Patents by Inventor Shyh-Ming Chen

Shyh-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100044009
    Abstract: An annular heat dissipating device, comprises an annular body; a periphery of the annular body being formed with a plurality of trenches and recesses; which are alternatively arranged. an inner middle area of the annular body having a seat plate for installing at least one heat source; a plurality of heat dissipated fins being arranged in the recesses which are annularly arranged around an outer periphery of the annular body; each fin being inserted into the recess. In assembly by punching, a shaping mold punches a trench between two fins so that two lateral wall of the trench will be pressed and deform; and then the fin in the recess tightly adheres to the outer periphery of the annular body.
    Type: Application
    Filed: August 20, 2008
    Publication date: February 25, 2010
    Inventor: Shyh-Ming Chen
  • Patent number: 7600558
    Abstract: A cooler comprises a base, a set of radiator fins and a plurality of heat pipes going through the base and the radiator fins. The lower surface of the base is further provided with a recess wherein part of the heat pipes is exposed, whereby a heat-generating element will be embedded with in the recess, and whereby the heat generated in the element will be conducted quickly through the heat pipes to the radiator fins. Therefore, the heat-dissipation efficiency is enhanced.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: October 13, 2009
    Inventor: Shyh-Ming Chen
  • Publication number: 20090129092
    Abstract: A heat convection dissipater for an LED lamp, comprises a convection heat dissipating device for an LED lamp, a light emitting diode module having a plurality of light emitting diodes; a heat dissipating unit behind the light emitting diode module for dissipating heat from the light emitting diode module set; a housing having a plurality of air holes at a lateral side thereof; the housing being engaged to the heat dissipating unit so as to form an internal space; and a blade wheel combined to the housing. Heat from the light emitting diodes is transferred to the internal space through the heat dissipating unit; external air is guided into the internal space through the air holes so as to drive air originally in the internal space flows toward the blade wheel to push the blade wheel to rotate so as to circulate the air in the internal space.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 21, 2009
    Inventor: Shyh-Ming Chen
  • Publication number: 20080202726
    Abstract: A fastening structure of a heat conducting pipe and a plurality of fins is provided in a cooler containing a plurality of fins. Each of the surfaces of the fins includes at least a through hole and a through slot connecting to the through hole. The heat conducting pipe penetrates through the through holes of the fins. The drifts located at the end portion of the mold pressing piece are allowed to pass through the through slots to stamp the connection positions on surface of the heat conducting pipe for shaping the indentation portions. The indentation portions compress the heat conducting pipe to be combined tightly with the through holes so that the fins and the heat conducting pipe are combined tightly for strengthening the combination of the fins and the heat conducting pipe effectively, and preventing the heat conducting pipe from being damaged so as to raise the quality and heat conductivity of the products.
    Type: Application
    Filed: February 23, 2007
    Publication date: August 28, 2008
    Inventor: Shyh-Ming Chen
  • Patent number: 7387155
    Abstract: A colored heat dissipating device comprises at least one heat conductive tube; a plurality of fins combined with the heat dissipating device; each fin being formed with a colored protection film by anodizing processing. Furthermore, a colored heat dissipating device comprises at least one seat; a plurality of fins combined with the seat; each fin being formed with a colored protection film by anodizing processing. Moreover the protection films of all the fins have the same color, the fins are combined with the heat conductive tube by punching. Or the protection films of fins are divided into several sets, the sets have different colors, the fins are combined with the heat conductive tube by punching. Thus the heat dissipating devices is anti-oxidized, erode-proof and dirt-proof. Thereby the indication on the protection film can be used to indicate the specifications of electronic devices suitable to be used therewith.
    Type: Grant
    Filed: November 15, 2005
    Date of Patent: June 17, 2008
    Inventor: Shyh Ming Chen
  • Publication number: 20080068803
    Abstract: In a heat dissipating device holder structure with a thin film thermal conducting medium coating, at least two thermal conducting medium coating blocks are set on attaching surfaces of a heat dissipating device holder and a processor, and a gap is disposed between the coating blocks, such that when the heat dissipating device holder is attached to the processor, the compressing force of the heat dissipating device holder and the processor exerted onto the thermal conducting medium coating blocks can be spread to fill the spread thermal conducting medium into a short distance of the gap, so as to achieve the best thin film coating for the thermal conducting medium and effectively lower thermal resistance and attach the heat dissipating apparatus holder tightly with the processor for the best heat dissipation effect.
    Type: Application
    Filed: September 18, 2006
    Publication date: March 20, 2008
    Inventor: Shyh-Ming Chen
  • Publication number: 20080055857
    Abstract: A method for connecting heat pipes and a heat sink comprises the steps of drilling a set of through holes through a heat dissipating base slab, implanting heat pipes through the through holes, integrating the heat-dissipating base slab with the heat pipes by punching using a press machine, and bending and twisting the heat pipes according to a predetermined angle and shape, whereby a set of radiation fins will be connected. The heat radiating device thereby produced is used on electronic elements.
    Type: Application
    Filed: September 5, 2006
    Publication date: March 6, 2008
    Inventors: Shyh-Ming Chen, Chiou-Tziy Chin
  • Publication number: 20080047693
    Abstract: A cooler comprises a base, a set of radiator fins and a plurality of heat pipes going through the base and the radiator fins. The lower surface of the base is further provided with a recess wherein part of the heat pipes is exposed, whereby a heat-generating element will be embedded with in the recess, and whereby the heat generated in the element will be conducted quickly through the heat pipes to the radiator fins. Therefore, the heat-dissipation efficiency is enhanced.
