Patents by Inventor Soichiro UMEDA

Soichiro UMEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210233885
    Abstract: A semiconductor device includes: an inner substrate on which a semiconductor chip is mounted, and has a surface on which terminals including electric path terminals are formed; a lead frame which has a chip connecting electrode portion which is electrically connected to a surface of the semiconductor chip via a conductive bonding member, substrate connecting electrode portions which are electrically connected to the electric path terminals of the inner substrate, and horizontal surface support portions which bulge to the outside from the chip connecting electrode portion or the substrate connecting electrode portions; and pin terminals which are mounted upright over the inner substrate in a direction perpendicular to flat surfaces of the substrate connecting electrode portions of the lead frame, wherein the horizontal surface support portions bulge to the outside of the inner substrate.
    Type: Application
    Filed: April 10, 2019
    Publication date: July 29, 2021
    Inventors: Soichiro UMEDA, Atsushi KYUTOKU
  • Patent number: 11075154
    Abstract: A semiconductor device includes: a lead frame that has one end in contact with the upper surface of the second terminal of the semiconductor element in the sealing portion, and that has the other end exposed from the sealing portion; and a control conductive bonding material that bonds between the upper surface of the second terminal of the semiconductor element and the one end of the lead frame, and the control conductive bonding material having electric conductivity.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 27, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Patent number: 11075091
    Abstract: In a first step of a method of manufacturing a semiconductor device, a portion to be the first lead frame is formed by selectively punching a metal plate, furthermore, notch portions depressed in the reference direction are formed on both side surfaces of a portion, of the first lead frame where the first bent portion is formed, in line contact with the first conductive layer in the reference direction; in the second step of the method, a first bent portion is formed by bending the one end of the first lead frame so as to protrude downward along the reference direction; and in the third step of the method, the upper surface of the first conductive layer and the lower surface of the first bent portion of the first lead frame are joined at the end of the substrate, by the first conductive bonding material, furthermore, the upper surface of the first conductive layer and the notch portions of the first bent portion are joined, by embedding a part of the first conductive bonding material in the notch portions.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 27, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Takenori Ishioka
  • Patent number: 11069538
    Abstract: The one end portion of the connector of the semiconductor device includes: a horizontal portion; a first inclined portion that is connected to the horizontal portion and is located closer to the tip end side of the one end than the horizontal portion, and the first inclined portion having a shape inclined downward from the horizontal portion; and a control bending portion that is connected to the first inclined portion and positioned at the tip of the one end portion, and the control bending portion bent downwardly along the bending axis direction. The lower surface of the control bending portion is in contact with an upper surface of the second terminal.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 20, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Publication number: 20210217721
    Abstract: A semiconductor device including a substrate; a chip on which a surface electrode is formed; and a lead. The lead includes a first electrode connecting portion disposed on the surface electrode and electrically connected to the surface electrode of the chip via a conductive bonding material; a second electrode connecting portion electrically connected to an electrode portion of a wiring pattern. A lead connected to the first electrode connecting portion and the second electrode connecting portion. The lead further has a thermal shrinking stress equalizing structure on a portion of an outer periphery of the first electrode connecting portion. The lead is configured to make a thermal shrinking stress applied to a conductive bonding material between the first electrode connecting portion and the surface electrode equal.
    Type: Application
    Filed: April 8, 2019
    Publication date: July 15, 2021
    Inventors: Soichiro UMEDA, Atsushi KYUTOKU
  • Patent number: 10957630
    Abstract: A semiconductor device includes: a circuit unit including a semiconductor chip; a plurality of pin terminals formed in a rod shape extending in a same direction from the circuit unit and electrically connected to the circuit unit; a sealing resin portion sealing the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit; and a plurality of covering resin portions integrally extending from an outer surface of the sealing resin portion from which second portions of the plurality of pin terminals protrude, the plurality of covering resin portions being formed in a cylindrical shape respectively covering base end portions of the second portions of the plurality of pin terminals, which are positioned on a side of the sealing resin portion.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: March 23, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Patent number: 10910292
    Abstract: An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90 and a connection body 50 having a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75. The head part 40 has a second projection protruding 42 toward the electronic element 95 and a first projection 41 protruding from the second projection 42 toward the electronic element 95.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: February 2, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Yuji Morinaga
  • Patent number: 10896868
    Abstract: An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: January 19, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Yuji Morinaga
  • Publication number: 20200395276
    Abstract: A semiconductor device includes: a substrate; a semiconductor element that disposed on the upper surface of the substrate; a sealing portion that seals the substrate and the semiconductor element; a first lead frame that has one end in contact with a upper surface of the first conductive layer at an end extending in the side direction of the upper surface of the substrate in the sealing portion, and has the other end exposed from the sealing portion; a first conductive bonding material that bonds between the upper surface of the first conductive layer and the lower surface side of the one end portion of the first lead frame at the end portion of the substrate, and has electrical conductivity.
    Type: Application
    Filed: October 26, 2017
    Publication date: December 17, 2020
    Inventors: Soichiro Umeda, Takenori Ishioka
  • Publication number: 20200395284
    Abstract: A semiconductor device includes: a lead frame that has one end in contact with the upper surface of the second terminal of the semiconductor element in the sealing portion, and that has the other end exposed from the sealing portion; and a control conductive bonding material that bonds between the upper surface of the second terminal of the semiconductor element and the one end of the lead frame, and the control conductive bonding material having electric conductivity.
