Power module device containing semiconductor elements

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Description

1. Power module device containing semiconductor elements

1.1 : Front

1.2 : Back

1.3 : Top

1.4 : Bottom

1.5 : Right

1.6 : Left

1.7 : Perspective

The broken lines showing portions of the power module device containing semiconductor elements form no part of the claim.

This article is a power module device containing semiconductor elements; this product is used to control and/or supply electric power.

Claims

The ornamental design for a power module device containing semiconductor elements, as shown and described.

Referenced Cited
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Patent History
Patent number: D920937
Type: Grant
Filed: Mar 29, 2019
Date of Patent: Jun 1, 2021
Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. (Tokyo)
Inventors: Soichiro Umeda (Saitama), Atsushi Kyutoku (Saitama)
Primary Examiner: Rhea Shields
Application Number: 35/508,564