    Type: Application
    Filed: August 22, 2006
    Publication date: February 28, 2008
    Inventor: Shyh-Ming Chen
  • Publication number: 20080028610
    Abstract: A method for assembling a vertical heat radiator comprises the steps of assembling heat-radiator fins in which a multitude of radiator fins, each having upper and lower holes or retaining notches, are combined with fixed spacing by lateral locking pieces, connecting heat pipes in which a set of heat pipes are put to go through the upper and lower holes or retaining notches and integrating components by punching in which the modules of heat-radiator fins and the heat pipes are integrated by an external punching tool.
    Type: Application
    Filed: July 26, 2006
    Publication date: February 7, 2008
    Inventor: Shyh-Ming Chen
  • Publication number: 20060260128
    Abstract: A method for riveting fins into a bottom plate of a heat dissipating device is disclosed. A punching device has a plurality of weights each of which is formed as a thin sheet. The punching device is installed to a fixture; a plurality of fins are spaced with a predetermined gap; and a bottom plate is formed with a plurality of trenches for receiving the fins. The method comprising the step of: positioning the bottom plate at the fixture; inserting the fins into the trenches of the bottom plate; inserting the weights of the punching device into the fins so that each space between two fins has a weight; and punching a backside of the bottom plate by a puncher so that as the bottom plate moves; the weights collides portions of the bottom plate between the fins to deform and rivet the fins into the bottom plate; and thus the fins are firmly secured in the bottom plate.
    Type: Application
    Filed: April 19, 2006
    Publication date: November 23, 2006
    Inventor: Shyh-Ming Chen
  • Patent number: 7120026
    Abstract: A heat-dissipating device with heat conductive tubes comprises a heat-dissipating unit having plurality of fins; each fin having a plurality of through holes; each through hole having a corresponding via hole near the through hole; a plurality of annular walls being arranged around each through hole; and a plurality of heat conductive tubes passing through respective through holes of the fins. In manufacturing, the plurality of heat conductive tubes and the heat-dissipating unit with press bars are positioned to a fixture; a shaping mold serves to punch the press bars so that the press bar to press the side walls and thus the fins are tightly riveted to the heat conductive tubes.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: October 10, 2006
    Inventor: Shyh-Ming Chen
  • Patent number: 7077188
    Abstract: A heat dissipating device with heat conductive tubes comprises a heat dissipating unit including a plurality of fins; a bottom edge of each fin having a plurality of concave portions; a seat; a surface of the seat having a plurality of protruding surfaces; a top of the seat having a plurality of trenches; each trench being parallel to at least one protruding surface; a plurality of recesses being vertically passing through the plurality of trenches; the concave portions being formed corresponding to the trenches; the fins are inserted into the recesses and the concave portions cover upon the trenches; a plurality of heat conductive tubes; one end of each heat conductive tube being installed between one respective trench and respective concave portions of the plurality of concave portions so that the heat conductive tubes are positioned in the seat. A method for forming the unit is included.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: July 18, 2006
    Inventor: Shyh-Ming Chen
  • Publication number: 20060070721
    Abstract: A heat dissipating device with heat conductive tubes comprises a heat dissipating unit including a plurality of fins; a bottom edge of each fin having a plurality of concave portions; a seat; a surface of the seat having a plurality of protruding surfaces; a top of the seat having a plurality of trenches; each trench being parallel to at least one protruding surface; a plurality of recesses being vertically passing through the plurality of trenches; the concave portions being formed corresponding to the trenches; the fins are inserted into the recesses and the concave portions cover upon the trenches; a plurality of heat conductive tubes; one end of each heat conductive tube being installed between one respective trench and respective concave portions of the plurality of concave portions so that the heat conductive tubes are positioned in the seat. A method for forming the unit is included.
    Type: Application
    Filed: September 27, 2004
    Publication date: April 6, 2006
    Inventor: Shyh-Ming Chen
  • Publication number: 20060072290
    Abstract: A heat-dissipating device with heat conductive tubes comprises a heat-dissipating unit having plurality of fins; each fin having a plurality of through holes; each through hole having a corresponding via hole near the through hole; a plurality of annular walls being arranged around each through hole; and a plurality of heat conductive tubes passing through respective through holes of the fins. In manufacturing, the plurality of heat conductive tubes and the heat-dissipating unit with press bars are positioned to a fixture; a shaping mold serves to punch the press bars so that the press bar to press the side walls and thus the fins are tightly riveted to the heat conductive tubes.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 6, 2006
    Inventor: Shyh-Ming Chen
  • Patent number: 6754078
    Abstract: A heat dissipating device comprises a bottom plate and plurality of heat dissipating sheets. A surface of the bottom plate is formed with a plurality of inclined recesses which are spaced with an equal space. Each inclined recess is inclined to a surface of the bottom plate and has two parallel sides, and every two adjacent recesses are spaced by a respective protruding rib. One end of each heat dissipating sheet has an inclined extending portion which has two parallel sides and is inclined to other portion of the heat dissipating sheet. The extending portions are inserted into the recesses of the bottom plate. By above structure, the heat dissipating sheets are inserted into the recesses of the bottom plate.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: June 22, 2004
    Inventor: Shyh-Ming Chen