Abstract: Methods of fabricating a device having laterally patterned first and second sub-devices, such as subpixels of an OLED, are provided. Exemplary methods may include depositing via organic vapor jet printing (OVJP) a first organic layer of the first sub-device and a first organic layer of the second sub-device. The first organic layer of the first sub-device and the first organic layer of the second sub-device are both the same type of layer, but have different thicknesses. The type of layer is selected from an ETL, an HTL, an HIL, a spacer and a capping layer.

Abstract: Methods of fabricating a device having laterally patterned first and second sub-devices, such as subpixels of an OLED, are provided. Exemplary methods may include depositing via organic vapor jet printing (OVJP) a first organic layer of the first sub-device and a first organic layer of the second sub-device. The first organic layer of the first sub-device and the first organic layer of the second sub-device are both the same type of layer, but have different thicknesses. The type of layer is selected from an ETL, an HTL, an HIL, a spacer and a capping layer.

Abstract: Optical components and devices are provided that include a substrate, a microlens array, and a barrier film system conformally covering the microlens array. An OLED may be optically coupled to the microlens array. The barrier film may provide protection to the microlens array or other components, without having a significant negative impact on outcoupling of light from the coupled OLED by the microlens array.

Abstract: Systems and methods are provided for depositing thin patterned films of materials in which individual elements of the patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on a substrate in a plurality of laterally spaced elements.

Abstract: Embodiments disclosed herein provide devices having a nozzle die with one or more nozzles, each of which has one or more integrated skimmers. The use of an integrated nozzle/skimmer structure allows for higher-resolution printing in OVJP-type deposition techniques without requiring the use of a shadow mask by allowing for a relatively narrow organic material beam that can be placed at relatively high distances away from the substrate.

Abstract: An emissive layer deposited in graded manner using a plurality of nozzles is disclosed. A mixtures ejected from the plurality of nozzles may contain varying concentrations of host-to-dopant material. The nozzles, as disclosed, may be arranged in a sequential manner such that the order of the sequence is based on varying concentration of the host-to-dopant material. The nozzles may be configured to translate relative to an area of a substrate to allow sequential deposition.

Abstract: Systems and methods are provided in which individual elements of a thin patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on the substrate in a plurality of laterally spaced elements, each of the elements deposited by a separate nozzle group. At least one of the nozzles in a group of nozzles depositing an element may be configured to deposit the material on the substrate in a width that is smaller than the width of the element.

Abstract: Methods of fabricating a device having laterally patterned first and second sub-devices, such as subpixels of an OLED, are provided. Exemplary methods may include depositing via organic vapor jet printing (OVJP) a first organic layer of the first sub-device and a first organic layer of the second sub-device. The first organic layer of the first sub-device and the first organic layer of the second sub-device are both the same type of layer, but have different thicknesses. The type of layer is selected from an ETL, an HTL, an HIL, a spacer and a capping layer.

Abstract: Systems and methods are provided in which individual elements of a thin patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on the substrate in a plurality of laterally spaced elements, each of the elements deposited by a separate nozzle group. At least one of the nozzles in a group of nozzles depositing an element may be configured to deposit the material on the substrate in a width that is smaller than the width of the element.

Abstract: Embodiments of the present invention provide electronic devices such as OLEDs that have enhanced mechanical integrity and prolonged shelf, by minimizing the spread of a delamination region using topographical non-uniformities introduced in the device structure. For example, a device may be made deliberately non-planar by introducing multiple energy barriers which can prevent or minimize the propagation of a delamination, because the delamination will have to cross the energy barriers in order to spread to a larger area.

Abstract: Nozzle designs which have been found to be effective in governing overspray in OVJP are provided. Aspects of the invention have been found to be effective in reducing or avoiding sudden pressure drops at the end of the nozzle close to the substrate, and may be advantageously employed in obtaining, for example, greater consistency between the nozzle outlet diameter and the deposited pattern width.

Abstract: Compounds comprising an aza-dibenzo moiety and a condensed aromatic moiety having at least three benzene rings are provided. In particular, the compounds may comprise an azadibenzofuran, azadibenzothiophene, or azadibenzoselenophene joined directly or indirectly to an anthracene. The compounds may be used in the electron transport layer of organic light emitting devices to provide devices with improved properties.

Abstract: A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

Abstract: Organic electronic devices comprising a covalently bonded organic/inorganic composite layer. The composite layer may be formed by the reaction of a metal alkoxide with a charge transport compound having one or more hydroxyl groups. Examples of metal alkoxides that can be used include vanadium alkoxides, molybdenum alkoxides, titanium alkoxides, or silicon alkoxides. This composite layer can be used for any of the various charge conducting layers in an organic electronic device, including the hole injection layer.

Abstract: Compounds comprising an aza-dibenzo moiety and a condensed aromatic moiety having at least three benzene rings are provided. In particular, the compounds may comprise an azadibenzofuran, azadibenzothiophene, or azadibenzoselenophene joined directly or indirectly to an anthracene. The compounds may be used in the electron transport layer of organic light emitting devices to provide devices with improved properties.

Abstract: Organic electronic devices comprising an improved charge transport layer. The charge transport layer comprises a covalently cross-linked host matrix. The covalently cross-linked matrix comprises a charge transport compound as molecular subunits that are cross-linked to each other. The charge transport layer further comprises a second charge transport compound as an additive. The charge transport layer may be a hole transport layer. The charge transport compound for the additive may be an arylamine compound, such as NPD.

Abstract: Organic electronic devices comprising an improved charge transport layer. The charge transport layer comprises a covalently cross-linked host matrix. The covalently cross-linked matrix comprises a charge transport compound as molecular subunits that are cross-linked to each other. The charge transport layer further comprises a second charge transport compound as an additive, which may be a small molecule, or a polymer, or a mixture of both. The charge transport layer may be a hole transport layer. The charge transport compound for the additive may be an arylamine compound, such as NPD.

Abstract: A device is provided. The device includes a nozzle, a source of carrier gas and a source of organic molecules in fluid communication with the nozzle. The device also includes an active cooling system disposed adjacent to the nozzle. Preferably, the device also includes a chamber, wherein the nozzle, and the active cooling system are disposed within the chamber. A substrate holder may also be disposed within the chamber, adapted to support a substrate beneath the nozzle, movable relative to the nozzle. Preferably, a substrate is held by the substrate holder, the substrate disposed at a distance of 0.1 to 10 mm from the active cooling system. Preferably, the device also includes a heating system attached to the nozzle. The points at which the heating system are attached to the nozzle preferably includes at least one point that is zero to 5 mm from the tip of the nozzle.