Patents by Inventor Shuichi Matsuda

Shuichi Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147866
    Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.
    Type: Application
    Filed: January 3, 2024
    Publication date: May 2, 2024
    Inventors: Koji OHASHI, Chikara KOJIMA, Hiroshi MATSUDA, Hironori SUZUKI, Shuichi TANAKA
  • Patent number: 11917922
    Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: February 27, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Koji Ohashi, Chikara Kojima, Hiroshi Matsuda, Hironori Suzuki, Shuichi Tanaka
  • Publication number: 20220401461
    Abstract: The inventors have found that compounds of formula (I) have an effect to protect cartilage. Accordingly the disclosure provides a pharmaceutical composition for protecting cartilage comprising a compound of formula (I) or an ester, oxide, pharmaceutically acceptable salt, or solvate thereof. The pharmaceutical composition can be used for treating and/or preventing a disease associated with cartilage degeneration such as osteoarthritis.
    Type: Application
    Filed: October 23, 2020
    Publication date: December 22, 2022
    Applicants: Kyoto University, Kyoto Drug Discovery & Development Co., Ltd.
    Inventors: Kohei Nishitani, Akira Kakizuka, Hanako Ikeda, Shuichi Matsuda, Sachiko Iwai, Motoo Saito, Kunihiro Musashi
  • Patent number: 10327860
    Abstract: A measurement instrument for joint surgery may relatively move a first bone and a second bone, which are connected by soft tissue at a joint, in directions other than directions in which these bones are separated from each other, and measure the stability of a connection state between these bones. A housing may be fixed to a first bone. A slider may slide relative to the housing, and abut against a second bone. A position display portion displays the position of the slider relative to the housing. A measurement instrument for joint surgery relatively moves the second bone relative to the first bone along a joint face by the slider sliding relative to the housing. The stability of a state of connection between the first bone and the second bone is measured based on the position of the slider relative to the housing displayed by the position display portion.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: June 25, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Shuichi Matsuda, Masahiko Hashida, Yuichi Enomoto
  • Publication number: 20180181742
    Abstract: Provided is a network system which improves a security and prevents illegal use when providing services such as Internet banking services. A random graphic table (RMT) is issued to a user, and having text characters which a user inputs and figures which corresponds to the text characters, respectively, and which is unrelated to the text characters such as a photograph. A banking organization server (30) manages random graphic table data corresponding to the random graphic table (RMT), distributes data for input including a portion of the random graphic table data to a communication terminal device (10) when information is inputted, and executing a specification of information to be specified while comparing the data for input with the random graphic table (RMT).
    Type: Application
    Filed: December 21, 2017
    Publication date: June 28, 2018
    Inventors: Haruhiko FUJII, Shuichi MATSUDA
  • Patent number: 9886564
    Abstract: Provided is a network system which improves a security and prevents illegal use when providing services such as Internet banking services. A random graphic table (RMT) is issued to a user, and having text characters which a user inputs and figures which corresponds to the text characters, respectively, and which is unrelated to the text characters such as a photograph. A banking organization server (30) manages random graphic table data corresponding to the random graphic table (RMT), distributes data for input including a portion of the random graphic table data to a communication terminal device (10) when information is inputted, and executing a specification of information to be specified while comparing the data for input with the random graphic table (RMT).
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: February 6, 2018
    Assignee: BankGuard, Inc.
    Inventors: Haruhiko Fujii, Shuichi Matsuda
  • Publication number: 20170049527
    Abstract: A measurement instrument for joint surgery may relatively move a first bone and a second bone, which are connected by soft tissue at a joint, in directions other than directions in which these bones are separated from each other, and measure the stability of a connection state between these bones. A housing may be fixed to a first bone. A slider may slide relative to the housing, and abut against a second bone. A position display portion displays the position of the slider relative to the housing. A measurement instrument for joint surgery relatively moves the second bone relative to the first bone along a joint face by the slider sliding relative to the housing. The stability of a state of connection between the first bone and the second bone is measured based on the position of the slider relative to the housing displayed by the position display portion.
    Type: Application
    Filed: June 17, 2015
    Publication date: February 23, 2017
    Applicant: KYOCERA Medical Corporation
    Inventors: Shuichi MATSUDA, Masahiko HASHIDA, Yuichi ENOMOTO
  • Publication number: 20170046506
    Abstract: Provided is a network system which improves a security and prevents illegal use when providing services such as Internet banking services. A random graphic table (RMT) is issued to a user, and having text characters which a user inputs and figures which corresponds to the text characters, respectively, and which is unrelated to the text characters such as a photograph. A banking organization server (30) manages random graphic table data corresponding to the random graphic table (RMT), distributes data for input including a portion of the random graphic table data to a communication terminal device (10) when information is inputted, and executing a specification of information to be specified while comparing the data for input with the random graphic table (RMT).
    Type: Application
    Filed: October 31, 2016
    Publication date: February 16, 2017
    Inventors: Haruhiko FUJII, Shuichi MATSUDA
  • Publication number: 20150240307
    Abstract: The present invention provides a method of testing a sample derived from the blood of a test subject for determining the pathology of rheumatoid arthritis, including the steps of (a) measuring an expression level of at least one miRNA selected from the group consisting of miR-24, miR-26a, miR-28-5p, miR-28-3p, miR-30c, miR-30e-3p, miR-125a-5p, miR-126-3p and miR-502-5p, or expression levels of miR-24, miR-30a-5p and miR-125a-5p, in a sample derived from the blood of a test subject, and (b) correlating the expression level measured in step (a) with the pathology of rheumatoid arthritis.
