Mounting seat for an integrated circuit and a circuit board and method of manufacturing the same
A mounting seat for an integrated circuit (IC) and a circuit board includes a base formed by way of powder metallurgy, two pin holes formed on the base, and two positioning pins, which may be respectively formed in the pin holes by way of insert molding or inserted into the pin holes by way of assembling. Thus, a surface of the base may be quickly molded to form the positioning pins or assembled with the positioning pins, which are made of a material different from that of the base. Consequently, the method of manufacturing the mounting seat is simple and timesaving, and the manufacturing cost can be reduced.
Latest Patents:
1. Field of the Invention
The invention relates in general to a mounting seat for an integrated circuit (IC) and a circuit board, and more particularly to a mounting seat for mounting a digital micromirror device (DMD) made by MEMS technology and a circuit board.
2. Prior Art
A typical mounting seat for an integrated circuit (IC) or a microprocessor is a block-like body, and a surface of the mounting seat is formed with a plurality of terminal holes. The mounting seat is adhered onto a surface of a circuit board, and electrical connection points of the mounting seat are electrically connected to circuits of the circuit board. The IC or microprocessor has protruding terminals, which are inserted into the terminal holes of the mounting seat. Thus, the IC or the microprocessor can be electrically connected to the circuits of the circuit board.
In addition, MEMS devices have been widely used in digital image products such as projectors, digital televisions, and the like. For example, Texas Instruments Incorporated has proposed a digital micromirror device (DMD), which has made using the MEMS technology, in conjunction with the digital light processing (DLP) to constitute the optical architecture of a projector.
The DMD has to be placed on a mounting seat, on which a circuit board to be electrically connected to the DMD is disposed. For example, U.S. Pat. No. 6,894,853 discloses a micromirror device, which is disposed on a surface of a ceramic seat, and a printed circuit board is adhered to the other surface of the ceramic seat. The micromirror device is electrically connected to the circuit board through a plurality of wires. In the '853 patent, the mounting seat is only adhered to the circuit board without any pre-positioning design, so the mounting seat and the circuit board have to be aligned precisely.
As shown in
The positioning pins 12 of the mounting seat 10 and the circuit board 14 are simply positioned. Thus, it is unnecessary to form the positioning pins 12 with the high-precision powder metallurgy method and the cutting or milling processes. In other words, modifying the method of forming the positioning pins and the structure configuration under the condition of the positioning requirement is advantageous to the improvement of the difficulty in manufacturing the mounting seat and the elimination of the drawback of the high cost.
SUMMARY OF THE INVENTIONAccording to the above-described prior art, the base and the positioning pins of the prior art mounting seat are integrally formed by the same material, so the mounting seat cannot be manufactured easily and has a high cost. Therefore, the invention provides a new mounting seat to solve the prior art problems.
An object of the invention is to provide a method of manufacturing a mounting seat for an IC and a circuit board. The method includes the steps of: forming a base by way of powder metallurgy and forming two pin holes on the base; and placing the base in a mold and forming two positioning pins protruding beyond a surface of the base in the pin holes by way of insert molding. The positioning pins may be made of a plastic material or a Bakelite material, so the pins may have smaller outer diameters. Thus, the mounting seat does not need the prior art cutting or milling processes, and thus can be manufactured more easily with the lower manufacturing cost.
Another object of the invention is to provide a method of manufacturing a mounting seat for an IC and a circuit board. The method includes the steps of: forming a base by way of powder metallurgy and forming two pin holes on the base; forming two positioning pins separated from the base by way of injection molding; and assembling the positioning pins with the base by inserting the positioning pins into the pin holes respectively, wherein one end of each of the positioning pins protrudes beyond a surface of the base. The positioning pins may be made of a plastic material or a Bakelite material, so the pins may have smaller outer diameters. Thus, the mounting seat does not need the prior art cutting or milling processes, and thus can be manufactured more easily with the lower manufacturing cost.
Still another object of the invention is to provide a mounting seat for an IC and a circuit board. The mounting seat includes a base, two pin holes formed on the base and at two opposite ends of the base, and two positioning pins each having a first end and a second end. The first ends of the positioning pins are fixed into the two pin holes, respectively, and the second ends of the positioning pins protrude beyond a surface of the base. Thus, the inconvenience of machining the positioning pins can be eliminated, and the manufacturing cost can be greatly reduced.
