Abstract: A method of etching the trench portions of a thermal inkjet printhead using a robust mask that precisely defines the area of the substrate surface to be etched and that protects the adjacent drop generator components from damaging exposure to the silicon etchant. The process in accordance with the present invention uses as a mask some of the material that is also used in patterned layers for producing the drop generator components on the substrate. The placement of the mask components on the substrate occurs simultaneously with the production of the drop generator components, thereby minimizing the time and expense of creating the silicon-etchant mask.

Abstract: A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.

Abstract: A method of etching the trench portions of a thermal inkjet printhead using a robust mask that precisely defines the area of the substrate surface to be etched and that protects the adjacent drop generator components from damaging exposure to the silicon etchant. The process in accordance with the present invention uses as a mask some of the material that is also used in patterned layers for producing the drop generator components on the substrate. The placement of the mask components on the substrate occurs simultaneously with the production of the drop generator components, thereby minimizing the time and expense of creating the silicon-etchant mask.

Abstract: A fluid ejection device including: a substrate having a first surface having an non-doped region; a first insulative material disposed on a portion of the first surface, the first insulative material having a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantial free of the second insulative material and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the non-doped region on the substrate.

Abstract: A replaceable printer component (14) includes a thermal sense resistor (14B) having a first resistance. A resistance modifier (510) coupled to the thermal sense resistor modifies the first resistance.

Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.

Abstract: The present invention includes as one embodiment an inkjet printhead including a plurality of ink drop generators configured to recieve a same color of ink and grouped into four axis groups, each of the four axis groups including a plurality of nozzles arranged along one of four axes, wherein the drop generators are staggered with respect to one another to decrease an effective pitch of the inkjet printhead to substantially one fourth of the pitch of a single one of the four axis groups.

Abstract: A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.

Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.

Abstract: A printhead includes a substrate having a plurality of fluid heating elements and at least one peripheral edge. Fluid channels deliver fluid to the plurality of fluid heating elements. The plurality of fluid channels includes at least one edgefeed fluid channel defined by the at least one peripheral edge, and at least one slot feed fluid channel.

Abstract: A replaceable printer component (14) includes a thermal sense resistor (14B) having a first resistance. A resistance modifier (510) coupled to the thermal sense resistor modifies the first resistance.

Abstract: A replaceable printer component (14) includes a thermal sense resistor (14B) having a first resistance. A resistance modifier (510) coupled to the thermal sense resistor modifies the first resistance.

Abstract: A fluid ejection device comprising a first fluid feed source having a first fluid feed source edge in communication with a substrate surface, first firing resistors disposed along the first fluid feed source and configured to respond to a first current to heat fluid provided by the first fluid feed source, and a reference conductor. The reference conductor is configured to conduct the first current from the first firing resistors, wherein the reference conductor is disposed between the first fluid feed source edge and the first firing resistors.

Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.

Abstract: An optical target is provided. In one embodiment, the target is formed on a substrate. The target includes a first layer deposited below a second layer on the substrate. The second layer is deposited below a third layer on the substrate. The first layer has a topographic contour formed thereon, the first layer at least partially projecting a patterned topographical contour through the second layer to the third layer.

Abstract: A fluid ejection device comprises a first heater element and a second heater element spaced a first distance from the first heater element. A first drive transistor is associated with the first heater element and a second drive transistor is associated with the second firing heater element. The second drive transistor is spaced a second distance from the first drive transistor. The second distance is different from the first distance.

Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.

Abstract: Integrated circuits and methods for producing them are provided. In particular, integrated circuits with shielding elements are provided.

Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.

Abstract: An ink jet printhead includes a printhead substrate having a plurality of thin film layers and four side by side columnar arrays of drop generators formed in the printhead substrate and extending along a longitudinal extent. Each columnar array has drop generators that are separated by a drop generator pitch P. The drop generators produce ink drops having a drop volume that enables single pass printing of a resolution that is 1/(4P) dpi along a print axis parallel to the longitudinal extent. Four columnar arrays of FET drive circuits formed in the printhead substrate are employed to energize corresponding columnar arrays of drop generators.