Abstract: A two-core twisted shielded cable includes two insulated wires being twisted together, a metal foil shield, a metal braid, and a sheath. A relationship between an ellipse circumscribing the two insulated wires and a width of the metal foil shield is the width=an elliptical circumference/(1??), and 0.20???0.40. The metal foil shield has a thickness of 15 ?m or more and 120 ?m or less, includes a metal layer and a PET film layer, and 0.10?(a metal layer thickness/a PET film layer thickness)?1.25.

Abstract: Disclosed is a propylene-based resin composition comprising more than 15 parts by mass and 40 parts by mass or less of an ethylene/?-olefin copolymer (E1) and 4 to 20 parts by mass of an ethylene/?-olefin/diene copolymer (E2), and comprising also a propylene-based polymer (P1) having an amount of a n-decane-soluble part at 23° C. of 5 to 25% by mass, wherein the ethylene content of the n-decane-soluble part is more than 40% by mass and 60% by mass or less, a propylene homopolymer (P2) and an inorganic filler (F) [providing that the total amount of the components (P1), (P2), (E1), (E2) and (F) is taken as 100 parts by weight]. The propylene-based resin composition is capable of producing a molded article which is excellent in mechanical properties, unnoticeable flow marks, low gloss.

Abstract: Disclosed is a propylene-based resin composition comprising more than 15 parts by mass and 40 parts by mass or less of an ethylene/?-olefin copolymer (E1) and 4 to 20 parts by mass of an ethylene/?-olefin/diene copolymer (E2), and comprising also a propylene-based polymer (P1) having an amount of a n-decane-soluble part at 23° C. of 5 to 25% by mass, wherein the ethylene content of the n-decane-soluble part is more than 40% by mass and 60% by mass or less, a propylene homopolymer (P2) and an inorganic filler (F) [providing that the total amount of the components (P1), (P2), (E1), (E2) and (F) is taken as 100 parts by weight]. The propylene-based resin composition is capable of producing a molded article which is excellent in mechanical properties, unnoticeable flow marks, low gloss.

Abstract: A wiring harness includes an electric wire having a conductor part and an insulator, the insulator covering an outer periphery of the conductor part and containing a plasticizer, and a coaxial wire having an internal conductor, an internal insulator, an external conductor, and a sheath, the internal insulator provided on an outer periphery of the internal conductor, the external conductor provided on an outer periphery of the internal insulator, and the sheath covering an outer periphery of the external conductor. The coaxial wire is arranged adjacent to the electric wire. The coaxial wire comprises a film layer which is provided between the internal insulator and the external conductor and which prevents transfer of the plasticizer. A contact force between the internal insulator and the film layer is 1N or more.

Abstract: The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.

Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.

Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.

Abstract: A wiring harness includes an electric wire having a conductor part and an insulator, the insulator covering an outer periphery of the conductor part and containing a plasticizer, and a coaxial wire having an internal conductor, an internal insulator, an external conductor, and a sheath, the internal insulator provided on an outer periphery of the internal conductor, the external conductor provided on an outer periphery of the internal insulator, and the sheath covering an outer periphery of the external conductor. The coaxial wire is arranged adjacent to the electric wire. The coaxial wire comprises a film layer which is provided between the internal insulator and the external conductor and which prevents transfer of the plasticizer. A contact force between the internal insulator and the film layer is 1N or more.

Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.

Abstract: The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.

Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.

Abstract: A pedal arm provided with an arm main body has a first end portion, a second end portion, a pedal pad portion, and a shaft portion. The arm main body includes a first wall portion and a second wall portion in a first direction, and a third wall portion and a fourth wall portion in a second direction. One of the first wall portion and the second wall portion includes an abutting portion where the first end portion and the second end portion contacts, and the third wall portion and the fourth wall portion include a first curved portion and a second curved portion. A first depressed wall portion and a second depressed wall portion are formed on the first curved portion and the second curved portion, which are formed in inward convex shapes, respectively, and parts of the first depressed wall portion and the second depressed wall portion contact.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Abstract: [OBJECT] In an SOFC cell comprising a Cr-containing alloy or the like and an air electrode bonded together, the invention is to provide a cell capable of effectively restricting occurrence of Cr poisoning of the air electrode and capable also of effectively restricting occurrence of oxidation deterioration due to Cr depletion in the alloy or the like. [SOLUTION] In a cell for a solid oxide fuel cell (SOFC) comprising a Cr (chrome)-containing alloy or oxide and an air electrode bonded together, wherein on the surface of the alloy or oxide, there is formed a coating layer containing a spinel oxide comprised of a first mono metal oxide and a second mono metal oxide, the first mono metal oxide having an equilibrium dissociated oxygen partial pressure at 750° C. ranging from 1.83×10?20 to 3.44×10?13 atm., the second mono metal oxide having a lower equilibrium dissociated oxygen partial pressure at 750° C. than the first mono metal oxide.

Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.

Abstract: When a lid (20) is attached to a substrate removal/insertion opening (2) in a container body (1), a placement piece forcible displacement means (22) forcibly moves a substrate placement piece (4), which is provided in a region in the vicinity of the substrate removal/insertion opening (2), to a displacement position which does not overlap with a disc-shaped substrate (W). Thus, even if the disc-shaped substrate (W) is increased in diameter, there is no risk of the stored disc-shaped substrate (W) coming into contact with the substrate placement piece (4) due to factors such as vibration or impact, thus the disc-shaped substrate (W) can be stored more safely.

Abstract: When a lid (20) is attached to a substrate removal/insertion opening (2) in a container body (1), a placement piece forcible displacement means (22) forcibly moves a substrate placement piece (4), which is provided in a region in the vicinity of the substrate removal/insertion opening (2), to a displacement position which does not overlap with a disc-shaped substrate (W). Thus, even if the disc-shaped substrate (W) is increased in diameter, there is no risk of the stored disc-shaped substrate (W) coming into contact with the substrate placement piece (4) due to factors such as vibration or impact, thus the disc-shaped substrate (W) can be stored more safely.

Abstract: A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.