Abstract: It is an object of the present invention to provide an organic EL element including a capping layer constituted by two layers consisting of a first capping layer and a second capping layer that has a refractive index that is higher than that of the first capping layer, in order to improve the light extraction efficiency compared with an organic EL element including a capping layer constituted by a single layer. The present invention provides an organic electroluminescent element at least including an anode, a hole transport layer, a light emitting layer, an electron transport layer, a cathode, and a capping layer arranged in this order, wherein the capping layer has a structure constituted by two layers consisting of a first capping layer and a second capping layer, a refractive index of the second capping layer is higher than a refractive index of the first capping layer throughout a wavelength range from 450 to 650 nm, and the second capping layer contains an arylamine compound having a specific structure.

Abstract: The present invention relates to an organic EL device having at least an anodic electrode, a hole transport layer, a light emitting layer, an electron transport layer, a cathodic electrode, and a capping layer in this order, in which the capping layer contains an amine compound having a benzazole ring structure represented by the following general formula (A-1).

Abstract: It is an object of the present invention to provide a compound for a capping layer that has a high refractive index and a low extinction coefficient in a range of 450 nm to 750 nm to improve the light extraction efficiency of an organic EL element. The present invention has focused on the fact that compounds having a benzene skeleton at the center thereof are excellent in stability and also durability in the form of a thin film, and that the refractive index thereof can be improved by modifying the molecular structure, and thus, molecules have been designed. Provided is a compound represented by a general formula (1), and an organic EL element with excellent luminance efficiency is obtained by using that compound as a constituent material of a capping layer.

Abstract: A method for manufacturing an SiC wafer from an SiC ingot includes a verifying step of applying a test laser beam to the SiC ingot in a predetermined area with the focal point of the test laser beam set inside the SiC ingot at a predetermined depth from the end surface of the SiC ingot. The test laser beam has a transmission wavelength to SiC, thereby forming a test separation layer inside the SiC ingot at the predetermined depth. The test separation layer has a test modified portion where SiC is decomposed into Si and C and test cracks extend from the test modified portion along a c-plane in the SiC ingot. Whether or not the test cracks have been properly formed is verified. When verifying, the power of the test laser beam is changed to set a proper power at which the test cracks are properly formed.

Abstract: According to the present invention, there is provided an organic electroluminescence element including at least an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and a cathode in the stated order, the organic electroluminescence element being characterized in that: the hole injection layer contains an arylamine compound represented by the following general formula (1) and an electron acceptor. The organic EL element of the present invention has a high light emission efficiency and an excellent durability, as compared with the related art, while maintaining the existing low drive voltage.

Abstract: An image forming system includes an image forming apparatus including an image forming unit and a fixing unit; a folding processing portion; a pressure-bonding portion; and an input portion capable of selecting a pressure-bonding mode in which a pressure-bonding print prepared by subjecting the recording material to pressure-bonding processing by the folding processing portion and the pressure-bonding portion and capable of selecting a layout of the toner image formed on the recording material. When the pressure-bonding mode is selected, the layout depending on the pressure-bonding mode is selected.

Abstract: An image forming system includes an image forming apparatus including a fixing unit, a folding processing portion, and a pressure-bonding portion. A first recording material having a first basis weight is fixed at a first temperature by the fixing unit and then is pressure-bonded by the pressure-bonding portion after a lapse of a first period. A second recording material having a second basis weight is fixed at a second temperature by the fixing unit and then is pressure-bonded by the pressure-bonding portion after a lapse of a second period. The second basis weight is larger than the first basis weight. The second temperature is higher than the first temperature. The second period is longer than the first period.

Abstract: To provide an organic EL device having low driving voltage, high luminous efficiency, and particularly a long lifetime by combining various materials for an organic EL device having excellent hole and electron injection/transport performances, electron blocking ability, stability in a thin-film state, and durability as materials for an organic EL device having high luminous efficiency and high durability so as to allow the respective materials to effectively reveal their characteristics. In the organic EL device having at least an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode, in this order, the hole injection layer includes an arylamine compound of the following general formula (1) and a radialene derivative of the following general formula (2).

Abstract: An RFID tag 300 with a boost antenna includes a boost antenna 100 and an RFID tag 200, wherein the boost antenna 100 includes: a radiation unit 10 which is conductive; a ground unit 30 which faces the radiation unit 10 and is conductive; and a short circuit unit 20 which connects one end of the radiation unit 10 and one end of the ground unit 30, and electrically connecting the radiation unit 10 and the ground unit 30 with each other, and wherein the RFID tag 200 is arranged at a position close to the short circuit unit 20 on the ground unit 30, wherein each of the boost antenna 100 and the RFID tag 200 has resonance characteristics.

Abstract: An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor.

Abstract: This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.

Abstract: An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

Abstract: This RFID tag comprises: a film wiring substrate including a flexible base material having a first surface and a second surface located opposite to the first surface, and conductors located on the first and second surfaces, respectively; and an RFIC IC connected to the conductors, wherein the film wiring substrate is bent, and at least a first conductor part included in the conductor on the first surface, a second conductor part included in the conductor on the first surface or the second surface, and a conductor on the second surface that does not include the second conductor part overlap each other.

Abstract: An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

Abstract: An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor.

Abstract: An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor.

Abstract: An RFID tag includes an RFID tag device and a seat antenna. The RFID tag device includes an RFID tag IC and a board where the RFID tag IC is mounted. The seat antenna includes an antenna conductor. To the seat antenna, the RFID tag device is fixed. The board includes a first surface conductor, a second surface conductor and a short-circuit conductor. The second surface conductor is disposed between the first surface conductor and the antenna conductor. The short-circuit conductor short-circuits the first surface conductor and the second surface conductor. A direction from a connection part in the second surface conductor with the short-circuit conductor to a center of the second surface conductor is aligned with a long side direction of the antenna conductor.

Abstract: An RFID tag board includes a circuit board and a radiation member. The circuit board includes a dielectric substrate, a radiation conductor, a ground conductor, a connection conductor, a first electrode and a second electrode. The dielectric substrate includes a first surface, a second surface and a recess. The second surface is opposite to the first surface, and is a mounting surface to be mounted on an article. The radiation conductor is on the first surface of the dielectric substrate. The ground conductor is on the second surface of the dielectric substrate. The connection conductor electrically connects the radiation conductor and the ground conductor. The first electrode and the second electrode are in the recess. The radiation member is fixed to the first surface of the circuit board.

Abstract: An RFID tag 300 with a boost antenna includes a boost antenna 100 and an RFID tag 200, wherein the boost antenna 100 includes: a radiation unit 10 which is conductive; a ground unit 30 which faces the radiation unit 10 and is conductive; and a short circuit unit 20 which connects one end of the radiation unit 10 and one end of the ground unit 30, and electrically connecting the radiation unit 10 and the ground unit 30 with each other, and wherein the RFID tag 200 is arranged at a position close to the short circuit unit 20 on the ground unit 30, wherein each of the boost antenna 100 and the RFID tag 200 has resonance characteristics.

Abstract: An RFID tag board includes an insulating substrate provided with a first surface conductor, a second surface conductor, a short-circuit part through conductor, a capacitance conductor, a capacitance part through conductor, a first electrode and a second electrode. The short-circuit part through conductor electrically connects the first surface conductor and the second surface conductor. The capacitance conductor faces at least part of one of the first and second surface conductors to form a capacitance element. The capacitance part through conductor electrically connects the capacitance conductor and the other one of the first and second surface conductors. First and second conductors of the capacitance element are electrically connected to the first and second electrodes, respectively, not via the short-circuit part through conductor.