Patents by Inventor Simon Dodd

Simon Dodd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180194131
    Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
    Type: Application
    Filed: March 9, 2018
    Publication date: July 12, 2018
    Inventors: Simon DODD, Ivan ELLUL, Christopher BRINCAT
  • Patent number: 9968700
    Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 15, 2018
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS S.R.L., STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Simon Dodd, Joseph Edward Scheffelin, Dave S. Hunt, Timothy James Hoekstra, Faiz Sherman, Stephan Gary Bush
  • Patent number: 9950511
    Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: April 24, 2018
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS (MALTA) LTD
    Inventors: Simon Dodd, Ivan Ellul, Christopher Brincat
  • Patent number: 9938136
    Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 10, 2018
    Assignees: STMICROELECTRONICS ASIA PACIFIC PTE LTD, STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC.
    Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
  • Publication number: 20180078954
    Abstract: Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.
    Type: Application
    Filed: October 23, 2017
    Publication date: March 22, 2018
    Inventors: Dana Paul GRUENBACHER, Stephan Gary BUSH, Teck Khim NEO, David S. Hunt, Joseph Edward SCHEFFELIN, Steven L. WEBB, Domenico GIUSTI, Simon DODD
  • Patent number: 9919334
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: March 20, 2018
    Assignees: STMicroelectronics, Inc., STMicroelectronics S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Publication number: 20180056319
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: November 3, 2017
    Publication date: March 1, 2018
    Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
  • Publication number: 20180050901
    Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
    Type: Application
    Filed: August 18, 2016
    Publication date: February 22, 2018
    Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
  • Patent number: 9873250
    Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: January 23, 2018
    Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS S.R.L.
    Inventors: Simon Dodd, Andrea Nicola Colecchia
  • Patent number: 9861720
    Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid in a direction that, at least in part, opposes gravity. In one embodiment, the microfluidic delivery system includes a microfluidic refill cartridge that is configured to be placed in a housing. The microfluidic refill cartridge includes at least one nozzle that faces upward or off to a side. The microfluidic refill cartridge includes a fluid transport member that allows fluid to travel upward from a fluid reservoir in opposition to gravity. A fluid path is located above the fluid transport member placing an end of the fluid transport member in fluid communication with a chamber and a nozzle. In response to the microfluidic delivery system receiving an electrical signal, an ejection element is configured to cause fluid in the chamber to be expelled through the nozzle.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: January 9, 2018
    Assignee: STMicroelectronics, Inc.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Tim Hoekstra, Faiz Sherman, Steve Bush
  • Patent number: 9833806
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: December 5, 2017
    Assignees: STMicroelectronics, Inc., STMICROELECTRONICS S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Matt Giere, Dana Gruenbacher, Faiz Sherman
  • Patent number: 9808812
    Abstract: Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: November 7, 2017
    Assignee: The Procter & Gamble Company
    Inventors: Dana Paul Gruenbacher, Stephan Gary Bush, Teck Khim Neo, David S Hunt, Joseph Edward Scheffelin, Steven L Webb, Domenico Giusti, Simon Dodd
  • Patent number: 9814098
    Abstract: A microfluidic refill includes a reservoir having a hollow body and an opening; a transport member in fluid communication with the reservoir; and a lid enclosing the opening of the reservoir. The lid is in fluid communication with the transport member. The lid comprises a rigid microfluidic delivery member. The rigid microfluidic delivery member includes a die and electrical traces that are in electrical communication with the die, wherein the electrical traces terminate at electrical contacts, wherein the electrical traces are disposed on only one plane. The die has a fluid chamber in fluid communication with the transport member at an inlet of the fluid chamber and with an orifice at an outlet of the fluid chamber and.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 7, 2017
    Assignee: The Procter & Gamble Company
    Inventors: Dana Paul Gruenbacher, David S. Hunt, Joseph Edward Scheffelin, Simon Dodd
  • Publication number: 20170311446
    Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
    Type: Application
    Filed: August 31, 2016
    Publication date: October 26, 2017
    Inventors: Simon DODD, Roberto BRIOSCHI
  • Publication number: 20170297332
    Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: Simon DODD, Joe SCHEFFELIN, Dave HUNT, Matt GIERE, Dana GRUENBACHER, Faiz SHERMAN
  • Publication number: 20170259568
    Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.
    Type: Application
    Filed: September 8, 2016
    Publication date: September 14, 2017
    Inventors: Simon Dodd, Andrea Nicola Colecchia
  • Publication number: 20170232739
    Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
    Type: Application
    Filed: September 27, 2016
    Publication date: August 17, 2017
    Inventors: Simon DODD, Ivan ELLUL, Christopher BRINCAT
  • Publication number: 20170188526
    Abstract: The present disclosure is directed to a greenhouse or single container for plant growth coupled to the Internet of Things and including a microfluidic die for water or nutrient distribution. The microfluidic die is controllable automatically or with instructions from a remote user, based on sensors included within a growth environment.
    Type: Application
    Filed: December 30, 2015
    Publication date: July 6, 2017
    Inventors: Marco DE FAZIO, Simon DODD
  • Publication number: 20170190174
    Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
    Type: Application
    Filed: August 31, 2016
    Publication date: July 6, 2017
    Inventors: Simon DODD, David S. HUNT, Joseph Edward SCHEFFELIN, Dana GRUENBACHER
  • Publication number: 20170190175
    Abstract: The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.
    Type: Application
    Filed: August 31, 2016
    Publication date: July 6, 2017
    Inventor: Simon DODD