Abstract: In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.

Abstract: A semiconductor device and a manufacturing method for downsizing and densification achieved by reducing the thickness of the semiconductor device without an increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed overlapping in height the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, wires connect the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wires. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

Abstract: A paint for forming a heat absorbing film which exhibits a good binding property for binding with a conductive reflecting film, contains a black pigment, and a compound represented by Si(OR1)nR2m, where n+m=4, n=1 to 4, m=0 to 3, each of R1 and R2 is one of an alkyl group, an alkenyl group and an aryl group, or a hydrolyzate of the compound. Also, the present invention relates to a heat absorbing film formed out of this heat absorbing film paint and a color CRT provided with this heat absorbing film.

Abstract: A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.

Abstract: A semiconductor chip mounting substrate provided with an adhesive layer is placed on a first supporting device included in a chip bonding unit. A collet holds a semiconductor chip, carries the same to the semiconductor chip mounting substrate placed on the first supporting device and presses the same against the semiconductor chip mounting substrate to bond the semiconductor chip temporarily to the semiconductor chip mounting substrate. The semiconductor chip mounting substrate to which the semiconductor chip is bonded temporarily is placed on a second supporting device included in a chip pressing unit. A pressing device applies pressure to the semiconductor chip to straighten the warped semiconductor chip and to bond the same entirely to the semiconductor chip mounting substrate.

Abstract: The semiconductor device is manufactured as follows. That is, after the die pad section, on which the semiconductor chip is mounted, the inner lead section and at least a part of the outer lead section are arranged in the cavity of the metal mold on the lead frame. Moreover, the sealing resin is filled into the cavity of the metal mold and hardened therein. Moreover, the sealing resin located on a surface layer region of the outer lead section of the lead frame removed.

Abstract: In a semiconductor device fabricating method, a plurality of wafers each having a plurality of chips into is carried and is placed in a die bonder. Chips taken out from the plurality of wafers is bonded together, respectively, and superpose in a stack by bonding layers to form a chip assembly. The chip assembly to a die pad by a bonding layer is bonded. Thus, the die bonder is able to bond the chip assembly consisting of the plurality of chips to the die pad, so that the process time of a die bonding process for bonding the plurality of chips to the die pad is comparatively short, the semiconductor fabricating apparatus produces semiconductor devices at an improved productivity, has a comparatively small scale and needs a comparatively low equipment investment.

Abstract: Disclosed is an infusion preparation for nutrient supply use. It comprises a sugar, amino acids, electrolytes and a fat emulsion. It has an excellent shelf life without causing precipitation, denaturation and the like in spite of the simultaneous presence of these components. Also disclosed is a container filled with infusion liquids comprising a first and a second compartment separated from each other by a separation means, wherein an infusion liquid containing a fat emulsion and a sugar is included in the first compartment and another infusion liquid containing amino acids and electrolytes is included in the second compartment. Further disclosed are an infusion preparation comprising a fat emulsion and a sugar, and an infusion preparation comprising amino acids and electrolytes.

Abstract: A semiconductor device and a manufacturing method thereof are provided with downsizing and densification achieved by reducing the thickness of the semiconductor device without increase in area. Terminal electrodes are arranged, in plan view, outside a region where semiconductor chips are arranged. A lower semiconductor chip is placed to overlap in the range of height with the terminal electrodes, an upper semiconductor chip is placed above the lower semiconductor chip, a wire connects the upper and lower semiconductor chips to the terminal electrodes, and an encapsulating resin encapsulates the upper and lower semiconductor chips and wire. The encapsulating resin has its bottom surface coplanar with the bottom surface of the terminal electrodes.

Abstract: In a duplex image transferring device of the present invention, a first bicolor toner image formed by a developing liquid is transferred to one side of a sheet. This toner image on the sheet includes a carrier liquid layer containing a liquid carrier of an amount not great enough to serve as an electrophoresis medium for a toner layer deposited on the sheet, but sufficient to serve as a parting agent for the toner layer and an intermediate image transfer belt contacting the toner image. Subsequently, a bicolor toner image of the same polarity as the toner layer is transferred to the other side of the sheet. It is possible to transfer the toner images to both sides of the sheet without switching back the one-sided sheet, without using two kinds of toner each being chargeable to particular polarity or without charging one toner image to the opposite polarity with a corona charger.

