Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: An embodiment includes encoding digital data into encoded digital data in a transition minimized differential signaling encoder, serializing the encoded digital data into encoded and serial digital data in a serializer, generating test data in a pseudo-random binary sequence generator circuit, transmitting the encoded and serial digital data through a multiplexer to a transmission medium in a normal mode of operation, and transmitting the test data through the multiplexer to the transmission medium in a test mode of operation. The encoder, the serializer, the sequence generator circuit, and the multiplexer may be fabricated in a single integrated circuit chip. The test data may be pseudo-random binary sequence data. The digital data may include data to generate colors in a visual image, and the encoded and serial digital data may be received, deserialized, decoded, and displayed in a display unit.

Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.