Patents by Inventor Shuhei Yamada

Shuhei Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOUNTING STRUCTURE FOR CAPACITOR AND RESISTOR, INPUT UNIT, AND MEASURING APPARATUS
    Publication number: 20200203080
    Abstract: A mounting structure minimizes the influence of displacements, along a length direction of a resistor, in mounting positions of capacitor electrodes on the electrical characteristics of a circuit including a parallel circuit composed of a capacitor and the resistor. The capacitor has first and second electrodes, which respectively include first and second side surface portions disposed in parallel to a length direction of the resistor. The resistor has a first resistance body corresponding to the first side surface portions and a second resistance body corresponding to the second side surface portions that are separately disposed along the length direction and connected in series via a wire, and is mounted so that the first resistance body is positioned directly facing the first side surface portions and the second resistance body is positioned directly facing the second side surface portions.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 25, 2020
    Applicant: HIOKI E.E. CORPORATION
    Inventors: Shuhei YAMADA, Kazunobu HAYASHI, Kenichi SEKI, Hajime YODA, Toshio HEISHI
  • Systems and methods for detection of occupancy using radio waves
    Patent number: 10620307
    Abstract: Systems and methods are disclosed for detecting a presence of a person in an area of coverage using radar. A transmitter can transmit radio signals in a first direction in an area of coverage defined by a wall and a floor. A receiver can receive the transmitted radio signals reflected back from the area of coverage. A signal conditioning circuit can process the received radio signals. One or more hardware processors can be programmed to analyze the processed radio signals and detect a presence of a person in the area of coverage based on the analysis. The analysis of the processed signals can be performed in both time and frequency domain. In addition to radar, an input from an infrared sensor can also be used in conjunction with radar based detection.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: April 14, 2020
    Assignee: University of Hawaii
    Inventors: Ehsan Yavari, Xiaomeng Gao, Olga Boric-Lubecke, Chenyan Song, Pooja Nuti, Shuhei Yamada
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Wafer level package and wafer level chip size package
    Patent number: 10497679
    Abstract: A wafer level package that includes a first wafer; a second wafer facing the first wafer; a plurality of chips between the first wafer and the second wafer and arranged in an array; a plurality of sealing frames at predetermined intervals and surrounding each of the plurality of chips to seal the chips; and a coupling portion which couples opposed corners of respective sealing frames.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: December 3, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • WORK MACHINE
    Publication number: 20190350112
    Abstract: A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.
    Type: Application
    Filed: January 17, 2017
    Publication date: November 14, 2019
    Applicant: FUJI CORPORATION
    Inventors: Shuhei YAMADA, Yusuke YAMAKAGE
  • Rotary head for component mounting device
    Patent number: 10440868
    Abstract: A rotary head includes a rotating body on which a plurality of suction nozzles that suck a component at a tip end are disposed in a circumferential direction, and revolves the plurality of suction nozzles by rotation of the rotating body, in which a wall portion with a wall surface along an axial direction of a rotary axis of the rotating body, is provided on a lower surface of the rotating body, and the wall portion is provided in the vicinity of an inner circumferential side of the plurality of suction nozzles such that a reduction in pressure on the inner circumferential side of the plurality of suction nozzles caused by the revolving of the suction nozzles is suppressed.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: October 8, 2019
    Assignee: FUJI CORPORATION
    Inventors: Masataka Iwasaki, Takeshi Fujishiro, Shuhei Yamada
  • ANTENNA BEAMWIDTH CONTROL
    Publication number: 20190305422
    Abstract: An antenna system including an antenna configured to emit an electromagnetic wave, and a beamwidth controller disposed on the antenna and configured to align with a magnetic or electric field direction of the electromagnetic wave, and when the electromagnetic wave at least partially or wholly propagates through the beamwidth controller, resonate and induce a magnetic field to interact with the electromagnetic wave to control a beamwidth of the electromagnetic wave based on a permittivity or permeability of the beamwidth controller.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Inventors: Debabani Choudhury, Shuhei Yamada
  • COMPOSITION FOR MOLDED FOAM AND METHOD FOR PRODUCING SAME, MOLDED FOAM AND METHOD FOR PRODUCING SAME, AND MODIFIED CELLULOSE-CONTAINING RESIN COMPOSITION FOR MOLDED FOAM
    Publication number: 20190218357
    Abstract: An object of the present invention is to provide a composition for a molded foam containing a peroxide and a blowing agent, in which cellulose fibers are uniformly dispersed in a resin for a foam molding material having high hydrophobicity such as a thermoplastic resin and a rubber, and a foam excellent in mechanical properties which is obtained by reaction of the composition for a molded foam during foam molding. The composition for a molded foam contains a modified cellulose fiber (A) having an unsaturated bond, a thermoplastic resin and/or a rubber (B), a peroxide (C), and a blowing agent (D).
