Abstract: A wireless communication circuit includes: a physical-layer circuit, arranged to operably communicate with other wireless communication devices through an antenna; a micro-controller, arranged to operably generate data frames to be transmitted to other wireless communication devices; and a MAC-layer circuit comprising: a MAC-layer storage circuit for storing a data queue; a MAC-layer control circuit, coupled with the physical-layer circuit, the micro-controller, and the MAC-layer storage circuit, arranged to temporarily store the data frames generated by the micro-controller in the data queue; and a scheduling circuit, coupled with the MAC-layer storage circuit and the MAC-layer control circuit, arranged to operably schedule a timing that the MAC-layer control circuit transmits data stored in the data queue to the physical-layer circuit.

Abstract: A wireless communication circuit includes: a physical-layer circuit, arranged to operably communicate with other wireless communication devices through an antenna; a micro-controller, arranged to operably generate data frames to be transmitted to other wireless communication devices; and a MAC-layer circuit comprising: a MAC-layer storage circuit for storing a data queue; a MAC-layer control circuit, coupled with the physical-layer circuit, the micro-controller, and the MAC-layer storage circuit, arranged to temporarily store the data frames generated by the micro-controller in the data queue; and a scheduling circuit, coupled with the MAC-layer storage circuit and the MAC-layer control circuit, arranged to operably schedule a timing that the MAC-layer control circuit transmits data stored in the data queue to the physical-layer circuit.

Abstract: A method for forming an interconnect of a solid oxide fuel cell includes the following steps. First of all, a powder mixture substantially including equal to or more than 90 wt % chromium powder, with the balance being iron powder and inevitable impurities, is provided. Then the powder mixture is pressurized by a pressing process with a pressure equal to or over 8 mt/cm2 to form a green interconnect with a density being equal to or over 90% of the theoretical density. Next the green interconnect is sintered by a sintering process to form an interconnect body. Finally, a protection process is performed on at least one surface of the interconnect body to form an interconnect.

Abstract: A method for forming an interconnect of a solid oxide fuel cell includes the following steps. First of all, a powder mixture substantially including equal to or more than 90 wt % chromium powder, with the balance being iron powder and inevitable impurities, is provided. Then the powder mixture is pressurized by a pressing process with a pressure equal to or over 8 mt/cm2 to form a green interconnect with a density being equal to or over 90% of the theoretical density. Next the green interconnect is sintered by a sintering process to form an interconnect body. Finally, a protection process is performed on at least one surface of the interconnect body to form an interconnect.

Abstract: A mounting seat for an integrated circuit (IC) and a circuit board includes a base formed by way of powder metallurgy, two pin holes formed on the base, and two positioning pins, which may be respectively formed in the pin holes by way of insert molding or inserted into the pin holes by way of assembling. Thus, a surface of the base may be quickly molded to form the positioning pins or assembled with the positioning pins, which are made of a material different from that of the base. Consequently, the method of manufacturing the mounting seat is simple and timesaving, and the manufacturing cost can be reduced.