Other objects, features, and advantages of the invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
As shown in
It is to be noted that the positioning pin 30 is formed in the pin hole 23 by way of insert molding. The positioning pin 30 may be formed of, without limitation to, a plastic material or a Bakelite material.
As shown in
As shown in
As shown in
In step 52, the base having two pin holes is formed by way of powder metallurgy.
In step 54, the base is placed in an injection molding mold, and the positioning pin, which protrudes beyond the surface of the base, is formed in each pin hole by way of insert molding.
After steps 52 and 54 are finished, the mounting seat may be taken out and used.
As shown in
In step 52, the base having two pin holes is formed by way of powder metallurgy.
In step 56, the positioning pins are formed by way of any molding technology (e.g., by way of injection molding technology).
In step 58, the positioning pins are assembled into and adhered to the pin holes of the base. The assembling process may be performed quickly by an automating apparatus.
In the above-mentioned manufacturing methods of the invention, either the method of forming the positioning pin 30 in the pin hole 23 by way of insert molding technology or the method of inserting and assembling the separately formed positioning pins 40 into the pin holes 23 can quickly finish the manufacturing procedures without additional machining procedures. Thus, the manufacturing cost can be effectively reduced.
As shown in
As shown in
Also, an IC (or a MEMS device) 70 is disposed in the accommodating opening 24, a surface of the IC 70 contacts the heat sink 26, which is advantageous to the heat dissipation. Consequently, the structure of the invention enables the IC 70 and the circuit board 60 to be assembled and positioned on the mounting seat 20 easily, and also enhances the heat dissipation efficiency.
While the preferred embodiment of the present invention has been shown and described, it will be apparent to those skilled in the art that various modifications may be made in the embodiment without departing from the spirit of the present invention. Such modifications are all within the scope of the present invention.
Claims
1. A method of manufacturing a mounting seat for an integrated circuit (IC) and a circuit board, the method comprising the steps of:
- forming a base by way of powder metallurgy and forming two pin holes on the base; and
- placing the base in a mold and forming two positioning pins protruding beyond a surface of the base in the pin holes by way of injection molding.
2. The method according to claim 1, wherein the positioning pins are formed by way of insert molding.
3. The method according to claim 1, wherein the positioning pins are made of a plastic material or a Bakelite material.
4. A method of manufacturing a mounting seat for an integrated circuit (IC) and a circuit board, the method comprising the steps of:
- forming a base by way of powder metallurgy and forming two pin holes on the base;
- forming two positioning pins separated from the base by way of injection molding; and
- assembling the positioning pins with the base by inserting the positioning pins into the pin holes respectively, wherein one end of each of the positioning pins protrudes beyond a surface of the base.
5. The method according to claim 4, wherein the positioning pins are made of a plastic material or a Bakelite material.
6. A mounting seat for an integrated circuit (IC) and a circuit board, the mounting seat comprising:
- a base;
- two pin holes formed on the base and at two opposite ends of the base; and
- two positioning pins each having a first end and a second end, wherein the first ends of the positioning pins are fixed into the two pin holes, respectively, and the second ends of the positioning pins protrude beyond a surface of the base.
7. The mounting seat according to claim 6, wherein the pin holes penetrate through the mounting seat.
8. The mounting seat according to claim 6, wherein the second end of the positioning pin is formed with a guiding slant at a circumference of the positioning pin.
9. The mounting seat according to claim 6, wherein the positioning pin is adhered to the pin hole.
10. The mounting seat according to claim 6, wherein the positioning pin is fixed into the pin hole by way of insert molding.
11. The mounting seat according to claim 6, wherein the surface of the base is formed with an accommodating opening for accommodating the IC.
12. The mounting seat according to claim 6, wherein a protruding heat sink is disposed on the surface of the base.
13. The mounting seat according to claim 6, wherein the surface of the base is formed with an accommodating opening and a heat sink is disposed on the surface of the base, and the heat sink crosses over two sides of the accommodating opening and protrudes beyond the surface of the base.
Type: Application
Filed: Sep 29, 2006
Publication Date: Jul 5, 2007
Applicant:
Inventors: Huei-Long Lee (Miaoli), Shun-Fa Chen (Miaoli), Simon D. Shong (Miaoli), T. L. Yeh (Miaoli), C. L. Chu (Miaoli)
Application Number: 11/540,395
International Classification: A47C 1/10 (20060101);