Patents by Inventor Siu Waf Low

Siu Waf Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible pin location integrated circuit package
    Patent number: 5952611
    Abstract: An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: September 14, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Kian Teng Eng, Min Yu Chan, Jing Sua Goh, Siu Waf Low