Abstract: A power semiconductor device is provided. The power semiconductor device includes a leadframe, which includes a first chip carrier part and at least one second chip carrier part, which are fitted at a distance from one another and are in each case electrically conductive, at least one first power semiconductor component applied on the first chip carrier part, at least one second power semiconductor component applied on the second chip carrier part, external contacts in the form of external leads, and a capacitor. The capacitor is mounted on two adjacent external leads.

Abstract: An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.

Abstract: A super-hydrophobic fiber of the present disclosure includes: a nano-needle fiber having a surface including needle-shaped nano structures; and a coating layer disposed on the surface including the nano structures, and containing a hydrophobic material. The fiber has no aging effect, and thus, is excellent in durability, and has such a large contact angle and such as small sliding angle that the fiber may not be wet with water. A method for fabricating the super-hydrophobic fiber includes: a preparation step of preparing a pre-treating fiber; an etching step of etching a surface and an inner portion of the pre-treating fiber to fabricate a nano-needle fiber having a surface on which needle-shaped nano structures are formed; and a coating step of forming a coating layer containing a hydrophobic material, and enables mass production and is performed by simple processes.

Abstract: Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Abstract: In an embodiment, a semiconductor device package includes a bidirectional switch circuit. The bidirectional switch circuit includes a first semiconductor transistor mounted on a first die pad, a second semiconductor transistor mounted on a second die pad, the second die pad being separate from the first die pad, and a conductive connector extending between a source electrode of the first transistor and a source electrode of the second transistor.

Abstract: Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Abstract: Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.

Abstract: Various embodiments provide a chip arrangement. The chip arrangement may include a first chip including a first contact and a second contact; a second chip; a leadframe including a first leadframe portion and a second leadframe portion electrically insulated from the first leadframe portion; and a plurality of pins coupled to the leadframe. At least one first pin is coupled to the first leadframe portion and at least one second pin is coupled to the second leadframe portion. The first contact of the first chip is electrically coupled to the first leadframe portion and the second contact of the first chip is coupled to the second leadframe portion. A contact of the second chip is electrically coupled to the second leadframe portion.

Abstract: A waste container (10) comprising a receptacle (11) and a closure (13) connectable to the receptacle (11). The closure (13) comprises a base (14) and a support (15) extending upwardly from the base (14). The support (15) defines a front opening (16) and having a rear wall (17). A tray (18) comprising a shelf (19) and an inferiorly depending guard (21) is also provided in the support (15), with the tray (18) being at least partially rotatable relative to the support (15). The closure (13) further comprises a shield (23) comprising a main body (24) extending from one edge (25) to a free edge (26) and having an upper surface (27) and a lower surface (28). The shield (23) is hingedly connected to the support (15) at or adjacent to the one edge (25) and is moveable between an open position in which it overlies the rear wall (17) of the closure (13) and a closed position in which it is secured to the closure (13) to at least substantially cover the front opening (16).

Abstract: A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices.

Abstract: A waste container (10) comprising a receptacle (11) and a closure (13) connectable to the receptacle (11). The closure (13) comprises a base (14) and a support (15) extending upwardly from the base (14). The support (15) defines a front opening (16) and having a rear wall (17). A tray (18) comprising a shelf (19) and an inferiorly depending guard (21) is also provided in the support (15), with the tray (18) being at least partially rotatable relative to the support (15). The closure (13) further comprises a shield (23) comprising a main body (24) extending from one edge (25) to a free edge (26) and having an upper surface (27) and a lower surface (28). The shield (23) is hingedly connected to the support (15) at or adjacent to the one edge (25) and is moveable between an open position in which it overlies the rear wall (17) of the closure (13) and a closed position in which it is secured to the closure (13) to at least substantially cover the front opening (16).

Abstract: In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material.

Abstract: A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.

Abstract: The invention relates to an injection device (110) with a luer fitting. The injection device has a compressible syringe body (137) defining a reservoir (146). A male luer fitting (150) has a channel (152) therethrough for conducting contents of the reservoir, and a luer tip at an end of said male luer fitting opposing said base end. A first connecting structure (182) is arranged on said male luer fitting between said base end and said luer tip. A shield cap (160) is arranged on the male luer fitting. The shield cap has a second connecting structure interacting with said first connecting structure to prevent inadvertent movement of said shield cap relative to said male luer fitting when said shield cap is arranged at said first position. A first seal (170) is provided for sealing said channel at said luer tip. A second seal (180) is arranged between said shield cap and said male luer fitting for sealing the outer surface and the luer tip of said male luer fitting from outside contamination.

Abstract: Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.

Abstract: Disclosed is an antioxidant nutritional supplement including a vegetable mixture and a fruit mixture each having an antioxidant effect as indispensible ingredients. Since the antioxidant nutritional supplement is not a drug, it may have a low price and it may not have medical side effects even if it is taken for a long period of time. Furthermore, since the antioxidant nutritional supplement includes various nutrients with balance, it may allow a user to be provided with nutrients which may lack to modern people, without causing a difficulty in taking other nutritional supplements.

Abstract: A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices.

Abstract: A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device.

Abstract: A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.