Patents by Inventor Simone Sassolini
Simone Sassolini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8901925Abstract: A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.Type: GrantFiled: September 10, 2012Date of Patent: December 2, 2014Assignee: STMicroelectronics S.r.l.Inventors: Benedetto Vigna, Simone Sassolini, Lorenzo Baldo, Francesco Procopio
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Patent number: 8679887Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.Type: GrantFiled: April 26, 2012Date of Patent: March 25, 2014Assignee: STMicroelectronics S.r.l.Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
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Publication number: 20130000136Abstract: A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.Type: ApplicationFiled: September 10, 2012Publication date: January 3, 2013Applicant: STMICROELECTRONICS S.R.L.Inventors: Benedetto Vigna, Simone Sassolini, Lorenzo Baldo, Francesco Procopio
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Patent number: 8289021Abstract: A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.Type: GrantFiled: June 29, 2010Date of Patent: October 16, 2012Assignee: STMicroelectronics S.r.l.Inventors: Benedetto Vigna, Simone Sassolini, Lorenzo Baldo, Francesco Procopio
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Publication number: 20120208343Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.Type: ApplicationFiled: April 26, 2012Publication date: August 16, 2012Applicant: STMICROELECTRONICS S.R.L.Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
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Patent number: 8193550Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.Type: GrantFiled: June 10, 2008Date of Patent: June 5, 2012Assignee: STMicroelectronics S.r.l.Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
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Patent number: 8044929Abstract: In a data-input device an actuator element that can be manually actuated, and a sensor mechanically coupled to the actuator element. The sensor is formed in a body of semiconductor material housing a first sensitive element, which detects the actuation of the actuator element and generates electrical control signals. The first sensitive element is a microelectromechanical pressure sensor, formed by: a cavity made within the body; a diaphragm made in a surface portion of the body and suspended above the cavity; and piezoresistive transducer elements integrated in peripheral surface portions of the diaphragm in order to detect its deformations upon actuation of the actuator element.Type: GrantFiled: March 30, 2006Date of Patent: October 25, 2011Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Simone Sassolini, Marco Del Sarto
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Publication number: 20100327864Abstract: A magnetoresistive element formed by a strip of magnetoresistive material which extends on a substrate of semiconductor material having an upper surface. The strip comprises at least one planar portion which extends parallel to the upper surface, and at least one transverse portion which extends in a direction transverse to the upper surface. The transverse portion is formed on a transverse wall of a dig. By providing a number of magnetoresistive elements perpendicular to one another it is possible to obtain an electronic compass that is insensitive to oscillations with respect to the horizontal plane parallel to the surface of the Earth.Type: ApplicationFiled: June 29, 2010Publication date: December 30, 2010Applicant: STMicroelectronics S.r.l.Inventors: Benedetto Vigna, Simone Sassolini, Lorenzo Baldo, Francesco Procopio
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Patent number: 7463454Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.Type: GrantFiled: June 14, 2007Date of Patent: December 9, 2008Assignee: STMicroelectronics S.R.L.Inventors: Ubaldo Mastromatteo, Bruno Murari, Paolo Ferrari, Simone Sassolini
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Publication number: 20080272447Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.Type: ApplicationFiled: June 10, 2008Publication date: November 6, 2008Applicant: STMICROELECTRONICS S.R.L.Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
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Patent number: 7437933Abstract: Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.Type: GrantFiled: July 7, 2005Date of Patent: October 21, 2008Assignee: STMicroelectronics S.r.l.Inventors: Guido Spinola Durante, Simone Sassolini, Marco Ferrera, Mauro Marchi
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Patent number: 7399652Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.Type: GrantFiled: April 8, 2004Date of Patent: July 15, 2008Assignee: STMicroelectronics S.R.L.Inventors: Simone Sassolini, Mauro Marchi, Marco Del Sarto, Lorenzo Baldo
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Publication number: 20070247761Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.Type: ApplicationFiled: June 14, 2007Publication date: October 25, 2007Inventors: Ubaldo Mastromatteo, Bruno Murari, Paolo Ferrari, Simone Sassolini
