Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.

Abstract: A composition including a first curable and a second curable material is provided. The first curable material may include an alcohol and an anhydride. At a first temperature (T1) the first curable material may cures and the second curable material may not cure. An associated method is provided.

Abstract: A syneretic composition is provided. The syneretic composition includes a first curable material comprising an alcohol and an anhydride, and a second curable material. At a first temperature (T1) the first curable material cures to form a polymeric matrix, and the second curable material has a degree of conversion that is less than 50 percent. The second curable material is liquid and capable of exuding from the polymeric matrix at a syneresis temperature (Tsyn). A method and an article are provided also.

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.

Abstract: An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone and a phenyl group, a curing agent, and a filler.

Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.

Abstract: Disclosed are hydrophilic functionalized silica compositions that are stable and do not show significant pH increases upon heat sterilization. Also provided are methods to make hydrophilic functionalized silica compositions by reacting acidic silica particles with hydrophilic organosilanes. Further provided are methods of separating components in a mixture using hydrophilic functionalized silica compositions.

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract: A new silicone condensation reaction, the condensation between an alkoxy silane or siloxane or a dihydric phenol and an organo-hydrosilane or siloxane and catalysts therefore is described and claimed.

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract: The present invention provides a novel method for the preparation of diorganosilanes by disproportionation of a hydridosiloxanes comprising at least one terminal SiH group and at least one siloxane bond in the presence of Lewis acid catalysts. The reaction is both selective and occurs under mild conditions. The triaryl borane, tris(petafluorophenyl)borane, is especially suited for use as a catalyst in the reaction. Organic catalysts such as tris(pentafluorophenyl)borane are typically preferred owing to their greater solubility and stability in the reaction mixture, relative to inorganic Lewis acid catalysts. The product, diorganosilane may be isolated from the product mixture by conventional techniques such as distillation.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A process for making a Si—H functional siloxane oligomer from the reaction between silicon hydride compositions and cyclic siloxane oligomer in the presence of a Lewis acid is provided. The Lewis acid is operable to interact with the hydrogen of the silicon hydride to promote ring opening of the cyclic siloxane oligomer and the insertion a siloxane oligomer segment between Si and H atom to thereby form the Si—H functional siloxane oligomer.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.

Abstract: Disclosed is a crosslinked polysiloxane network comprising both residual Si—H linkages and a Lewis acid catalyst, wherein the network is derived from a linear hydridosiloxane, a branched hydridosiloxane, a cyclic hydridosiloxane or a mixture of a linear hydridosiloxane or branched hydridosiloxane and a cyclic hydridosiloxane. Disclosed also is a method to produce the crosslinked polysiloxane network, alternatively accompanied by a silane with aliphatic, aromatic, or cycloaliphatic substituents by reacting in the presence of an effective amount of a Lewis acid catalyst a linear hydridosiloxane, a branched hydridosiloxane, a cyclic hydridosiloxane or a mixture of a linear hydridosiloxane or branched hydridosiloxane and a cyclic hydridosiloxane.

Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.

Abstract: A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.

Abstract: A battery operated hand-held dispenser which operates efficiently at lower power levels than prior art devices. The dispenser as included therein has spray, foam or stream, dispensing capabilities coupled with pump mechanisms, vent mechanisms and positive closures.