Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.

Abstract: An efficient method of calculating maximum current limits for library gates in which a current limit includes the impact of self-heating effects associated with the maximum current. A maximum current solution is obtained in a self-consistent fashion, providing a way of determining the self-consistent solution in a rapid fashion without extensive numerical calculations or simulations. The present method provides a practical approach for characterizing a large library of gates for use in CMOS designs.

Abstract: An efficient method of calculating maximum current limits for library gates in which a current limit includes the impact of self-heating effects associated with the maximum current. A maximum current solution is obtained in a self-consistent fashion, providing a way of determining the self-consistent solution in a rapid fashion without extensive numerical calculations or simulations. The present method provides a practical approach for characterizing a large library of gates for use in CMOS designs.

Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.

Abstract: A method of fabricating a semiconducting device is disclosed. A carbon nanotube is formed on a substrate. A portion of the substrate is removed to form a recess below a section of the carbon nanotube. A doped material is applied in the recess to fabricate the semiconducting device. The recess may be between one or more contacts formed on the substrate separated by a gap.

Abstract: In one aspect, a method for fabricating an electronic device includes the following steps. A wafer is provided having at least one first active area and at least one second active area defined therein. One or more p-FET/n-FET devices are formed in the active areas, each having a p-FET/n-FET gate stack and p-FET/n-FET source and drain regions. A self-aligned silicide is formed in each of the p-FET/n-FET source and drain regions, wherein the self-aligned silicide in each of the p-FET source and drain regions has a thickness T1 and the self-aligned silicide in each of the n-FET source and drain regions having a thickness T2, wherein T1 is less than T2. During a subsequent trench silicidation in the p-FET/n-FET source and drain regions, the trench silicide metal will diffuse through the thinner self-aligned silicide in the p-FET device(s) but not through the thicker self-aligned silicide in the n-FET device(s).

Abstract: In one aspect, a method for fabricating an electronic device includes the following steps. A wafer is provided having at least one first active area and at least one second active area defined therein. One or more p-FET/n-FET devices are formed in the active areas, each having a p-FET/n-FET gate stack and p-FET/n-FET source and drain regions. A self-aligned silicide is formed in each of the p-FET/n-FET source and drain regions, wherein the self-aligned silicide in each of the p-FET source and drain regions has a thickness T1 and the self-aligned silicide in each of the n-FET source and drain regions having a thickness T2, wherein T1 is less than T2. During a subsequent trench silicidation in the p-FET/n-FET source and drain regions, the trench silicide metal will diffuse through the thinner self-aligned silicide in the p-FET device(s) but not through the thicker self-aligned silicide in the n-FET device(s).

Abstract: Techniques for fabricating a field effect transistor (FET) device having a doped core and an undoped or counter-doped epitaxial shell are provided. In one aspect, a method of fabricating a FET device is provided. The method includes the following steps. A wafer is provided having a semiconductor material selected from the group consisting of silicon, silicon germanium and silicon carbon. At least one fin core is formed in the wafer. Ion implantation is used to dope the fin core. Corners of the fin core are reshaped to make the corners rounded or faceted. An epitaxial shell is grown surrounding the fin core, wherein the epitaxial shell includes a semiconductor material selected from the group consisting of silicon, silicon germanium and silicon carbon.

Abstract: In one aspect, a method for silicidation includes the steps of: (a) providing a wafer having at least one first active area and at least one second active area defined therein; (b) masking the first active area with a first hardmask; (c) doping the second active area; (d) forming a silicide in the second active area, wherein the first hardmask serves to mask the first active area during both the doping step (c) and the forming step (d); (e) removing the first hardmask; (f) masking the second active area with a second hardmask; (g) doping the first active area; (h) forming a silicide in the first active area, wherein the second hardmask serves to mask the second active area during both the doping step (g) and the forming step (h); and (i) removing the second hardmask.

Abstract: A method of fabricating a semiconducting device is disclosed. A carbon nanotube is formed on a substrate. A portion of the substrate is removed to form a recess below a section of the carbon nanotube. A doped material is applied in the recess to fabricate the semiconducting device. The recess may be between one or more contacts formed on the substrate separated by a gap.

Abstract: A method of fabricating a semiconducting device is disclosed. A carbon nanotube is formed on a substrate. A portion of the substrate is removed to form a recess below a section of the carbon nanotube. A doped material is applied in the recess to fabricate the semiconducting device. The recess may be between one or more contacts formed on the substrate separated by a gap.

Abstract: Techniques for fabricating a field effect transistor (FET) device having a doped core and an undoped or counter-doped epitaxial shell are provided. In one aspect, a method of fabricating a FET device is provided. The method includes the following steps. A wafer is provided having a semiconductor material selected from the group consisting of silicon, silicon germanium and silicon carbon. At least one fin core is formed in the wafer. Ion implantation is used to dope the fin core. Corners of the fin core are reshaped to make the corners rounded or faceted. An epitaxial shell is grown surrounding the fin core, wherein the epitaxial shell includes a semiconductor material selected from the group consisting of silicon, silicon germanium and silicon carbon.

Abstract: A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included.