Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: A polishing apparatus comprises: a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises: air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the air exhaust conduits, respectively; and, a controller for independently controlling the valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections in the housing.

Abstract: The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid is supplied onto a polishing cloth attached on a turntable, and a semiconductor wafer to be polished is held by a top ring. The turntable and the top ring are rotated, respectively. A surface, to be polished, of the semiconductor wafer held by the top ring is pressed against the polishing cloth on the turntable to polish the semiconductor wafer. When a polished semiconductor wafer held by the top ring is to be removed from the polishing cloth on the turntable, a relative speed of the turntable and the top ring is increased as compared with a relative speed of the turntable and the top ring at a period of polishing.

Abstract: A substrate delivery mechanism comprises a top ring 10, a substrate loader 50 for loading a substrate Wf, and a pusher mechanism 20, wherein the substrate loader 50 comprises a top ring guide 53 and the pusher mechanism 20 comprises a top ring guide lifting table 21, in which the top ring guide 53 and the top ring guide lifting table 21 together form a sealed space M below the substrate Wf held by the top ring 10 in a condition where the substrate loader 50 is moved up by the pusher mechanism 20, wherein the substrate Wf is detached from the top ring 10 by exhausting the sealed space M while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring 10.

Abstract: A polishing apparatus comprises a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises a plurality of air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the respective air exhaust conduits, respectively; and, a control for independently controlling the respective valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections of the housing.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid Q is supplied onto a polishing cloth 11 attached on a turntable 1, and a semiconductor wafer W to be polished is held by a top ring 2. The turntable 1 and the top ring 2 are rotated, respectively. A surface, to be polished, of the semiconductor wafer W held by the top ring 2 is pressed against the polishing cloth 11 on the turntable 1 to polish the semiconductor wafer W. When the polished semiconductor wafer W held by said top ring 2 is to be removed from the polishing cloth 11 on the turntable 1, a relative speed of the turntable 1 and the top ring 2 is increased in comparison with a relative speed of the turntable 1 and the top ring 2 at a period of polishing.

Abstract: A mounting structure for mounting a polygon mirror on a rotating body includes a mirror seat formed in the rotating body for mounting the polygon mirror thereon and a fixing device for fixing the polygon mirror on the mirror seat. The mirror seat is formed on the periphery of the rotating body, and the polygon mirror includes in a top surface thereof an annular groove of a rectangular section at a position thereof a predetermined radius from the center of rotation of the rotating body. The fixing device comprises a planar ring-shaped anchoring member fixed to the rotating body and having along a peripheral portion thereof a plurality of downwardly extending conical or semispherical projections. The projections of the anchoring member engage with the annular groove in the polygon mirror and press against the upper edge of the inner periphery of the groove by point contact to thereby fix the polygon mirror in position.

Abstract: A polygon mirror mounting structure mounting a polygon mirror to an outer periphery of a rotor includes a mirror seating surface formed on the outer peripheral portion of the rotor for seating the polygon mirror thereon, and a retaining member having a ring-shaped configuration and a plurality of radially extending pawls on the outer periphery thereof for retaining the polygon mirror on the mirror seating surface. The pawls have an arcuate or tapered cross-sectional configuration and directly press the polygon mirror downwardly and radially outwardly, to thereby enable securing the polygon mirror to the rotor without providing through-holes for receiving screws in the polygon mirror.

Abstract: A polygon mirror is made up of a rotor including a ceramic ring, a yoke and a mirror surface formation member. The yoke and the mirror surface formation member are secured to an outer periphery of the ceramic ring. A radial dynamic pressure bearing is defined by an inner periphery of the ceramic ring and an outer periphery of the fixing shaft. A thrust dynamic pressure bearing is defined by both end surfaces of the ceramic ring and surfaces of a thrust plate fixedly secured to the stator and confronting both end surfaces of the ceramic ring. The ceramic ring, the yoke and the mirror surface formation member are integrated by the material making up the mirror surface formation member during the molding of the member to form the rotor.