Abstract: An opto-coupler including an optical transmitter and an optical receiver. The opto-coupler includes at least three layers of materials between the optical transmitter and the optical receiver that attach and optically couple the optical transmitter and the optical receiver to define a stack. A method of manufacturing the opto-coupler is also disclosed. The method includes disposing an insulating layer on a first die and disposing an isolation layer on the insulating layer. The method further includes disposing a securing layer on the isolation layer and disposing a second die on the securing layer.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.

Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.