Patents by Inventor Shuhei Yamada

Shuhei Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPERSION OF EXFOLIATED PARTICLES OF LAYERED POLYSILICATE COMPOUND, AND METHOD FOR PRODUCING SAME
    Publication number: 20240132365
    Abstract: A dispersion of exfoliated particles which includes at least one nitrogen-containing basic compound (A) which is a tertiary amine or a quaternary ammonium hydroxide having at least one alkyl group having 3 or 4 carbon atoms, and in which exfoliated particles (C) produced by interlayer-exfoliating a proton-type layered polysilicate compound (B) are dispersed in an aqueous solution (D) having 10 vol % to 90 vol % of an alcohol having 1 to 3 carbon atoms; and a film-forming composition, a porous body-forming composition, an LB film, a coating film, a free-standing membrane, a proton conductor, an electrolyte membrane for fuel cells, and a porous body each containing exfoliated particles.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Applicants: NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY, NISSAN CHEMICAL CORPORATION
    Inventors: Shintaro IDA, Keisuke AWAYA, Kazutoshi SEKIGUCHI, Hirotake KITAGAWA, Shuhei YAMADA
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11955732
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION
    Publication number: 20240113438
    Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Zhen ZHOU, Shuhei YAMADA, Renzhi LIU, Tae Young YANG, Tolga ACIKALIN, Kenneth P. FOUST
  • CONTACTLESS MULTI-DROP AND BROADCAST BIDIRECTIONAL COMMUNICATION SYSTEM
    Publication number: 20240106126
    Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.
    Type: Application
    Filed: July 14, 2023
    Publication date: March 28, 2024
    Inventors: Zhen ZHOU, Tolga ACIKALIN, Kenneth FOUST, Shuhei YAMADA, Tae Young YANG, Timothy F. COX, Renzhi LIU, Richard DORRANCE, Johanny ESCOBAR PELAEZ
  • WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
    Publication number: 20240021522
    Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.
    Type: Application
    Filed: December 23, 2020
    Publication date: January 18, 2024
    Inventors: Tolga ACIKALIN, Tae Young YANG, Debabani CHOUDHURY, Shuhei YAMADA, Roya DOOSTNEJAD, Hosein NIKOPOUR, Issy KIPNIS, Oner ORHAN, Mehnaz RAHMAN, Kenneth P. FOUST, Christopher D. HULL, Telesphor KAMGAING, Omkar KARHADE, Stefano PELLERANO, Peter SAGAZIO, Sai VADLAMANI
  • COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER
    Publication number: 20230416422
    Abstract: A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 10 to 40 ring atoms; and R0 is a monovalent group including a heteroaromatic ring which includes a sulfur atom as a ring-forming atom.
    Type: Application
    Filed: September 11, 2023
    Publication date: December 28, 2023
    Applicant: JSR CORPORATION
    Inventors: Hiroki NAKATSU, Shuhei Yamada, Shinya Abe, Takashi Tsuji, Kanako Ueda, Hiroyuki Miyauchi
  • COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, POLYMER, AND METHOD FOR MANUFACTURING POLYMER
    Publication number: 20230416451
    Abstract: A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a group represented by formula (1-1) or (1-2). In the formulas (1-1) and (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii) or (iv); * is a bond with the carbon atom in the formula (1); and Ar2, Ar3 and Ar4 are each independently a substituted or unsubstituted aromatic ring having 6 to 20 ring atoms that forms a fused ring structure together with the two adjacent carbon atoms in the formulas (1-1) and (1-2).
    Type: Application
    Filed: August 29, 2023
    Publication date: December 28, 2023
    Applicant: JSR CORPORATION
    Inventors: Shuhei YAMADA, Shinya ABE, Takashi TSUJI, Kanako UEDA, Hiroki NAKATSU, Hiroyuki MIYAUCHI
  • Connector
    Patent number: 11799238
    Abstract: A receptacle 47 includes a resiliently deformable lock arm 55 extending in a front-rear direction. The lock arm 55 includes a locking projection 57 projecting into the receptacle 47 from a rear end part and a stopping projection 59 projecting into the receptacle 47 from a location forward of the locking projection 57. The moving plate 42 includes a lock portion 76 at a position corresponding to the lock arm 55. A rear surface of the lock portion 76 faces the locking projection 57 to restrict a movement of the moving plate 42 to a connection position and a front surface of the lock portion 76 faces the stopping projection 59 to restrict a forward movement of the moving plate 42 when the moving plate 42 is at the initial position.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: October 24, 2023
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Shuhei Yamada
  • ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES
    Publication number: 20230207405
    Abstract: Embodiments disclosed herein include electronic devices. In an embodiment, an electronic device comprises a core, where the core comprises a first layer comprising glass, and a second layer comprising glass over the first layer. In an embodiment, a trace is between the first layer and the second layer. In an embodiment, routing layers are on the core.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Arghya SAIN, Andrew P. COLLINS, Sivaseetharaman PANDI, Telesphor KAMGAING, Tolga ACIKALIN, Shuhei YAMADA
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20230145401
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 11, 2023
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • COMPOSITION FOR FORMING GAS BARRIER FILM, GAS BARRIER FILM AND METHOD FOR PRODUCING SAME
    Publication number: 20230104467
    Abstract: A gas barrier film-forming composition comprising the following components: plate-like particles composed of exfoliated layer substances generated through interlayer exfoliation of layered compound, plate-like particles having average thickness of 0.7 nm to 100 nm, average major-axis length of 100 nm to 100,000 nm, and ratio of (maximum major-axis length/width orthogonal to maximum major-axis length) of 1.0 to 10.0, and containing quaternary ammonium ions each having total carbon atom number of 13 to 45 and one or two C10-20 alkyl groups, and anionic surfactant having ammonium ion, wherein the amount of each of quaternary ammonium ions and anionic surfactant is more than 0% by mass and 3.0% by mass or less relative to mass of plate-like particles, a water-soluble polymer; and an aqueous medium. The gas barrier film-forming composition, wherein layered compound is ilerite. A formed product comprising a base and a gas barrier film disposed on surface of the base.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 6, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Masahiro HIDA, Shuhei YAMADA, Jiahao LIU, Hirotake KITAGAWA
  • CONNECTOR
    Publication number: 20230030972
    Abstract: A connector 10 is provided with electrically conductive inner conductors 11, an outer conductor 13 made of die casting for surrounding the inner conductors 11, an insulating housing 14 into which the outer conductor 13 is mounted, and a coupling member 15 for coupling the outer conductor 13 and the housing 14 to each other.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 2, 2023
    Inventor: Shuhei YAMADA
  • ANTENNA ASSEMBLY FOR INTEGRATED CIRCUIT PACKAGE
    Publication number: 20220416428
    Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Zhen Zhou, Tae Young Yang, Shuhei Yamada, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth Foust, Jason Mix, Renzhi Liu
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20220384956
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 1, 2022
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asi, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • EMBEDDED ANTENNAS STRUCTURES FOR WIRELESS COMMUNICATIONS AND RADAR
    Publication number: 20220352622
    Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.
