Patents by Inventor Shuhei Yamada

Shuhei Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM
    Publication number: 20250078102
    Abstract: An information processing apparatus (100) includes a generation unit (102) generating an optimization model (80) by using template information (10) defining an objective function and a constraint that are indicators of an optimization problem, wherein the template information (10) includes item definition information (12) determining data items input to the objective function and the constraint, and algorithm definition information (14) defining an algorithm for the objective function and the constraint.
    Type: Application
    Filed: January 28, 2022
    Publication date: March 6, 2025
    Applicant: NEC Corporation
    Inventors: Junpei OGAWA, Shuhei YAMADA, Norihito GOTO
  • STRUCTURE INVESTIGATION ASSISTANCE SYSTEM, STRUCTURE INVESTIGATION ASSISTANCE METHOD, AND RECORDING MEDIUM
    Publication number: 20250067573
    Abstract: A structure investigation assistance system comprises: a first storage unit that stores image data of a road captured continuously by a camera; a second storage unit that stores detailed information about a structure around the road in association with position information about the structure on a map, the detailed information on the structure being configured using point cloud data obtained by 3D scanning the structure; a first selection unit that selects, from the first storage unit, image data targeted for an investigation request in a case where a request for an investigation of the structure is received; a second selection unit that selects, from the second storage unit, detailed information about the structure targeted for the investigation request; and an information presentation unit that presents a map indicating a location of the structure, the image data selected, and the detailed information about the structure.
    Type: Application
    Filed: February 9, 2022
    Publication date: February 27, 2025
    Applicant: NEC Corporation
    Inventors: Naoko FUKUSHI, Shintaro CHIKU, Shuhei MIZUGUCHI, Masanori KUKI, Shuei YAMADA, Kosei KOBAYASHI
  • Wireless communication technology, apparatuses, and methods
    Patent number: 12237589
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: February 25, 2025
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • ROAD SURFACE MARKING DETERIORATION ANALYSIS APPARATUS, METHOD, AND COMPUTER-READABLE MEDIUM
    Publication number: 20250052018
    Abstract: A road surface marking detection means detects a road surface marking on a road, based on sensor information acquired by sensing a road. An interruption detection means detects a portion where the road surface marking is interrupted, based on a detection result of the road surface marking. A factor determination unit determines a factor for which the road surface marking is interrupted with respect to a portion where a matter that the road surface marking is interrupted is detected.
    Type: Application
    Filed: March 1, 2022
    Publication date: February 13, 2025
    Applicant: NEC CORPORATION
    Inventors: Masanori KUKI, Shintaro Chiku, Naoko Fukushi, Shuei Yamada, Shuhei Mizuguchi, Kosei Kobayashi
  • SHIELD TERMINAL
    Publication number: 20250038459
    Abstract: A shield terminal includes a first outer conductor, a second outer conductor connected to the first outer conductor, and a module housed in the first outer conductor. The first outer conductor has one wall facing one side intersecting a front-rear direction, and an opening portion open to the one side at a position rearward of the one wall. The module has an inner conductor that is connected to a front end portion of a shielded electric wire and dielectrics and housing the inner conductor, and is disposed facing the opening portion. The second outer conductor has a cover wall covering the opening portion, and the cover wall has a second edge portion covering, from the one side, a first edge portion of the one wall facing the opening portion.
    Type: Application
    Filed: July 15, 2024
    Publication date: January 30, 2025
    Inventor: Shuhei YAMADA
  • PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES
    Publication number: 20240421062
    Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.
    Type: Application
    Filed: June 13, 2023
    Publication date: December 19, 2024
    Inventors: Tolga Acikalin, Shuhei Yamada, Telesphor Kamgaing, Tae Young Yang
  • WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
    Publication number: 20240421465
    Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.
    Type: Application
    Filed: June 13, 2023
    Publication date: December 19, 2024
    Inventors: Tolga Acikalin, Tae Young Yang, Shuhei Yamada, Telesphor Kamgaing
  • CONNECTOR
    Publication number: 20240405491
    Abstract: A housing includes a back wall portion and a tubular peripheral wall portion projecting forward from the back wall portion. A second outer conductor includes a tube portion to be passed through an insertion hole of the back wall portion and arranged inside the peripheral wall portion and a base portion to be arranged behind the back wall portion. The first outer conductor includes a bottom portion to be arranged behind the back wall portion to face the base portion. The bottom portion includes a through hole, through which an end part of a dielectric is passed. Mounting portions, to be electrically connected to a circuit board and positioning portions positionable on the circuit board includes project around the through hole in a bottom surface of the bottom portion.
