each support one end portion of the holder part. A second packaging member main body which is the other of the set of packaging member main bodies has a plurality of second support parts disposed at the predetermined intervals along the longitudinal direction of the packaging member main body. The second support parts each support the other end portion of the holder part.

Abstract: A semiconductor device package includes an electrically conductive die pad having a die attach surface and an outer surface. A semiconductor die is mounted on the die attach surface. An encapsulant material encapsulates the semiconductor die and exposes the outer surface of the die pad. A first lead directly contacts the die pad, extends away from a first sidewall of the encapsulant material, and bends towards a lower side of the encapsulant material. A second lead is electrically connected to a terminal of the semiconductor die, extends away from a second sidewall of the encapsulant material, and bends towards the lower side of the encapsulant material. A first lateral section of the first lead that intersects the first sidewall is vertically offset from a second lateral section of the second lead that intersects the second sidewall.

Abstract: The system disclosed implements a secure method for facilitating secure exchange of health information among various stakeholders, including data owners or contributors, data requestors or miners, and medical providers, including hospitals, clinics, and research laboratories. Additional aspects of the system provide means for conducting secure research on health data collected from data contributors. Health information is exchanged using a decentralized system that incentivizes data contributors to provide health data to data miners. The data miners, which may be pharmaceutical companies, medical laboratories, or hospitals, use various methods in order to perform research on aggregated contributor data, while maintaining contributor privacy.

Abstract: The present invention discloses a residual pressure measurement system for a MEMS pressure sensor with an F-P cavity and method thereof, the measurement system includes a low-coherence light source, a 3 dB coupler, a MEMS pressure sensor, an air pressure chamber, a thermostat, a pressure control system, a cavity length demodulator, an acquisition card and a computer. The measurement method comprises: performing cavity length measurement by using the reflecting light by the pressure control system at two temperatures, respectively, so as to calibrate the MEMS pressure sensor and establish a relationship between the absolute phase of a monochromatic frequency and the external pressure; performing linear fitting to the two measurement data to obtain all the external pressure when the cavity length of two measurement data are equal to each other, and substituting the theoretical equation for calculation to obtain the residual pressure under the flat condition of the diaphragm.

Abstract: A method for receiving a signal in a wireless communication system includes: receiving and demodulating a signal transmitted by using a quadrature spatial modulation technology to obtain a complex symbol; and decoding the complex symbol with a spherical decoding detection algorithm. Decoding includes, for the ith layer of a constellation symbol, discarding the constellation symbol if a calculated radius of the ith layer is greater than a minimum radius of the ith layer; otherwise updating the minimum radius of the ith layer according to the calculated radius; where i is a natural number in a range between Nr and 1; Nr is the number of receiving antennas; and for each constellation symbol that is not discarded, taking a sum of the radii of respective layers of the constellation symbol as the radius of the constellation symbol, and selecting a constellation symbol with the smallest radius as a symbol obtained from the decoding.

Abstract: Disclosed is an in-situ detoxification method for a heavily contaminated site by hexavalent chromium. The method includes injecting a chemical reducing agent into a site heavily contaminated with hexavalent chromium, and injecting a chromium soil remediation microbial agent into the site after 0-10 days. The in-situ detoxification method includes: first, in-situ injecting the chemical reducing agent into the soil, preliminarily reducing high-concentration hexavalent chromium such that the hexavalent chromium of high concentration has no toxic effect on the subsequent ecological microbial agent, then in-situ injecting the ecological microbial agent prepared from biogas residue, a carbon source and sulfate into the chromium-containing soil under pressure, and forming a large-scale reducing buffer zone containing sulfate-reducing bacteria and sulfide in a special maintenance manner in the subsurface soil of the site to reduce the hexavalent chromium continuously and effectively.

Abstract: A method for receiving a signal in a wireless communication system includes: receiving and demodulating a signal transmitted by using a quadrature spatial modulation technology to obtain a complex symbol; and decoding the complex symbol with a spherical decoding detection algorithm. Decoding includes, for the ith layer of a constellation symbol, discarding the constellation symbol if a calculated radius of the ith layer is greater than a minimum radius of the ith layer; otherwise updating the minimum radius of the ith layer according to the calculated radius; where i is a natural number in a range between Nr and 1; Nr is the number of receiving antennas; and for each constellation symbol that is not discarded, taking a sum of the radii of respective layers of the constellation symbol as the radius of the constellation symbol, and selecting a constellation symbol with the smallest radius as a symbol obtained from the decoding.

Abstract: Fiber optical Fabry-Perot flow test device with local bending diversion structure, having an inlet flange, a test tube and an outlet flange, with both a fiber optical Fabry-Perot pressure sensor at high-pressure-side and a fiber optical Fabry-Perot pressure sensor at low-pressure-side, which are fixedly connected to the test tube through an auxiliary connecting device.

Abstract: A semiconductor device package includes an electrically conductive die pad having a die attach surface and an outer surface. A semiconductor die is mounted on the die attach surface. An encapsulant material encapsulates the semiconductor die and exposes the outer surface of the die pad. A first lead directly contacts the die pad, extends away from a first sidewall of the encapsulant material, and bends towards a lower side of the encapsulant material. A second lead is electrically connected to a terminal of the semiconductor die, extends away from a second sidewall of the encapsulant material, and bends towards the lower side of the encapsulant material. A first lateral section of the first lead that intersects the first sidewall is vertically offset from a second lateral section of the second lead that intersects the second sidewall.

Abstract: Disclosed is a cleaning blade, having an elastic body formed of a rubber base material molded product, and a surface treatment layer on at least an area of the elastic body to be brought into contact with a cleaning object. The surface treatment layer is formed by impregnating a surface portion of the elastic body with a surface treatment liquid containing an isocyanate compound and an organic solvent, and hardening the liquid. The surface treatment layer has an indentation elastic modulus of 21 MPa to 56 MPa. The elastic body has an indentation elastic modulus greater than 20 MPa and 35 MPa or less. The difference in indentation elastic modulus between the surface treatment layer and the elastic body is 1 MPa to 21 MPa.

Abstract: The present disclosure discloses a method for identifying a wireless AP performed at a server. The method includes: obtaining network connection information of terminal devices; for each terminal device, determining a rank for each respective wireless AP to which the terminal device connects by: analyzing corresponding network connection information to determine a first number of times of connections between the terminal device and the wireless AP; analyzing corresponding network connection information to determine a second number of times of connections between the wireless AP and each terminal device connecting to the wireless AP; and determining the rank for the wireless AP based on a weighted average of the first number of times of connections and the second number of times of connections; and returning identifier information of wireless APs as a first-type wireless AP to which the terminal device connects and their corresponding ranks to the terminal device.