    Type: Application
    Filed: October 26, 2017
    Publication date: December 17, 2020
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Publication number: 20200350236
    Abstract: A semiconductor device includes: a circuit unit including a semiconductor chip; a plurality of pin terminals formed in a rod shape extending in a same direction from the circuit unit and electrically connected to the circuit unit; a sealing resin portion sealing the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit; and a plurality of covering resin portions integrally extending from an outer surface of the sealing resin portion from which second portions of the plurality of pin terminals protrude, the plurality of covering resin portions being formed in a cylindrical shape respectively covering base end portions of the second portions of the plurality of pin terminals, which are positioned on a side of the sealing resin portion.
    Type: Application
    Filed: December 19, 2018
    Publication date: November 5, 2020
    Inventors: Soichiro UMEDA, Atsushi KYUTOKU
  • Publication number: 20200227279
    Abstract: In a first step of a method of manufacturing a semiconductor device, a portion to be the first lead frame is formed by selectively punching a metal plate, furthermore, notch portions depressed in the reference direction are formed on both side surfaces of a portion, of the first lead frame where the first bent portion is formed, in line contact with the first conductive layer in the reference direction; in the second step of the method, a first bent portion is formed by bending the one end of the first lead frame so as to protrude downward along the reference direction; and in the third step of the method, the upper surface of the first conductive layer and the lower surface of the first bent portion of the first lead frame are joined at the end of the substrate, by the first conductive bonding material, furthermore, the upper surface of the first conductive layer and the notch portions of the first bent portion are joined, by embedding a part of the first conductive bonding material in the notch portions.
    Type: Application
    Filed: October 26, 2017
    Publication date: July 16, 2020
    Inventors: Soichiro Umeda, Takenori Ishioka
  • Publication number: 20200227280
    Abstract: The one end portion of the connector of the semiconductor device includes: a horizontal portion; a first inclined portion that is connected to the horizontal portion and is located closer to the tip end side of the one end than the horizontal portion, and the first inclined portion having a shape inclined downward from the horizontal portion; and a control bending portion that is connected to the first inclined portion and positioned at the tip of the one end portion, and the control bending portion bent downwardly along the bending axis direction. The lower surface of the control bending portion is in contact with an upper surface of the second terminal.
    Type: Application
    Filed: October 26, 2017
    Publication date: July 16, 2020
    Inventors: Soichiro Umeda, Atsushi Kyutoku
  • Publication number: 20200219797
    Abstract: An electronic device has a sealing part 90, a first terminal 11 projecting outward from a first side surface of the sealing part 90, a second terminal 13 projecting outward from a second side surface different from the first side surface of the sealing part 90, an electronic element 95 provided inside the sealing part 90, and a head part 40 coupled to the first terminal 11 and the second terminal and connected to a front surface of the semiconductor element 95 via a conductive adhesive 75.
    Type: Application
    Filed: February 20, 2017
    Publication date: July 9, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro UMEDA, Yuji MORINAGA
  • Patent number: 10615092
    Abstract: An electronic device has a substrate 5, a first conductor layer 71 provided on the substrate 5, a second conductor layer 72 provided on the substrate 5; an electronic element provided on the first conductor layer 71, and a sealing part 90 covering the substrate 5, the first conductor layer 71, the second conductor layer 72, and the electronic element 95. The first conductor layer 71 is not provided on a virtual straight line VL including the second conductor layer 72 in an in-plane direction of the substrate 5. The second conductor layer 72 is sealed inside the sealing part 90 and covered only with the sealing part 90.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: April 7, 2020
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Yuji Morinaga
  • Patent number: 10600712
    Abstract: An electronic device has a substrate 5, a first electric element 91 provided on a first conductor layer 71, a second electric element 92 provided on the first electric element 91, and a connector 50 having a base end part 45 provided on a second conductor layer 72 and a head part 40 provided on a front surface electrode 92a of the second electric element 92 via a conductive adhesive 75. An area of the base end part 45 placed on the second conductor layer 72 is larger than an area of the head part 40 placed on the second electric element 92. The base end part 45 is located at a side of the substrate 5 compared with the head part 40, and a gravity center position of the connector 50 is at a side of the base end part 45 of the connector 50.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: March 24, 2020
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Yuji Morinaga, Soichiro Umeda
  • Publication number: 20200011904
    Abstract: An electronic device has a sealing part 90, a first main terminal 11 protruding outward from the sealing part 90, a second main terminal 12 protruding outwardly from the sealing part, an electronic element 95 provided in the sealing part and having a front surface electrically connected to the first main terminal 11 and a back surface electrically connected to the second main terminal 12, a head part 40 connected to the front surface of the electronic element 95, a sensing terminal 13 protruding to an outside from the sealing part 90 and used for sensing and a connection part 35 integrally formed with the head part 40 and electrically connected to the sensing terminal 13. A current flowing through the sensing terminal 13 and the connection part 35 among a sensing current path does not overlap a main current path flowing through the second main terminal 12, the electronic element 95 and the first main terminal 11.
    Type: Application
    Filed: February 20, 2017
    Publication date: January 9, 2020
    Applicant: SHiNDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro UMEDA, Yuji MORINAGA
  • Publication number: 20190378782
    Abstract: An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90 and a connection body 50 having a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75. The head part 40 has a second projection protruding 42 toward the electronic element 95 and a first projection 41 protruding from the second projection 42 toward the electronic element 95.
    Type: Application
    Filed: February 20, 2017
    Publication date: December 12, 2019
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro UMEDA, Yuji MORINAGA
  • Publication number: 20190318982
    Abstract: An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.
    Type: Application
    Filed: February 20, 2017
    Publication date: October 17, 2019
    Applicant: SHIDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro UMEDA, Yuji MORINAGA
  • Patent number: D920937
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 1, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Atsushi Kyutoku