Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Abstract: The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.

Abstract: A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

Abstract: An electronic device having an indication member for determining liquid exposure in an electronic device is disclosed. The indication member may include ink and a layer covering the ink. The layer may include a liquid-permeable layer that allows liquid to pass through the layer and contact the ink. In this regard, at least some of the ink may rise through the layer and to a top surface of the indication member. Although the ink may be exposed at the top surface, in some cases, the ink is visible or detectable when exposed to light from an ultraviolet light source. Also, the top surface may include a pattern or other indicia that is also visible or detectable when exposed to the light source. When the indication member is exposed to liquid, the pattern may be altered or disturbed in a location corresponding to an exposed portion of the indication member.

Abstract: The disclosed embodiments relate generally to methods for creating smooth cosmetic surfaces along small features of an electronic device. The disclosed embodiments are well suited for reaching surfaces disposed in constrained spaces. More specifically a method for finishing a workpiece is described. For example, the method may be employed to finish an inlet portion of a cable connector. The method may involve the use of an abrasive brush which may include a single filament and abrasive particles coupled thereto, which can be configured to provide any number of different surface geometries during a finishing operation.

Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic join between various parts.

Abstract: Processes for forming cosmetically appealing edges on laminated fabric structures are described. The methods involve a laser cutting process that includes in-process melting of polymer material within the laminated fabric so as to coat fibers of the laminated fabric. The resultant cut laminated fabric has a cosmetic edge that has no exposed fibers. The laser cutting and melting can be performed in a single laser cutting operation, making it well suited for integration into manufacturing product lines.

Abstract: A three-dimensional printing system includes a reservoir containing a UV curable resin therein, a UV light, an oxygen delivery system, and a movable platform having a build surface configured to support a three-dimensional printed part at a non-planar feature thereon. The bottom of the reservoir can be UV-transparent and oxygen permeable, so the resin is cured by UV light at the build surface or printing part, but not cured despite UV light at the oxygen rich region near the reservoir bottom. Non-planar features include recesses and/or protrusions at the build surface, which can help form backsides of printed parts. Metal parts can be fitted to non-planar features to have thin insulative three-dimensional layers printed thereto. Many identical non-planar features can be used to mass-produce identical printed parts, which can be for electronic devices.

Abstract: The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.

Abstract: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Abstract: A method for efficiently machining magnets with curved surfaces is disclosed. The use of machining equipment capable of making curved cuts through magnetic material can allow significant cost and material savings, particularly when machining magnets with complementary surfaces. A process for using a series of cutting wires to simultaneously cut magnetic material into conformally shaped magnets is described.

Abstract: An electronic device can include a processor, output device(s) coupled thereto, and an outer housing or enclosure containing these and other electronic and/or optical items. The enclosure can include a substantially thin contoured component having an external surface exposed to a user and an internal surface. A stiffening plate situated with respect to the internal surface provides a substantial increase in the torsional stiffness and/or bending stiffness of the enclosure. The stiffening plate and contoured component can form a cavity therebetween, and one or more ridges, fins, plates, foam structures and/or other structural items can be located within the cavity. In various embodiments, the device can be a laptop computer and the contoured component can be a dome shaped outer housing behind the display portion thereof.

Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

Abstract: A method and system for observing and monitoring thermal characteristics of a machining operation, such as a surface finishing operation, performed on a workpiece is disclosed. The surface finishing operation can be performed on the workpiece in order to remove a surface defect, e.g. a parting line, on a surface of the workpiece and/or to provide a mirror-like finish to the workpiece. In one embodiment, an emissive layer is applied to the workpiece to increase a thermal emissivity of the workpiece. In some embodiments, a finishing surface, such as a polishing or buffing wheel, and/or a lubricant used in a finishing operation is monitored. A thermal profile of the surface of the workpiece, finishing surface and/or lubricant can be obtained. The finishing operation can be modified in response to the monitored thermal characteristics to prevent the occurrence of defects and improve the efficacy of the finishing operation.

Abstract: Systems and methods related to three-dimensional coding are disclosed. In one embodiment, a method for encoding data is described that includes generating a pattern in a substrate. The pattern includes elements and each element has one of an aperture or a protrusion. The aperture or protrusion has unique x, y coordinates within the pattern. The method also includes varying a depth of at least one element. The varied depth encodes data.

Abstract: The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.

Abstract: The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.

Abstract: Methods of machining a housing of a portable computing device are provided. A cutting tool may be moved perpendicularly to a rotational axis during each rotation thereof to machine a substrate and define pockets and holes including substantially non-rounded corners. In this regard, the cutting tool may be translated perpendicularly to the rotational axis during each rotation of the cutting tool to define a non-rounded cutting profile, where desired. Translation movement perpendicular to the rotational axis may be provided by a controller actively controlling actuators of a computer numerical control (CNC) mill or other rotary machine.