    Type: Application
    Filed: May 20, 2024
    Publication date: December 5, 2024
    Inventor: Shuhei YAMADA
  • RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE ANTENNA AND THE RF DIE
    Publication number: 20240363567
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, where a top surface of the first pad is substantially coplanar with the second surface. In an embodiment, the die module comprises an antenna module with a third surface and a fourth surface. In an embodiment, a second pad is on the third surface of the antenna module, where a bottom surface of the second pad is substantially coplanar with the third surface. In an embodiment, the top surface of the first pad directly contacts the bottom surface of the second pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • ANTENNA MODULE WITH CAPACITIVE COUPLING
    Publication number: 20240364000
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • Reactive silicone composition and cured product thereof
    Patent number: 12129409
    Abstract: A reactive silicone composition including component (S) and component (T) below, the component (S): a reactive silicone compound including a condensation product of a diaryl silicate compound represented by Formula [1] and a silicon compound represented by Formula [2], (wherein Ar1 and Ar2 each independently represent a phenyl group optionally substituted by a C1-6 alkyl group and X represents a hydrolyzable reactive group), the component (T): modified titanium oxide-containing oxide colloidal particles produced by bonding an organosilicon compound to surfaces of titanium oxide-containing oxide colloidal particles (C) having an average particle diameter of from 2 to 100 nm and including, as a core, titanium oxide-containing metal oxide colloidal particles (A), surfaces of which are coated with a coating including silicon dioxide- and tin oxide-containing composite oxide colloidal particles (B).
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 29, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Masahiro Hida, Shuhei Yamada, Masashi Abe
  • Spherical forsterite particles, method for producing the same, and resin composition including spherical forsterite particles
    Patent number: 12129360
    Abstract: Forsterite particles have an average size of 0.1 ?m to 10 ?m and a dielectric loss tangent of 0.0003 to 0.0025. Sphericity=(Average particle size (?m) measured with a laser diffraction particle size distribution analyzer)/(Average primary particle size (?m) calculated by conversion using specific surface area measured by a nitrogen gas adsorption method) may be from 1.0 to 3.3. This method for producing forsterite particles may include: step (A): mixing a magnesium compound as a magnesium source and a silicon compound as a silicon source so MgO/SiO2 has a molar ratio of 1.90 to 2.10 to prepare particles; step (B): putting the particles prepared in step (A) into a hydrocarbon combustion flame to recover the resulting particles; and step (C): firing the particles obtained in step (B) at 700° C. to 1100° C. The ratio between a resin and the particles may be 1:0.001 to 1000 by mass ratio.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: October 29, 2024
    Assignee: NISSAN CHEMICAL CORPORATION
    Inventors: Masahiro Hida, Shuhei Yamada
  • Liquid chemical for forming water-repellent protective film, method for preparing same, and method for manufacturing surface-treated body
    Patent number: 12098319
    Abstract: The present invention is directed to a liquid chemical for forming a water-repellent protective film on a silicon element-containing wafer surface, a method of preparing the liquid chemical and a method of manufacturing a surface-treated body with the use of the liquid chemical, wherein the liquid chemical includes the following components: (I) a silylation agent; (II) at least one kind of nitrogen-containing compound selected from the group consisting of those of the following general formulas [1] and [2]; and (III) an organic solvent.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: September 24, 2024
    Assignee: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Yuzo Okumura, Katsuya Kondo, Shuhei Yamada, Atsushi Ryokawa, Yuki Fukui
  • WATER-REPELLENT PROTECTIVE FILM-FORMING AGENT, WATER-REPELLENT PROTECTIVE FILM-FORMING CHEMICAL SOLUTION, AND WAFER SURFACE TREATMENT METHOD
    Publication number: 20240287103
    Abstract: The present invention is directed to a novel water-repellent protective film-forming agent and a novel water-repellent protective film-forming liquid chemical, each of which is for forming a water-repellent protective film on a silicon element-containing surface of a wafer, and a method of surface-treating a wafer with the use of the agent in liquid form or the liquid chemical. The water-repellent protective film-forming agent according to the present invention includes at least one kind of silicon compound selected from the group consisting of guanidine derivatives of the following general formula [1] and amidine derivatives of the following general formula [2].
