Abstract: The invention provides a bonding structure with compliant bumps, and also includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer is lower then the stopper structure and compliant bumps. It can be separated or connected with stoppers.

Abstract: A method for forming electrically conductive bumps on a semiconductor substrate, or a semiconductor wafer and devices formed by the method are disclosed. In the method, a wafer that has an active surface, a plurality of conductive elements formed on the active surface and a passivation layer insulating the plurality of conductive bumps from each other is first provided. A first metal layer is then sputter deposited on top of the plurality of conductive elements and the passivation layer, followed by stencil printing a plurality of bumps of an insulating material on top of each one of the plurality of conductive elements. The plurality of bumps may be heat treated to a temperature of at least 100° C. for a period of at least 10 minutes for stress relief. A second metal layer is then sputter deposited on top of the plurality of bumps and the first metal layer.

Abstract: An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

Abstract: A method for bonding an IC chip by a non-conductive adhesive that contains between about 5 weight % and about 25 weight % of a non-conductive filler is described. The filler particles in the filler material must have a hardness that is higher, and preferably at least two times higher, than the metal material forming the bump. Moreover, the filler particles must be non-electrically conductive such that electrical shorts between a plurality of bumps on the IC chip do not occur. The concentration of the filler in the adhesive must be high enough so as to reduce the CTE of the adhesive to match that of the IC chip and the substrate, and low enough so as not to impede the electrical communication between the bumps on the IC chip and the bond pads on the substrate.

Abstract: A method for bonding an IC chip formed with corrugated, multi-layered bumps to conductive elements on a substrate and devices formed by such method are disclosed. In the method, multi-layered bumps are formed by a cover layer of a conductive metal deposited on a base layer of a compliant material. The exposed bonding surface of the bump is formed in a corrugated fashion, or in a serrated shape with saw-tooth configurations. The saw-tooth configurations may either be rectangular or triangular. In the bonding method, instead of using an anisotropic conductive film loaded with conductive particles, a solid adhesive film without conductive particles or a liquid adhesive material without conductive particles can be utilized. The serrated bonding surface of the bumps is effective in expelling the adhesive material from the bonding interface between the bumps and the conductive elements such that a low resistance bond can be formed between an IC chip and a substrate.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus and a conductive metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little tendency to separate the connections after the bonded structure is formed. The bond can be formed using thermocompression bonding, ultrasonic bonding, application of heat or application of light. The bond can also be formed using a non conductive adhesive between the integrated circuit element and the substrate. The bond can also be formed with a conductive adhesive coating on the composite bump.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus and a conductive metal coating. The bond can be formed using thermocompression bonding, ultrasonic bonding, application of heat or application of light. The bond can also be formed using a non conductive adhesive between the integrated circuit element and the substrate. The bond can also be formed with a conductive adhesive coating on the composite bump.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.

Abstract: A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.

Abstract: This invention provides a connection structure and methods of forming the connection structure which combines the advantages of composite bumps and conductive films formed of conductive particles in a non-conductive binder. The conductive film provides conductive particles in a non-conductive binder which can be placed on the input/output pads of an integrated circuit element or substrate. The conductive particles contact composite bumps comprised of a polymer body, having a relatively low Young's Modulus, and a conductive metal coating to form the connection structure. The relatively low Young's Modulus of the composite bumps greatly reduce the recoil forces during bonding. Because of the low recoil forces the connection can be formed with reduced bonding force and forces tending to separate the connection once formed are reduced. The non-conductive binder is cured to form the adhesive between the integrated circuit element and the substrate.

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing.

Abstract: An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.