Patents by Inventor Sidharth Dalmia

Sidharth Dalmia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • DEVICE WITH OUT-PLANE INDUCTORS
    Publication number: 20200082969
    Abstract: An apparatus is provided which comprises: a planar dielectric surface, two or more conductive leads on the surface, the conductive leads extending away from the substrate surface, two or more conductive traces on the surface between the conductive leads, the traces substantially parallel to each other, and a wire coupling a first end of a first conductive trace to an opposite end of an adjacent second conductive trace, the wire extending away from the surface. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 28, 2017
    Publication date: March 12, 2020
    Applicant: Intel Corporation
    Inventors: Fay Hua, Sidharth Dalmia, Zhichao Zhang
  • 5G MMWAVE ANTENNA ARCHITECTURE WITH THERMAL MANAGEMENT
    Publication number: 20200076046
    Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 5, 2020
    Inventors: Omkar KARHADE, William J. LAMBERT, Xiaoqian LI, Sidharth DALMIA
  • Package on antenna package
    Patent number: 10566298
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 18, 2020
    Assignee: Intel IP Corporation
    Inventors: Sidharth Dalmia, Ana M. Yepes, Pouya Talebbeydokhti, Miroslav Baryakh, Omer Asaf
  • INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES
    Publication number: 20190372198
    Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai
  • ANTENNA MODULES AND COMMUNICATION DEVICES
    Publication number: 20190372229
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 5, 2019
    Applicant: Intel Corporation
    Inventors: Sidharth Dalmia, Trang Thai, William James Lambert, Zhichao Zhang, Jiwei Sun
  • ANTENNA BOARDS AND COMMUNICATION DEVICES
    Publication number: 20190348749
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 14, 2019
    Applicant: Intel IP Corporation
    Inventors: Trang Thai, Sidharth Dalmia, Raanan Sover, Josef Hagn, Omer Asaf, Simon Svendsen
  • ANTENNA BOARDS AND COMMUNICATION DEVICES
    Publication number: 20190305430
    Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Applicant: Intel IP Corporation
    Inventors: Trang Thai, Sidharth Dalmia
  • ANTENNA MODULES AND COMMUNICATION DEVICES
    Publication number: 20190305402
    Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 3, 2019
    Applicant: Intel IP Corporation
    Inventors: Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William James Lambert, Benjamin Jann
  • ANTENNA MODULES AND COMMUNICATION DEVICES
    Publication number: 20190260110
    Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 22, 2019
    Applicant: Intel Corporation
    Inventors: Trang Thai, Raanan Sover, Noam Kogan, Jonathan Jensen, Richard Perry, William James Lambert, Omer Asaf, Ralph Winzenburg, Daniel R. Cox, Josef Hagn, Sidharth Dalmia
  • Partially molded direct chip attach package structures for connectivity module solutions
    Patent number: 10332821
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: June 25, 2019
    Assignee: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • WIRELESS MODULE WITH ANTENNA PACKAGE AND CAP PACKAGE
    Publication number: 20190139915
    Abstract: Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Application
    Filed: June 3, 2016
    Publication date: May 9, 2019
    Inventors: Sidharth Dalmia, Igal Yehuda Kushnir
  • COMPACT RADIO FREQUENCY (RF) COMMUNICATION MODULES WITH ENDFIRE AND BROADSIDE ANTENNAS
    Publication number: 20190103682
    Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 4, 2019
    Applicant: INTEL IP CORPORATION
    Inventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
  • PARTIALLY MOLDED DIRECT CHIP ATTACH PACKAGE STRUCTURES FOR CONNECTIVITY MODULE SOLUTIONS
    Publication number: 20190067163
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 28, 2019
    Applicant: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • PACKAGE ON ANTENNA PACKAGE
    Publication number: 20190035749
    Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.
    Type: Application
    Filed: April 1, 2016
    Publication date: January 31, 2019
    Applicant: INTEL CORPORATION
    Inventors: Sidharth DALMIA, Ana M. YEPES, Pouya TALEBBEYDOKHTI, Miroslav BARYAKH, Omer ASAF
  • INTEGRATED SUBSTRATE COMMUNICATION FRONTEND
    Publication number: 20190027432
    Abstract: Described is an apparatus which comprises: a die with a first side; a first set of solder balls coupled to the die along the first side; a laminate based substrate adjacent to the first set of solder balls, the laminate based substrate having at least one balun, at least one bandpass filter (BPF), and at least one diplexer embedded in the laminate, wherein the at least one balun is communicatively coupled to the first die via at least one of the solder balls of the first set.
    Type: Application
    Filed: March 15, 2016
    Publication date: January 24, 2019
    Applicant: INTEL CORPORATION
    Inventor: Sidharth Dalmia
  • Antennas in electronic devices
    Patent number: 10186756
    Abstract: In various embodiments, the disclosure describes systems and methods that can be use in connection with electronic devices (for example, mobile devices) and can include one or more a dies, first antenna elements/feeding elements electrically coupled to the die, and second antenna elements/parasitic elements disposed on at least a portion of the electronic device. In one embodiment, the parasitic elements can be disposed near the feeding element and in a spaced relationship over one or more gaps. Further the parasitic elements can be electrically coupled to the feeding element over the gap. In various embodiments, the disclosed systems and methods can be used to implement a Yagi-Uda antenna in an electronic device, for example, a mobile device.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: January 22, 2019
    Assignee: Intel IP Corporation
    Inventor: Sidharth Dalmia
  • Partially molded direct chip attach package structures for connectivity module solutions
    Patent number: 10049961
    Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 14, 2018
    Assignee: Intel IP Corporation
    Inventors: Quan Qi, Carlton E. Hanna, Eytan Mann, Sidharth Dalmia
  • ANTENNAS IN ELECTRONIC DEVICES
    Publication number: 20180034134
    Abstract: In various embodiments, the disclosure describes systems and methods that can be use in connection with electronic devices (for example, mobile devices) and can include one or more a dies, first antenna elements/feeding elements electrically coupled to the die, and second antenna elements/parasitic elements disposed on at least a portion of the electronic device. In one embodiment, the parasitic elements can be disposed near the feeding element and in a spaced relationship over one or more gaps. Further the parasitic elements can be electrically coupled to the feeding element over the gap. In various embodiments, the disclosed systems and methods can be used to implement a Yagi-Uda antenna in an electronic device, for example, a mobile device.
    Type: Application
    Filed: August 1, 2016
    Publication date: February 1, 2018
    Inventor: Sidharth Dalmia
  • Planar electronic device and method for manufacturing
    Patent number: 9440378
    Abstract: A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: September 13, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: Sidharth Dalmia, William Lee Harrison