    Type: Application
    Filed: February 21, 2024
    Publication date: August 29, 2024
    Inventors: Yuzo OKUMURA, Katsuya KONDO, Shuhei YAMADA, Atsushi RYOKAWA, Yuki FUKUI
  • COMPUTER IMPLEMENTED METHOD OF DETERMINING A TRANSFER FUNCTION OF A MODULE OR A COMPONENT AND GENERATING SUCH COMPONENT
    Publication number: 20240248953
    Abstract: A computer implemented method of determining a transfer function (TRF) of a module (MDL). To improve an accuracy, the method includes measuring a first set-of-sensors-output (SO1) applied to the module (MDL) and measuring a second set-of-sensors-output (SO2), deducing a transfer function (TRF) of the module (MDL), wherein a transfer-function matrix (MTM) is a quadratic n-dimensional matrix for the n degrees of freedom (DOF), selecting a submatrix (SBM), determining for the selected submatrix (SBM) a corresponding rotational matrix (RTM) which improves the symmetry of the submatrix (SBM), generating a main rotational matrix (MRM) to transform the main transfer-function matrix (MTM), and providing the transfer function (TRF) with the transformed transfer-function matrix (TTM).
    Type: Application
    Filed: April 4, 2022
    Publication date: July 25, 2024
    Inventors: Theo Geluk, Shuhei Yamada
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20240243477
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: February 15, 2024
    Publication date: July 18, 2024
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Marian Verhelst, Yossi Tsfati, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • DISPERSION OF EXFOLIATED PARTICLES OF LAYERED POLYSILICATE COMPOUND, AND METHOD FOR PRODUCING SAME
    Publication number: 20240228306
    Abstract: A dispersion of exfoliated particles which includes at least one nitrogen-containing basic compound (A) which is a tertiary amine or a quaternary ammonium hydroxide having at least one alkyl group having 3 or 4 carbon atoms, and in which exfoliated particles (C) produced by interlayer-exfoliating a proton-type layered polysilicate compound (B) are dispersed in an aqueous solution (D) having 10 vol % to 90 vol % of an alcohol having 1 to 3 carbon atoms; and a film-forming composition, a porous body-forming composition, an LB film, a coating film, a free-standing membrane, a proton conductor, an electrolyte membrane for fuel cells, and a porous body each containing exfoliated particles.
    Type: Application
    Filed: February 22, 2022
    Publication date: July 11, 2024
    Applicants: NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY, NISSAN CHEMICAL CORPORATION
    Inventors: Shintaro IDA, Keisuke AWAYA, Kazutoshi SEKIGUCHI, Hirotake KITAGAWA, Shuhei YAMADA
  • APPARATUS AND DEVICES TO REDUCE ELECTROMAGNETIC INTERFERENCE FOR SHORT-RANGE WIRELESS INTERCONNECTIONS
    Publication number: 20240222859
    Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 4, 2024
    Inventors: Tae Young YANG, Zhen ZHOU, Shuhei YAMADA, Tolga ACIKALIN, Kenneth P. FOUST, Bryce D. HORINE
  • Servo driver with simple assembly work of capacitor to housing
    Patent number: 12014874
    Abstract: A servo driver is provided with a housing, a substantially cylindrical capacitor, and a case body in which the capacitor is stored. The case body has a substantially box-like shape formed by being provided with an opening portion that makes it possible to take in and out the capacitor with respect to the case body along a direction orthogonal to an axial direction of the capacitor, and is assembled to the housing so that the opening portion is covered with a closing portion that is a part of the housing. An elastically deformable cushion material is interposed between the closing portion and the capacitor. While being elastically biased to a bottom portion of the case body, the capacitor is thereby sandwiched and held between the closing portion and the bottom portion.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: June 18, 2024
    Assignee: OMRON Corporation
    Inventors: Shuhei Yamada, Keisuke Mori
  • METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION
    Publication number: 20240153768
    Abstract: A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).
    Type: Application
    Filed: December 21, 2023
    Publication date: May 9, 2024
    Applicant: JSR CORPORATION
    Inventors: Hiroki NAKATSU, Shinya Abe, Shuhei Yamada, Takashi Tsuji, Hiroki Wakayama, Kosuke Mayumi, Hiroyuki Miyauchi