Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Abstract: Solid-state deposition of materials and structures formed thereof are described. In particular embodiments, solid-state deposition of materials may be utilized for integrated magnetic assemblies. The integrated magnetic assemblies may include a substrate having a cavity that is physically isolated from an environment external from the substrate and a magnetizable magnetic element formed of particles of magnetizable material. The magnetizable magnetic element may be carried within the cavity such that the magnetizable magnetic element fills the cavity and takes on a size and a shape of the cavity.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region.

Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region. The cable assemblies can also include a hinged cover that can be pivoted to close a gap between two hinged sections of the electronic device.

Abstract: An electronic device having an indication member for determining liquid exposure in an electronic device is disclosed. The indication member may include ink and a layer covering the ink. The layer may include a liquid-permeable layer that allows liquid to pass through the layer and contact the ink. In this regard, at least some of the ink may rise through the layer and to a top surface of the indication member. Although the ink may be exposed at the top surface, in some cases, the ink is visible or detectable when exposed to light from an ultraviolet light source. Also, the top surface may include a pattern or other indicia that is also visible or detectable when exposed to the light source. When the indication member is exposed to liquid, the pattern may be altered or disturbed in a location corresponding to an exposed portion of the indication member.

Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Abstract: Processes for forming cosmetically appealing edges on laminated fabric structures are described. The methods involve a laser cutting process that includes in-process melting of polymer material within the laminated fabric so as to coat fibers of the laminated fabric. The resultant cut laminated fabric has a cosmetic edge that has no exposed fibers. The laser cutting and melting can be performed in a single laser cutting operation, making it well suited for integration into manufacturing product lines.

Abstract: The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.

Abstract: This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin.

Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Abstract: Processes for forming cosmetically appealing edges on laminated fabric structures are described. The methods involve a laser cutting process that includes in-process melting of polymer material within the laminated fabric so as to coat fibers of the laminated fabric. The resultant cut laminated fabric has a cosmetic edge that has no exposed fibers. The laser cutting and melting can be performed in a single laser cutting operation, making it well suited for integration into manufacturing product lines.

Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Abstract: An electronic device can include a processor, output device(s) coupled thereto, and an outer housing or enclosure containing these and other electronic and/or optical items. The enclosure can include a substantially thin contoured component having an external surface exposed to a user and an internal surface. A stiffening plate situated with respect to the internal surface provides a substantial increase in the torsional stiffness and/or bending stiffness of the enclosure. The stiffening plate and contoured component can form a cavity therebetween, and one or more ridges, fins, plates, foam structures and/or other structural items can be located within the cavity. In various embodiments, the device can be a laptop computer and the contoured component can be a dome shaped outer housing behind the display portion thereof.

Abstract: Cable assemblies for providing electrical communication between hinged sections of an electronic device are described. The cable assemblies can include a cover that covers one or more cables that run through a hinge region of the electronic device. The cable and cover can be drawn over a mandrel of the hinge region. The cover and the portions of the mandrel can be visible to a user at the hinge region of the electronic device. The cover can be sufficiently rigid to guide a path of the cable and protect the cable from bending beyond a prescribed angle during rotation of the electronic device at the hinge region. The cover can also be sufficiently rigid to prevent ceasing or folding of the cover and the cable during rotation of the electronic device at the hinge region. The cable assemblies can also include a hinged cover that can be pivoted to close a gap between two hinged sections of the electronic device.