Abstract: A semiconductor device module includes a device mounted on the surface of an organic substrate; a heat dissipation block bonded and fixed to the surfaces of the device; and a molded resin sealing the device with at least one surface of the heat dissipation block being exposed. The heat dissipation block includes a first portion and a second portion made of materials different in hardness: the first portion is harder than the second portion, and a gradient in hardness from the first portion on the side exposed from the molded resin to the second portion on the side bonded to the device, to keep a good grinding performance of grinding wheel.

Abstract: To provide a semiconductor device having improved reliability. A method of manufacturing a semiconductor device according to one embodiment includes a step of cutting, in a dicing region arranged between two chip regions adjacent to each other, a wafer along an extending direction of the dicing region. The dicing region has therein a plurality of metal patterns in a plurality of columns. In the step of cutting the wafer, one or more of the columns of metal patterns formed in a plurality of columns are removed, and the metal patterns of the column(s) different from the above-mentioned one or more of the columns are not removed.

Abstract: To provide a semiconductor device having improved reliability. A method of manufacturing a semiconductor device according to one embodiment includes a step of cutting, in a dicing region arranged between two chip regions adjacent to each other, a wafer along an extending direction of the dicing region. The dicing region has therein a plurality of metal patterns in a plurality of columns. In the step of cutting the wafer, one or more of the columns of metal patterns formed in a plurality of columns are removed, and the metal patterns of the column(s) different from the above-mentioned one or more of the columns are not removed.

Abstract: A disclosed fixing device applying a bubble-like fixing liquid to resin-containing particles adhered to a medium so that the resin-containing particles are fixed to the medium, the bubble-like fixing liquid being formed by transforming a fixing liquid into foam that dissolves or swells at least a part of the resin, includes a control device that, based on a difference between a moisture content included in the medium after fixing and a target value of the moisture content, adjusts an application amount of the fixing liquid for a next medium.

Abstract: A fixing device includes a foam fixer generator unit generating a foam fixer containing a softener softening toner by dissolving or swelling part of resin of the toner, an application roller carrying and transferring the foam fixer onto a recording sheet, a pressure roller applying pressure to a toner image on the recording sheet via the foam fixer on the application roller to fix the toner image on the recording sheet, a cleaning device removing residual components remaining on the application roller, a recording sheet detector unit detecting presence or absence of the recording sheet, a remover unit being in contact with and separated from the application roller to remove the foam fixer on the application roller, and a control unit controlling the contact-separation operation of the remover unit based on a detected result of a front end and/or a rear end of the recording sheet.

Abstract: A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.

Abstract: A fixing device for applying a foam fixing agent to particles including resin resting on a medium to fix the particles including resin onto the medium. The foam fixing agent includes a softener for softening the particles including resin by dissolving or swelling at least part of the resin. The fixing device includes a first foam fixing agent generating unit that generates a first foam fixing agent from a fixing agent; a second foam fixing agent generating unit that generates a second foam fixing agent from the fixing agent, the second foam fixing agent having a lower density than the first foam fixing agent; and a foam application member on which a first film formed with the first foam fixing agent and a second film formed with the second foam fixing agent are formed.

Abstract: A disclosed cleaning device for removing adhering matter from a surface of a member subject to cleaning includes a belt-shaped film member arranged in a stretched configuration capable of being wound or endlessly move in a direction opposite to a surface movement direction of the member subject to cleaning while being in contact with the surface of the member subject to cleaning, and a cleaning blade configured to abut on the surface of the member subject to cleaning via the belt-shaped film member at a position where the belt-shaped film member is brought into contact with the member subject to cleaning.

Abstract: A disclosed fixing device applying a bubble-like fixing liquid to resin-containing particles adhered to a medium so that the resin-containing particles are fixed to the medium, the bubble-like fixing liquid being formed by transforming a fixing liquid into foam that dissolves or swells at least a part of the resin, includes a control device that, based on a difference between a moisture content included in the medium after fixing and a target value of the moisture content, adjusts an application amount of the fixing liquid for a next medium.

Abstract: A fixing device includes a foam fixer generator unit generating a foam fixer containing a softener softening toner by dissolving or swelling part of resin of the toner, an application roller carrying and transferring the foam fixer onto a recording sheet, a pressure roller applying pressure to a toner image on the recording sheet via the foam fixer on the application roller to fix the toner image on the recording sheet, a cleaning device removing residual components remaining on the application roller, a recording sheet detector unit detecting presence or absence of the recording sheet, a remover unit being in contact with and separated from the application roller to remove the foam fixer on the application roller, and a control unit controlling the contact-separation operation of the remover unit based on a detected result of a front end and/or a rear end of the recording sheet.

Abstract: A disclosed fixing device for fixing resin particles softened by applying a foam fixer thereon to a recording medium includes a foam fixer generator unit to introduce air bubbles into a liquid fixer containing a softener for softening the resin particles by dissolving or swelling a part of the resin particles to generate the foam fixer, a fixer application member to be brought into contact with a facing member facing the fixer application member to form an application nip and transfer the generated foam fixer to the application nip by moving its surface while carrying the foam fixer to apply the foam fixer to a surface of the recording medium carrying the resin particles at the application nip, and a foam accumulation detector unit to detect a foam accumulation formed of the foam fixer accumulated at an entrance side of the application nip.

Abstract: A disclosed cleaning device for removing adhering matter from a surface of a member subject to cleaning includes a belt-shaped film member arranged in a stretched configuration capable of being wound or endlessly move in a direction opposite to a surface movement direction of the member subject to cleaning while being in contact with the surface of the member subject to cleaning, and a cleaning blade configured to abut on the surface of the member subject to cleaning via the belt-shaped film member at a position where the belt-shaped film member is brought into contact with the member subject to cleaning.

Abstract: A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.

Abstract: In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.

Abstract: A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed to overlap in the range of height with the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, a wire connects the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wire. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

Abstract: The reliability and production yield of a solid state image sensing device is improved. Over a surface of a wiring substrate, a sensor chip and a lens-barrel having the sensor chip housed therein are mounted. To the lens-barrel, a lens holder for retaining a lens is connected. Over a back surface of the wiring substrate, a logic chip, a memory chip and a passive part are mounted, and they are sealed with a sealing resin. The lens-barrel and lens holder are each threaded. They are thermally welded while the threads are fitted to each other. The passive part is bonded to the wiring substrate via a Sn—Ag type Pb-free solder. After the wiring substrate is subjected to plasma washing treatment, the sensor chip is mounted over the wiring substrate and an electrode pad of the sensor chip and an electrode of the wiring substrate are electrically connected via a bonding wire.

Abstract: In a lead frame used in a molded package of a semiconductor device, leads disposed entirely including an island portion, which is a portion for mounting a semiconductor chip, are formed. In the manufacture of a semiconductor device, after mounting the semiconductor chip and performing wire bonding and resin sealing, the leads are adequately cut corresponding to the number of electrodes of the semiconductor chip to divide the leads into a plurality of portions.

Abstract: A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.

Abstract: A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed to overlap in the range of height with the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, a wire connects the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wire. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

Abstract: In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.