Abstract: A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 ?m or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.

Abstract: A valve spring includes a nitrided layer, and a core portion that is further inward than the nitrided layer. A chemical composition of the core portion consists of, in mass %, C: 0.53 to 0.59%, Si: 2.51 to 2.90%, Mn: 0.70 to 0.85%, P: 0.020% or less, S: 0.020% or less, Cr: 1.40 to 1.70%, Mo: 0.17 to 0.53%, V: 0.23 to 0.33%, Ca: 0.0001 to 0.0050%, Cu: 0.050% or less, Ni: 0.050% or less, Al: 0.0050% or less, Ti: 0.050% or less, and N: 0.0070% or less, with the balance being Fe and impurities. In the core portion, a number density of V-based precipitates having a maximum diameter ranging from 2 to 10 nm is 500 to 8000 per ?m2, and in the core portion, a numerical proportion of Ca sulfides with respect to a total number of oxide-based inclusions and sulfide-based inclusions is 0.20% or less.

Abstract: A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 ?m from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.

Abstract: A fork guide groove of a drum member guides a shift fork so that a shifter member is in a reference position not engaged with first and second speed change members when the drum member is placed in a neutral position, is movable between a first speed-change position engaged with the first speed-change member and the reference position when the drum member is placed in a first operational position, and is movable between a second speed-change position engaged with the second speed-change member and the reference position when the drum member is placed in a second operational position. A slider guide groove of the drum member guides a slider member supported by a fork shaft in an axially movable manner so as not to obstruct movement of the shifter member between the reference position and the first speed-change position when the drum member is placed in the first operational position.

Abstract: A parking lock mechanism of the drum-type transmission device comprises a parking gear that is provided on the transmission shaft, a parking operation arm which is selectively operated between a lock position engaging with the parking gear and an unlock position away from the parking gear, a parking release spring for urging the operation arm toward the unlock position, and a parking pushing member which is positioned at a lock position by pushing the operation arm according to the rotation of the drum member from the shift position or the neutral position to the parking position. One end of the transmission operation shaft is located near the operation arm. At one end of the shift operation shaft, there is provided an arm restraining portion that can urge the operation arm toward the unlock position when the drum member is moved from the parking position to the shift position or the neutral position.

Abstract: An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 ?m or larger and 50 ?m or smaller.

Abstract: A fork guide groove of a drum member guides a shift fork so that a shifter member is in a reference position not engaged with first and second speed change members when the drum member is placed in a neutral position, is movable between a first speed-change position engaged with the first speed-change member and the reference position when the drum member is placed in a first operational position, and is movable between a second speed-change position engaged with the second speed-change member and the reference position when the drum member is placed in a second operational position. A slider guide groove of the drum member guides a slider member supported by a fork shaft in an axially movable manner so as not to obstruct movement of the shifter member between the reference position and the first speed-change position when the drum member is placed in the first operational position.

Abstract: A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 ?m or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.

Abstract: An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 ?m or larger and 50 ?m or smaller.

Abstract: A thermoelectric conversion module includes thermoelectric conversion elements, and a first insulating circuit board provided with a first insulating layer and a first electrode part formed on one surface of the first insulating layer is disposed on one end side of the thermoelectric conversion elements. The first electrode part includes a first aluminum layer made of aluminum or an aluminum alloy, and a first sintered silver layer which is formed on a surface of the first aluminum layer on a side opposite to the first insulating layer and is formed of a sintered body of silver. The first aluminum layer has a thickness in a range of 50 ?m or more and 2000 ?m or less. The first sintered silver layer has a thickness of 5 ?m or more and a porosity of less than 10% at least in a region where the thermoelectric conversion element is disposed.

Abstract: A parking lock mechanism of the drum-type transmission device comprises a parking gear that is provided on the transmission shaft, a parking operation arm which is selectively operated between a lock position engaging with the parking gear and an unlock position away from the parking gear, a parking release spring for urging the operation arm toward the unlock position, and a parking pushing member which is positioned at a lock position by pushing the operation arm according to the rotation of the drum member from the shift position or the neutral position to the parking position. One end of the transmission operation shaft is located near the operation arm. At one end of the shift operation shaft, there is provided an arm restraining portion that can urge the operation arm toward the unlock position when the drum member is moved from the parking position to the shift position or the neutral position.

Abstract: An Ag underlayer-attached metallic member includes a metallic member joined with a body to be joined and an Ag underlayer formed on a joining surface of the metallic member with the body to be joined, the Ag underlayer includes a glass layer formed on a metallic member side and an Ag layer laminated on the glass layer, and an area proportion of voids in an Ag layer surface of the Ag underlayer is 25% or less.