    Type: Application
    Filed: December 12, 2017
    Publication date: July 18, 2019
    Inventors: Shuhei YAMADA, Yukino YANAGIBORI, Syuichi OHIRA, Daisuke KUROKI
  • Method for bonding wafers
    Patent number: 10118247
    Abstract: Provided is a method for bonding wafers, which can bond the wafers to each other with high reliability while reducing the influence on the wafers. The method for bonding wafers includes the steps of: preparing a first wafer that has, on the surface thereof, a first metal layer with a first rigidity modulus, and a second wafer that has, on the surface thereof, a second metal layer with a second rigidity modulus higher than the first rigidity modulus; removing an oxide film at the surface of the second metal layer while an oxide film at the surface of the first metal layer is not removed; and bonding the surface of the first wafer to the surface of the second wafer.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: November 6, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • Liquid crystal apparatus and electronic equipment
    Patent number: 10026370
    Abstract: A liquid crystal apparatus includes a first substrate and a second substrate which are arranged opposite to each other and bonded with sealing material, a liquid crystal layer interposed between the first substrate and the second substrate, a pixel electrode provided in a display region of the first substrate, a counter electrode provided to oppose the pixel electrodes in the second substrate, and a peripheral electrode provided in the first substrate between the display region and the sealing material in plan view, in which a signal, which is an alternating potential which inverts a polarity with respect to a reference potential in a first period and which is the reference potential in a second period, is applied to the peripheral electrode.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 17, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Shuhei Yamada
  • MEMS DEVICE AND METHOD FOR PRODUCING SAME
    Publication number: 20180127268
    Abstract: A MEMS device that includes a lower substrate having an element region on a surface thereof; an upper substrate opposed to the lower substrate; and a bonding section that bonds the lower substrate and the upper substrate to each other around the periphery of the element region. The bonding section has a first region, a second region, and a third region which are sequentially provided in this order from a side closer to the element region to a side farther from the element region. At least one of the first region and the third region contains a hyper-eutectic alloy of one of a first component and a second component, and the second region contains a eutectic alloy of the first component and the second component.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 10, 2018
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • WAFER LEVEL PACKAGE AND WAFER LEVEL CHIP SIZE PACKAGE
    Publication number: 20180096972
    Abstract: A wafer level package that includes a first wafer; a second wafer facing the first wafer; a plurality of chips between the first wafer and the second wafer and arranged in an array; a plurality of sealing frames at predetermined intervals and surrounding each of the plurality of chips to seal the chips; and a coupling portion which couples opposed corners of respective sealing frames.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • Linear motor device
    Patent number: 9825508
    Abstract: A linear motor device includes a track member with multiple magnets with alternating N poles and S poles arranged along the moving direction, and a moving body with a configuration which includes an armature which is movably mounted on the track member; and the device generates a driving force in the moving direction between the magnetic flux created armature and the magnets of track member. The armature also includes a heat conduction member arranged in cooling passages formed in cores of the armature. By this, coils on the moving body side are cooled efficiently, and a large driving force can be achieved by passing a large current as well as maintaining a large space for winding the coils in order to increase the winding count.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: November 21, 2017
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Makoto Kainuma, Ryo Nagata, Masatoshi Fujita, Shuhei Yamada
  • ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
    Publication number: 20170315344
    Abstract: In an electro-optical device, a mirror that is formed on an element substrate is sealed by a frame shaped spacer and a plate-like light-transmitting cover which is adhered to the spacer. An inorganic barrier layer is formed on an outer face of the spacer and a side face of the light-transmitting cover, and the boundary of the spacer and the light-transmitting cover is covered by the inorganic barrier layer.
