Abstract: Provided is a method for improving the corrosion resistance of a gold finger, which is applicable to an electro-optical circuit board including gold fingers, wherein a guide line is arranged at a root portion of the gold fingers of the electro-optical circuit board. The method comprises the following steps in sequence: 1) electrical connection: using an outer lead to electrically connect all gold fingers of a electro-optical circuit board; 2) solder resistance: performing solder resistance on an area other than the outer lead; 3) gold plating on the gold fingers; 4) etching of the outer lead; and 5) solder resistance: performing solder resistance on a vacancy after etching of the lead. In the method, an outer lead is arranged to electrically connect all gold fingers of a electro-optical circuit board, so that all sides of the gold fingers are plated with gold, thereby significantly improving the corrosion resistance of the gold fingers.

Abstract: Provided is a method for improving the corrosion resistance of a gold finger, which is applicable to a photovoltaic panel (1) including gold fingers (2), wherein a guide line (3) is arranged at a root portion of the gold fingers (2) of the photovoltaic panel (1). The method comprises the following steps in sequence: 1) electrical connection: using an outer lead (4) to electrically connect all gold fingers (2) of a photovoltaic panel (1); 2) solder resistance: performing solder resistance on an area other than the outer lead (4); 3) gold plating on the gold fingers (2); 4) etching of the outer lead (4); and 5) solder resistance: performing solder resistance on a vacancy after etching of the lead (4). In the method, an outer lead (4) is arranged to electrically connect all gold fingers (2) of a photovoltaic panel (1), so that all sides of the gold fingers (2) are plated with gold, thereby significantly improving the corrosion resistance of the gold fingers (2).