    Type: Application
    Filed: December 27, 2019
    Publication date: November 3, 2022
    Inventors: Debabani CHOUDHURY, Jose Rodrigo CAMACHO PEREZ, Shuhei YAMADA, Vida Ilderem BURGER, Bryce D. HORINE, Harry SKINNER
  • ANTENNA UNITS, RADIATION AND BEAM SHAPE OF ANTENNA UNITS, AND METHODS THEREOF
    Publication number: 20220344835
    Abstract: Monodirectional antennas may be arranged to radiate in a near omni-directional pattern. By incorporating switches into the antenna arrangement, the antennas can be controlled to selectively radiate from a common radiofrequency feed. These arrangements may be packaged in a housing, which may aid both in antenna performance and in antenna installation. According to another aspect of the disclosure, housings may include a plurality of antennas, and one or more procedures may be implemented to determine a codebook to radiate from the circular arrangement according to various beam constrains.
    Type: Application
    Filed: December 24, 2019
    Publication date: October 27, 2022
    Inventors: Seong-Youp John SUH, Timo Sakari HUUSARI, Shuhei YAMADA, Oner ORHAN, Jose Rodrigo CAMACHO PEREZ
  • ANTENNA DUPLEXING, WAVEGUIDES, AND METHODS THEREOF
    Publication number: 20220337282
    Abstract: A radio frequency front end and an antenna front end may be separated from one another to maintain close proximity between a low noise amplifier and an antenna while achieving improved thermal regulation of a power amplifier. The radio frequency front end antenna front end may include a duplexing system that enables operation with a single electrical cable. Furthermore, where it is desired to transmit a radiofrequency signal via a waveguide, a flexible waveguide may be constructed with a distributed capacitance between waveguide protrusions.
    Type: Application
    Filed: December 24, 2019
    Publication date: October 20, 2022
    Inventors: Jose Rodrigo CAMACHO PEREZ, Debabani CHOUDHURY, Timo Sakari HUUSARI, Seong-Youp John SUH, Shuhei YAMADA
  • SERVO DRIVER
    Publication number: 20220293340
    Abstract: A servo driver is provided with a housing, a substantially cylindrical capacitor, and a case body in which the capacitor is stored. The case body has a substantially box-like shape formed by being provided with an opening portion that makes it possible to take in and out the capacitor with respect to the case body along a direction orthogonal to an axial direction of the capacitor, and is assembled to the housing so that the opening portion is covered with a closing portion that is a part of the housing. An elastically deformable cushion material is interposed between the closing portion and the capacitor. While being elastically biased to a bottom portion of the case body, the capacitor is thereby sandwiched and held between the closing portion and the bottom portion.
    Type: Application
    Filed: February 5, 2020
    Publication date: September 15, 2022
    Applicant: OMRON Corporation
    Inventors: Shuhei YAMADA, Keisuke MORI
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11424539
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • COMPOSITION FOR PREVENTING OR TREATING NEUROTROPHIC KERATITIS WHICH CONTAINS PACAP PEPTIDE OR STABILIZED PACAP PEPTIDE
    Publication number: 20220202905
    Abstract: The purpose of the present invention is to provide a composition for preventing or treating neurotrophic keratitis. It is found that PACAP peptide exerts an effect to prevent corneal damages in a neurotrophic keratitis model and can promote neurite extension in a cultured nerve cell model. Furthermore, stability can be significantly increased by substituting a carboxyl group in an aspartic acid residue located at position-3 and/or position-8 in the sequence for PACAP by tetrazole. Provided are: a composition for preventing or treating neurotrophic keratitis, which contains PACAP peptide or stabilized PACAP peptide, and a neurite extension promoting agent.
    Type: Application
    Filed: May 14, 2020
    Publication date: June 30, 2022
    Applicant: SENJU PHARMACEUTICAL CO., LTD.
    Inventors: Takeshi NAKAJIMA, Mamiko MACHIDA, Shuhei YAMADA