Abstract: A mounting seat for an integrated circuit (IC) and a circuit board includes a base formed by way of powder metallurgy, two pin holes formed on the base, and two positioning pins, which may be respectively formed in the pin holes by way of insert molding or inserted into the pin holes by way of assembling. Thus, a surface of the base may be quickly molded to form the positioning pins or assembled with the positioning pins, which are made of a material different from that of the base. Consequently, the method of manufacturing the mounting seat is simple and timesaving, and the manufacturing cost can be reduced.

Abstract: A method for refining the microstructure and enhancing the processability of titanium aluminum alloys containing about 45 to 55 atomic percent aluminum which comprises the steps of:(a) rapidly solidifying a titanium aluminum alloy containing about 45 to 55 atomic percent aluminum in a hydrogen-containing atmosphere to provide a hydrogenated, rapidly solidified material having at least one dimension not greater than about 100 micrometers, and;(b) diffusing hydrogen out of the hydrogenated solid material.