Abstract: A semiconductor device of the present invention includes a circuit layer formed of a conductive material, a semiconductor element mounted on a first surface of the circuit layer, and a ceramic substrate disposed on a second surface of the circuit layer, in which a Ag underlayer having a glass layer and a Ag layer laminated on the glass layer is formed on the first surface of the circuit layer, and the Ag layer of the Ag underlayer and the semiconductor element are directly joined together.

Abstract: An Ag underlayer-attached metallic member includes a metallic member joined with a body to be joined and an Ag underlayer formed on a joining surface of the metallic member with the body to be joined, the Ag underlayer includes a glass layer formed on a metallic member side and an Ag layer laminated on the glass layer, and an area proportion of voids in an Ag layer surface of the Ag underlayer is 25% or less.

Abstract: A semiconductor device of the present invention includes a circuit layer formed of a conductive material, a semiconductor element mounted on a first surface of the circuit layer, and a ceramic substrate disposed on a second surface of the circuit layer, in which a Ag underlayer having a glass layer and a Ag layer laminated on the glass layer is formed on the first surface of the circuit layer, and the Ag layer of the Ag underlayer and the semiconductor element are directly joined together.

Abstract: In a shift-drum speed change operation mechanism, a fork guide groove of a drum member guides a shift fork such that the shift fork is secured in a reference position where it is not depression/projection-engaged with any of first and second speed change members. The shift fork is capable of moving between the reference position and a first speed change position or a second speed change position, where it is depression/projection-engaged with the first or second speed change member respectively, when the drum member is placed in neutral, first and second speed change positions. A slider guide groove of the drum member guides a slider member, which is supported on a boss part of the shift fork in an axially movable manner, so that the slider member does not obstruct movement of the shifter member between the reference and first speed change positions when the drum member is placed in the first speed change position.

Abstract: An elongated trench (35) is formed so as to connect the Ag layer (32) and the exposed part of the circuit layer stretching out around the Ag layer (32). The trench (35) a narrow and elongated recessed part penetrating the glass layer (31) and the aluminum oxide film (12A) from the Ag layer (32) to reach the surface (12a) of the circuit layer (2). The extended part (36), which is a part of the Ag layer (32) flatted along with the inner surface (35a) of the trench (35), is formed in the trench (35). The Ag layer (32) and the circuit layer (12) are electrically connected directly by Ag with a low electric resistance value by the extended part (36) in the portion where the trench (35) is formed.

Abstract: A power module substrate with a Ag underlayer of the invention includes: a circuit layer that is formed on one surface of an insulating layer; and a Ag underlayer that is formed on the circuit layer, in which the Ag underlayer is composed of a glass layer that is formed on the circuit layer side and a Ag layer that is formed by lamination on the glass layer, and regarding the Ag underlayer, in a Raman spectrum obtained by a Raman spectroscopy with incident light made incident from a surface of the Ag layer on a side opposite to the glass layer, when a maximum value of intensity in a wavenumber range of 3,000 cm?1 to 4,000 cm?1 indicated by IA, and a maximum value of intensity in a wavenumber range of 450 cm?1 to 550 cm?1 is indicated by IB, IA/IB is 1.1 or greater.

Abstract: A power module substrate with a Ag underlayer of the invention includes: a circuit layer that is formed on one surface of an insulating layer; and a Ag underlayer that is formed on the circuit layer, in which the Ag underlayer is composed of a glass layer that is formed on the circuit layer side and a Ag layer that is formed by lamination on the glass layer, and regarding the Ag underlayer, in a Raman spectrum obtained by a Raman spectroscopy with incident light made incident from a surface of the Ag layer on a side opposite to the glass layer, when a maximum value of intensity in a wavenumber range of 3,000 cm?1 to 4,000 cm?1 indicated by IA, and a maximum value of intensity in a wavenumber range of 450 cm?1 to 550 cm?1 is indicated by IB, IA/IB is 1.1 or greater.

Abstract: A dual clutch transmission comprises a housing formed therein with a gear chamber incorporating an odd-numbered speed gear train group and an even-numbered speed gear train group. An end of the input shaft is connected to an engine, and a cover is detachably attached to the housing opposite the end of the input shaft so as to define a clutch chamber divided from the gear chamber. A first clutch for the odd-numbered speed gear train group and a second clutch for the even-numbered speed gear train group are disposed in the clutch chamber. Fluid passages for supplying hydraulic fluid to the first and second clutches are formed in the cover.