Abstract: A curable epoxy formulation comprising at least one epoxy monomer, at least one organofunctionalized colloidal silica, at least one alkyl onium cure catalyst, and optional reagents is provided in the present invention. Also disclosed are a packaged solid state device comprising an encapsulant comprising the aforementioned curable epoxy formulation.

Abstract: Siloxane cross-linked polyolefins provide for a composition that is more or less impermeable to gaseous sulfur compounds such as hydrogen sulfide providing for a protective coating for various articles of manufacture especially electronic components and a method of protecting various articles of manufacture from the effects of such gaseous sulfur compounds.

Abstract: A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.

Abstract: A new silicone condensation reaction, the condensation between an alkoxy silane or siloxane and an organo-hydrosilane or siloxane and catalysts therefore is described and claimed.

Abstract: A composition is provided in the present invention comprising functionalized colloidal silica. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. Further embodiments of the present invention include dispersions comprising the functionalized colloidal silica and methods for making.

Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A silicone composition that includes at least one functionalized polydiorganosiloxane, at least one cure catalyst, at least one reactive diluant, and at least one thermally conductive filler is provided in the present invention. Further embodiments of the present invention include a method for substantially increasing the thermal conductivity of a silicone composition and a thermal interface material containing the aforementioned silicone composition.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A process for the production of linear silanol stopped siloxanes comprising: a) conducting a ring opening polymerization of a hexaorganocyclotrisiloxane having the formula: D3=(R1R2SiO)3 where R1 and R2 are independently selected from the group of one to forty carbon atom monovalent radicals, in a solvent comprising a mixture of water and a volatile polar aprotic organic solvent in the presence of catalytic amounts of a strong base; b) neutralizing the catalytic amount of the strong base with a partially neutralized salt of a polybasic acid wherein the pH ranges from about 6 to about 8; and c) washing with water.

Abstract: A process for the production of linear silanol stopped siloxanes comprising: a) conducting a ring opening polymerization of a hexaorganocyclotrisiloxane having the formula:

Abstract: Cationically polymerizable or crosslinkable compositions including onium salts exhibit excellent homogeneity and photoactivity. These compositions are especially useful for the preparation of antiadhesive coatings. Methods for generating these antiadhesive coatings and articles bearing them are also described.

Abstract: A curable release coating composition is provided, comprising (a) a cationically curable functionalized polyorganosiloxane; (b) a photoinitiator; and (c) an adhesion promoter having the following formula (1): wherein R1 to R3 and R7 to R9 are independently alkyl, alkoxy, aryl, aryloxy or alkenyl hydrocarbon or halohydrocarbon groups having from 1 to 20 carbon atoms, R4 and R6 are are independently alkyl, aryl, or alkenyl hydrocarbon or halohydrocarbon groups having from 1 to 20 carbon atoms, and R5 is an alkyl, aryl, or alkenyl hydrocarbon or halohydrocarbon group having from 1 to 20 carbon atoms. Cured release coatings from theses compositions exhibit less rub off than other coatings, particularly on plastic substrates.

Abstract: Telechelic polymers are presented, comprising polysiloxane polymers having multiple epoxy end-groups of the formula G—R3—SiR1R2O(SiR1R2O)mSiR1R2—R3—G wherein each R1 and R2 are independently monovalent alkyl, alkoxy, aryl, aryloxy, and halohydrocarbon radicals having from 1 to 20 carbon atoms, halohydrocarbon radicals having the formula CnF2n+1CH2CH2— wherein n is an integer from 1 to 18; m is an integer in the range from 10 to about 1000; R3 is a divalent hydrocarbon radical having from 2 to 18 carbon atoms; and G is a silicon-based functionalized end group, wherein the functionalities are selected from the group consisting of epoxides, vinyl ethers, propenyl ether, or a combination thereof.

Abstract: Intermediate compositions comprising ethynylorgano polyorganosiloxanes are prepared by hydrosilylation of an olefinic hydroxy compound followed by reaction with a propargyl halide, or by hydrosilylation of a diethynyl compound. The intermediate compositions may be oxidatively coupled to form poly(conjugated diacetylenic)polyorganosiloxanes. The latter may be cured thermally or by radiation to form cured compositions useful as release coatings or conformal coatings.

Abstract: Compositions, comprising functionalized resins having the formula MxHMyRQ  (I) wherein x+y is in the range from 0.

Abstract: A mixture of a short chain linear phosphazene having the formula:X.sub.3-p (HO).sub.p P(NPX2).sub.m NP(O)X.sub.2,where X is a halogen selected from the group consisting of F, Cl, Br, and I, and m is an integer ranging from 0 to 6 and p is 0 or 1; anda linear sifoxane having a viscosity ranging from 1 to 5,000 centistokes is a catalyst for the polymerization, condensation, or redistribution of siloxanes; the process of making the catalyst and the process of using the catalyst.

Abstract: The compression set of elastomeric silicone compositions, addition cured injection moldable compositions, is reduced by the incorporation of nitrogen compounds wherein the nitrogen possesses at least one organic substituent and the nitrogen is tetravalent wherein the nitrogen is cationic. The adhesion of such compositions to thermoset or thermoplastic polymer substrates is improved by the addition of bis(trimethoxysilylpropyl)fumarate and a disilanol that may or may not contain alkenyl groups. The lubricity of such compositions is improved by the addition of compounds selected from the group consisting of diorganosiloxanes such as polydimethylsiloxanes, phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, fluorosilicones such as silicones containing trifluoropropyl substituted siloxanes, polydimethylsiloxanes, aliphatic and aromatic hydrocarbons that are liquid between 0.degree. C. and 100.degree. C.