    Type: Application
    Filed: July 17, 2017
    Publication date: November 2, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Terunao HANAOKA, Shuhei YAMADA
  • METHOD FOR BONDING WAFERS
    Publication number: 20170252855
    Abstract: Provided is a method for bonding wafers, which can bond the wafers to each other with high reliability while reducing the influence on the wafers. The method for bonding wafers includes the steps of: preparing a first wafer that has, on the surface thereof, a first metal layer with a first rigidity modulus, and a second wafer that has, on the surface thereof, a second metal layer with a second rigidity modulus higher than the first rigidity modulus; removing an oxide film at the surface of the second metal layer while an oxide film at the surface of the first metal layer is not removed; and bonding the surface of the first wafer to the surface of the second wafer.
    Type: Application
    Filed: May 19, 2017
    Publication date: September 7, 2017
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • Liquid chemical for forming protecting film
    Patent number: 9748092
    Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film at least on a surface of a recessed portion of an uneven pattern at the time of cleaning a wafer having a finely uneven pattern at its surface and containing silicon at at least a part of the uneven pattern. This liquid chemical contains a silicon compound A represented by the general formula: R1aSi(H)bX4-a-b and an acid A, the acid A being at least one selected from the group consisting of trimethylsilyl trifluoroactate, trimethylsilyl trifluoromethanesulfonate, dimethylsilyl trifluoroactate, dimethylsilyl trifluoromethanesulfonate, butyldimethylsilyl trifluoroactate, butyldimethylsilyl trifluoromethanesulfonate, hexyldimethylsilyl trifluoroacetate, hexyldimethylsilyl trifluoromethanesulfonate, octyldimethylsilyl trifluoroactate, octyldimethylsilyl trifluoromethanesulfonate, decyldimethylsilyl trifluoroacetate and decyldimethylsilyl trifluoromethanesulfonate.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: August 29, 2017
    Assignee: Central Glass Company, Limited
    Inventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Masanori Saito, Atsushi Ryokawa, Shuhei Yamada, Hidehisa Nanai, Yoshinori Akamatsu
  • Chemical for forming protective film
    Patent number: 9691603
    Abstract: Disclosed is a liquid chemical for forming a water repellent protective film on a wafer that has at its surface a finely uneven pattern and contains silicon element at least at a part of the uneven pattern, the water repellent protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains: a silicon compound (A) represented by the general formula R1aSi(H)b(X)4?a?b and an acid; or a silicon compound (C) represented by the general formula R7gSi(H)h(CH3)w(Z)4?g?h?w and a base that contains no more than 35 mass % of water. The total amount of water in the liquid chemical is no greater than 1000 mass ppm relative to the total amount of the liquid chemical. The liquid chemical can improve a cleaning step that easily induces pattern collapse.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: June 27, 2017
    Assignee: Central Glass Company, Limited
    Inventors: Soichi Kumon, Takashi Saio, Shinobu Arata, Masanori Saito, Atsushi Ryokawa, Shuhei Yamada, Hidehisa Nanai, Yoshinori Akamatsu
  • SYSTEMS AND METHODS FOR DETECTION OF OCCUPANCY USING RADIO WAVES
    Publication number: 20170123058
    Abstract: Systems and methods are disclosed for detecting a presence of a person in an area of coverage using radar. A transmitter can transmit radio signals in a first direction in an area of coverage defined by a wall and a floor. A receiver can receive the transmitted radio signals reflected back from the area of coverage. A signal conditioning circuit can process the received radio signals. One or more hardware processors can be programmed to analyze the processed radio signals and detect a presence of a person in the area of coverage based on the analysis. The analysis of the processed signals can be performed in both time and frequency domain. In addition to radar, an input from an infrared sensor can also be used in conjunction with radar based detection.
    Type: Application
    Filed: November 4, 2016
    Publication date: May 4, 2017
    Inventors: Ehsan Yavari, Xiaomeng Gao, Olga Boric-Lubecke, Chenyan Song, Pooja Nuti, Shuhei Yamada
  • Controller for servomotor
    Patent number: D892740
    Type: Grant
    Filed: April 7, 2019
    Date of Patent: August 11, 2020
    Assignee: OMRON Corporation
    Inventors: Heita Nada, Shuhei Yamada, Satoshi Sano, Tomohiro Fujita
  • Controller for servomotor
    Patent number: D893425
    Type: Grant
    Filed: April 7, 2019
    Date of Patent: August 18, 2020
    Assignee: OMRON Corporation
    Inventors: Heita Nada, Shuhei Yamada, Satoshi Sano, Tomohiro Fujita