Patents by Inventor Shyh-Wei Cheng

Shyh-Wei Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130068023
    Abstract: A Micro-Electro-Mechanical System (MEMS) device includes a sensing element, and a proof mass over and overlapping at least a portion of the sensing element. The proof mass is configured to be movable toward the sensing element. A protection region is formed between the sensing element and the proof mass. The protection region overlaps a first portion of the sensing element, and does not overlap a second portion of the sensing element, wherein the first and the second portions overlap the proof mass.
    Type: Application
    Filed: January 18, 2012
    Publication date: March 21, 2013
    Applicant: Taiwan Semiconductor Manufaturing Company, Ltd.
    Inventors: Shyh-Wei Cheng, Yu-Ting Hsu, Hsi-Cheng Hsu, Chih-Yu Wang, Jui-Chun Weng, Che-Jung Chu
  • Publication number: 20110084391
    Abstract: An integrated circuit structure includes a semiconductor substrate; a first titanium layer over the semiconductor substrate, wherein the first titanium layer has a first thickness less than 130 ?; a first titanium nitride layer over and contacting the first titanium layer; and an aluminum-containing layer over and contacting the first titanium nitride layer.
    Type: Application
    Filed: July 23, 2010
    Publication date: April 14, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shyh-Wei Cheng, Pin-Shyne Chin, Kuo-Chio Liu, Che-Jung Chu, Ming-Chang Hsieh, Hung-Lin Chen, Tian Sheng Lin