Abstract: An image processing system comprises a first input unit for inputting an image signal, a second input unit for inputting a character or code signal, a binarizing unit for binarizing the image signal, including a unit for gray level processing the image signal, a discrimination unit for discriminating the presence or absence of a gray level in the image signal, and an output unit for outputting the image signal when the discrimination unit discriminates the absence of the gray level or the character or code signal as a digital image signal without processing the signal by the gray level processing unit.

Abstract: This invention relates to a stable vitamin C preparation and a method for stabilizing vitamin C preparation. According to the invention, the vitamin C preparation stable for a long period of time can be obtain, since the preparation contains magnesium ions which have the effect of stabilizing vitamin C.

Abstract: The present invention aims at providing an alimentative infusion liquid which has improved stability and preservability and can be administered through a peripheral vein. The infusion liquid contains sugars, amino acids, electrolytes and a fat emulsion at a specific mixing ratio and has a specific pH value and a titratable acidity. The alimentative infusion liquid of the present invention containing the above-described components has good preservability without suffering from precipitation, denaturation and the like problems. Further, since the pH value is adjusted to a specific level and the titratable acidity is retained low, administration of the infusion liquid through a peripheral vein does not cause troubles such as angialiga.

Abstract: Disclosed is an infusion preparation for nutrient supply use. It comprises a sugar, amino acids, electrolytes and a fat emulsion. It has an excellent shelf life without causing precipitation, denaturation and the like in spite of the simultaneous presence of these components. Also disclosed is a container filled with infusion liquids comprising a first and a second compartments separated from each other by a separation means, wherein an infusion liquid containing a fat emulsion and a sugar is included in the first compartment and another infusion liquid containing amino acids and electrolytes is included in the second compartment. Further disclosed are an infusion preparation comprising a fat emulsion and a sugar, and an infusion preparation comprising amino acids and electrolytes.

Abstract: A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer frame section, a die pad displaced from the outer frame section, and a suspending lead connecting the die pad to the outer frame section with the die pad disposed inside the outer frame section; and a frame for leads including an outer frame portion and leads extending from opposite sides of the outer frame portion, connected to the frame for a die pad, the die pad being connected to the frame for leads at the suspending lead, wherein one of the frame for a die pad and the frame for leads includes a projection and the other of the frame for a die pad and the frame for leads includes a hole, the hole receiving the projection, the projection being disposed parallel to the frame for leads, connecting the frame for a die pad to the frame for leads.

Abstract: A color image forming apparatus separately corrects an intensity of each of color component images used for forming a multicolor image. The multicolor image is formed by superimposing a plurality of color component images on a printing paper. Each of the color component images is formed by one of color toners. Color patterns having a gradation are printed by using each of the color toners. A color sensor is provided at a position in which each of the color patterns is read, the color sensor being sensitive to a color of each of the color toners. The color sensor outputs output signals corresponding to each of the color patterns. The intensity of each of the color component images is corrected in accordance with the corresponding output signals of the color sensor. A mixture of colors in each of the color component images is detected, and the intensity of the corresponding color component image is corrected so as to maintain a desired color balance.

Abstract: A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.

Abstract: A container filled with infusion liquids useful for preparation of an infusion liquid containing sugars, amino acids, electrolytes, a fat emulsion and vitamins. A container having two compartments which are separated from each other by a separation means, which contains an infusion liquid comprising a fat emulsion, sugars and specific vitamins in the first compartment and an infusion liquid comprising amino acids, electrolytes and other specific vitamins in the second compartment. An infusion preparation containing sugars, amino acids, electrolytes, a fat emulsion and vitamins can be obtained easily and aseptically upon use, by simply removing a separation means and mixing the infusion liquids included in the first and second compartments.

Abstract: A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.

Abstract: Disclosed is an infusion preparation for nutrient supply use. It comprises a sugar, amino acids, electrolytes and a fat emulsion. It has an excellent shelf life without causing precipitation, denaturation and the like in spite of the simultaneous presence of these components. Also disclosed is a container filled with infusion liquids comprising a first and a second compartments separated from each other by a separation means, wherein an infusion liquid containing a fat emulsion and a sugar is included in the first compartment and another infusion liquid containing amino acids and electrolytes is included in the second compartment. Further disclosed are an infusion preparation comprising a fat emulsion and a sugar, and an infusion preparation comprising amino acids and electrolytes.