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Patent number: 7270003Abstract: The semiconductor inertial sensor is formed by a rotor element and a stator element electrostatically coupled together. The rotor element is formed by a suspended mass and by a plurality of mobile electrodes extending from the suspended mass. The stator element is formed by a plurality of fixed electrodes facing respective mobile electrodes. The suspended mass is supported by elastic suspension elements. The suspended mass has a first, larger, thickness, and the elastic suspension elements have a second thickness, smaller than the first thickness.Type: GrantFiled: July 25, 2005Date of Patent: September 18, 2007Assignee: STMicroelectronics S.r.l.Inventors: Simone Sassolini, Marco Del Sarto, Lorenzo Baldo, Mauro Marchi
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Patent number: 7258008Abstract: An Integrated gyroscope includes a suspended mass; mobile actuation electrodes extending from the suspended mass; and a sensing mass connected to the actuation mass through coupling springs. The suspended mass is formed by an external part and an internal part, electrically separated by an electrical-insulation region having a closed annular shape. The electrical-insulation region is laterally completely surrounded by the external part and by the internal part. In one embodiment, the suspended mass has the shape of a closed frame delimiting an opening, the sensing mass is formed inside the opening and is connected to the internal part, and the mobile actuation electrodes are connected to the external part.Type: GrantFiled: December 22, 2005Date of Patent: August 21, 2007Assignee: STMicroelectronics S.r.l.Inventors: Guido Spinola Durante, Simone Sassolini, Andrea Rusconi Clerici
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Micro-electro-mechanical actuator for positioning a device such as a read/write head in a disk drive
Patent number: 7239487Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.Type: GrantFiled: June 20, 2003Date of Patent: July 3, 2007Assignee: STMicroelectronics S.r.l.Inventors: Ubaldo Mastromatteo, Bruno Murari, Paolo Ferrari, Simone Sassolini -
Publication number: 20060262088Abstract: In a data-input device an actuator element that can be manually actuated, and a sensor mechanically coupled to the actuator element. The sensor is formed in a body of semiconductor material housing a first sensitive element, which detects the actuation of the actuator element and generates electrical control signals. The first sensitive element is a microelectromechanical pressure sensor, formed by: a cavity made within the body; a diaphragm made in a surface portion of the body and suspended above the cavity; and piezoresistive transducer elements integrated in peripheral surface portions of the diaphragm in order to detect its deformations upon actuation of the actuator element.Type: ApplicationFiled: March 30, 2006Publication date: November 23, 2006Applicant: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Simone Sassolini, Marco Del Sarto
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Patent number: 7116525Abstract: A read/write assembly for magnetic hard disks includes at least: one supporting element; one read/write (R/W) transducer; one micro-actuator, set between the R/W transducer and the supporting element; one electrical-connection structure for connection to a remote device carried by the supporting element and connected to the R/W transducer and to the micro-actuator. In addition, a protective structure, set so as to cover the micro-actuator is made of a single piece with the electrical-connection structure.Type: GrantFiled: May 2, 2003Date of Patent: October 3, 2006Assignee: STMicroelectronics S.R.L.Inventors: Marco Del Sarto, Mauro Marchi, Lorenzo Baldo, Simone Sassolini
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Publication number: 20060162448Abstract: An Integrated gyroscope includes a suspended mass; mobile actuation electrodes extending from the suspended mass; and a sensing mass connected to the actuation mass through coupling springs. The suspended mass is formed by an external part and an internal part, electrically separated by an electrical-insulation region having a closed annular shape. The electrical-insulation region is laterally completely surrounded by the external part and by the internal part. In one embodiment, the suspended mass has the shape of a closed frame delimiting an opening, the sensing mass is formed inside the opening and is connected to the internal part, and the mobile actuation electrodes are connected to the external part.Type: ApplicationFiled: December 22, 2005Publication date: July 27, 2006Applicant: STMicroelectronics S.r.l.Inventors: Guido Durante, Simone Sassolini, Andrea Clerici
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Publication number: 20060070441Abstract: Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.Type: ApplicationFiled: July 7, 2005Publication date: April 6, 2006Applicant: STMicroelectronics S.r.I.Inventors: Guido Durante, Simone Sassolini, Marco Ferrera, Mauro Marchi