Abstract: A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract: The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108. By interposing the silicone layer 111, it is possible to easily detach and attach the polishing pad 108. In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.

Abstract: A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract: An apparatus dresses a polishing pad. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member.

Abstract: A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liquid supplied from the liquid supply source, an electropneumatic regulator for supplying a pressurized gas from a gas source to the supply tube, and a pipe having no narrow portion for controlling a flow rate of the liquid. The supply tube is vertically disposed. The pressurized gas supply mechanism is operable to supply the pressurized gas to the supply tube so as to supply the liquid, filling the supply tube, to the polishing surface of the polishing table via the pipe and a polishing liquid supply pipe.

Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

Abstract: An apparatus for dressing a polishing pad is described. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing provided in the dresser flange and configured to allow the dressing member to tilt with respect to the dresser drive shaft, and a spring mechanism configured to generate a force against a tilting motion of the dressing member.

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liquid supplied from the liquid supply source, an electropneumatic regulator for supplying a pressurized gas from a gas source to the supply tube, and a pipe having no narrow portion for controlling a flow rate of the liquid. The supply tube is vertically disposed. The pressurized gas supply mechanism is operable to supply the pressurized gas to the supply tube so as to supply the liquid, filling the supply tube, to the polishing surface of the polishing table via the pipe and a polishing liquid supply pipe.