    Type: Application
    Filed: August 27, 2013
    Publication date: August 27, 2015
    Inventors: Hiroyuki Yoshitomi, Koichi Murata, Shuichi Matsuda, Hiromu Ito, Moritoshi Furu
  • Patent number: 8246570
    Abstract: The present invention provides a cell transplantation device which is capable of inserting cells for transplantation into a cell-deficient site without application of direct external force to the cells. The present invention discloses a cell transplantation device provided with a plate-type carrier with at least one pass-through hole formed on its side surface, a linear member to be threaded through the pass-through hole, and a pusher member which engages with the linear member that comes out from each exit of the pass-through holes.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: August 21, 2012
    Assignees: Japan Medical Materials Corporation
    Inventors: Yukihide Iwamoto, Koichi Nakayama, Hiromasa Miura, Kazuhiro Tanaka, Shuichi Matsuda
  • Publication number: 20110106005
    Abstract: The present invention provides a cell transplantation device which is capable of inserting cells for transplantation into a cell-deficient site without application of direct external force to the cells. The present invention discloses a cell transplantation device provided with a plate-type carrier with at least one pass-through hole formed on its side surface, a linear member to be threaded through the pass-through hole, and a pusher member which engages with the linear member that comes out from each exit of the pass-through holes.
    Type: Application
    Filed: December 21, 2007
    Publication date: May 5, 2011
    Inventors: Yukihide Iwamoto, Koichi Nakayama, Hiromasa Miura, Kazuhiro Tanaka, Shuichi Matsuda
  • Patent number: 7268439
    Abstract: A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: September 11, 2007
    Assignee: NEC Electronics Corporation
    Inventor: Shuichi Matsuda
  • Publication number: 20060231936
    Abstract: A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.
    Type: Application
    Filed: June 6, 2006
    Publication date: October 19, 2006
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Shuichi Matsuda
  • Patent number: 7084511
    Abstract: A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: August 1, 2006
    Assignee: NEC Electronics Corporation
    Inventor: Shuichi Matsuda
  • Publication number: 20050154629
    Abstract: A system for analyzing purchasing trends of products which manufacturers sell in stores, characterized by being provided with a server 1 communicably connected with first terminals 3 provided at manufacturers and second terminals 3 provided in stores, the server 1 provided with entry means enabling input of product information of products from the first terminals 3, product information display means for sending product information to and displaying it at the second terminals 2, and acquiring means for acquiring histories by which product information is accessed by the second terminals 2.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 14, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Shuichi Matsuda, Yoshiharu Shimada, Tsuneji Ookawara, Miyuki Sato
  • Patent number: 6858230
    Abstract: The present invention provides a method for preparation of a pharmaceutical composition which comprises suspending a hydrophobic medical compound without generating foams. The present inventors have directed attention to properties of a hydrophobic medical compound and found a method for preparation of a pharmaceutical composition which comprises suspending and dispersing a basic hydrophobic medical compound, and neutralizing with a basic aqueous solution.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: February 22, 2005
    Assignee: Shionogi & Co., Ltd.
    Inventors: Hidekazu Shodai, Noboru Nagafuji, Shuichi Matsuda, Yusuke Suzuki
  • Patent number: 6794750
    Abstract: A semiconductor device equipped with a TAB (tape automated bonding) tape. A desired pattern of wiring is formed on one surface of the TAB tape and a semiconductor chip having two or more chip electrodes is disposed on the other surface of the TAB tape. The wiring and the chip electrodes are electrically interconnected via bumps that are formed in through-holes of the wiring in conforming relationship with the chip electrodes. This prevents fault connection between the chip electrodes and the bumps.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: September 21, 2004
    Assignee: NEC Electronics Corporation
    Inventor: Shuichi Matsuda
  • Patent number: 6632452
    Abstract: Coloring change of a pharmaceutical composition containing a compound having a phenolic hydroxyl group, such as an anti-inflammatory agent or an antioxidant having a phenolic hydroxyl group or the compound of formula (I) can be controlled by adding an acid. The present invention provides a pharmaceutical composition containing a compound having a phenolic hydroxyl group and an acid in which coloring change is controlled.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: October 14, 2003
    Assignee: Shionogi & Co., Ltd.
    Inventors: Hidekazu Shodai, Noboru Nagafuji, Shuichi Matsuda
  • Publication number: 20020140083
    Abstract: A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin. When the sealing resin is molded, among the plurality of wiring patterns, a gap will not be produced between the circuit board and a metal mold abutted against the front surface of the circuit board.
    Type: Application
    Filed: March 27, 2002
    Publication date: October 3, 2002
    Applicant: NEC CORPORATION
    Inventor: Shuichi Matsuda
  • Publication number: 20020143650
    Abstract: A network system of a client (semiconductor device manufacturer) and a network system of a product provider (mask manufacturer) are interconnected by means of a private line. A client stores order information in an information management server managed thereby and makes the order information open to the product provider. The product provider accesses the information management server of the client and acquires the order information, thus receiving an order.
    Type: Application
    Filed: October 5, 2001
    Publication date: October 3, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Shuichi Matsuda