Patents by Inventor Sidharth Dalmia

Sidharth Dalmia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11121468
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
  • Publication number: 20210234260
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Applicant: Intel IP Corporation
    Inventors: Trang Thai, Sidharth Dalmia, Raanan Sover, Josef Hagn, Omer Asaf, Simon Svendsen
  • Publication number: 20210210442
    Abstract: Described is an apparatus which comprises: a first transmission path for a first frequency band; a second transmission path for a second frequency band different from the first frequency band; a node common to the first and second transmission paths, the node to be coupled to an antenna; and a transmission-zero circuit coupled to the common node.
    Type: Application
    Filed: March 15, 2016
    Publication date: July 8, 2021
    Applicant: Intel Corporation
    Inventor: Sidharth Dalmia
  • Patent number: 11024574
    Abstract: Described is an apparatus which comprises: a die with a first side; a first set of solder balls coupled to the die along the first side; a laminate based substrate adjacent to the first set of solder balls, the laminate based substrate having at least one balun, at least one bandpass filter (BPF), and at least one diplexer embedded in the laminate, wherein the at least one balun is communicatively coupled to the first die via at least one of the solder balls of the first set.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: June 1, 2021
    Assignee: Intel Corporation
    Inventor: Sidharth Dalmia
  • Patent number: 11011827
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: May 18, 2021
    Assignee: Intel IP Corporation
    Inventors: Trang Thai, Sidharth Dalmia, Raanan Sover, Josef Hagn, Omer Asaf, Simon Svendsen
  • Publication number: 20210075122
    Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
    Type: Application
    Filed: July 20, 2020
    Publication date: March 11, 2021
    Applicant: Intel IP Corporation
    Inventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
  • Publication number: 20200403316
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
    Type: Application
    Filed: September 8, 2020
    Publication date: December 24, 2020
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
  • Patent number: 10797394
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
  • Patent number: 10756033
    Abstract: Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: August 25, 2020
    Assignee: Intel IP Corporation
    Inventors: Sidharth Dalmia, Igal Yehuda Kushnir
  • Patent number: 10741932
    Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 11, 2020
    Assignee: Intel IP Corporation
    Inventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
  • Publication number: 20200253040
    Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
    Type: Application
    Filed: February 5, 2019
    Publication date: August 6, 2020
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Zhenguo Jiang, William James Lambert, Kirthika Nahalingam, Swathi Vijayakumar
  • Publication number: 20200227811
    Abstract: An RF transceiver device, for use in an RF system, includes a chip package comprising one or more circuit components, a signal cable, and an antenna block. The signal cable is configured to carry signals sent to the chip package or received from the chip package. The signal cable has a first surface and a second surface. The chip package is directly coupled to the first surface of the signal cable. The antenna block comprises one or more antennas and is directly coupled to the second surface of the signal cable. By directly coupling the chip package and antenna block to the signal cable, bulky connectors are no longer needed thus reducing the total footprint of the transceiver device and increasing signal fidelity. The arrangement may be integrated with, for example, a PCB or a communication system.
    Type: Application
    Filed: January 16, 2019
    Publication date: July 16, 2020
    Applicant: INTEL CORPORATION
    Inventors: SIDHARTH DALMIA, JONATHAN C. JENSEN, TRANG THAI, OZGUR INAC
  • Publication number: 20200203834
    Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.
    Type: Application
    Filed: September 30, 2017
    Publication date: June 25, 2020
    Applicant: INTEL CORPORATION
    Inventors: Omer Asaf, Sidharth Dalmia, Trang Thai, Josef Hagn, Richard S. Perry, Jonathan C. Jensen, Raanan Sover
  • Publication number: 20200185342
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 11, 2020
    Inventors: Sidharth DALMIA, Ana M. YEPES, Pouya TALEBBEYDOKHTI, Miroslav BARYAKH, Omer ASAF
  • Publication number: 20200137884
    Abstract: For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Ofer Markish, Sidharth Dalmia, Arnaud Amadjikpe
  • Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Publication number: 20200082969
    Abstract: An apparatus is provided which comprises: a planar dielectric surface, two or more conductive leads on the surface, the conductive leads extending away from the substrate surface, two or more conductive traces on the surface between the conductive leads, the traces substantially parallel to each other, and a wire coupling a first end of a first conductive trace to an opposite end of an adjacent second conductive trace, the wire extending away from the surface. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 28, 2017
    Publication date: March 12, 2020
    Applicant: Intel Corporation
    Inventors: Fay Hua, Sidharth Dalmia, Zhichao Zhang
  • Publication number: 20200076046
    Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 5, 2020
    Inventors: Omkar KARHADE, William J. LAMBERT, Xiaoqian LI, Sidharth DALMIA
  • Patent number: 10566298
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 18, 2020
    Assignee: Intel IP Corporation
    Inventors: Sidharth Dalmia, Ana M. Yepes, Pouya Talebbeydokhti, Miroslav Baryakh, Omer Asaf
  • Publication number: 20190372229
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 5, 2019
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun