Patents by Inventor Shuzo Taguchi

Shuzo Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing tape
    Patent number: 9324592
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: April 26, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • WAFER PROCESSING TAPE
    Publication number: 20100227165
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Application
    Filed: July 16, 2008
    Publication date: September 9, 2010
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Semiconductor wafer processing tape
    Patent number: D621803
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: August 17, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata
  • Semiconductor wafer processing tape
    Patent number: D628170
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: November 30, 2010
    Assignee: The Furukawa Electric Company
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata