Abstract: A heterocyclic compound is represented by Formula 1. A light-emitting device includes a first electrode, a second electrode disposed on the first electrode, and one or more organic layers interposed between the first electrode and the second electrode. One or more of the organic layers includes the heterocyclic compound. One or more of the organic layer may further include a compound represented by Formula 3.

Abstract: A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elasticity of the silicon pad.

Abstract: Disclosed are an organic light emitting device including a first heterocyclic compound to a third heterocyclic compound, a composition for an organic material layer of an organic light emitting device, and a method for manufacturing an organic light emitting device. The organic light emitting device and the composition for an organic material layer thereof according to an exemplary embodiment of the present application can not only lower the driving voltage of the device and improve the light efficiency, but also improve the thermal stability of the compound, thereby improving the service life characteristics of the device.

Abstract: A method of manufacturing a gamma-germanium selenide (?-GeSe) layer may include coating a first surface of a base layer with a catalytic metal, providing alpha-germanium selenide (?-GeSe) at a first position in a processing space and providing the base layer at a second position in the process space, which is spaced apart from the first position in the processing space, heating the first position in the processing space to a first temperature, supplying gas from the first position to the second position in the processing space, and depositing ?-GeSe on the first surface of the base layer. The base layer may include a crystalline material having a crystal system that is hexagonal.

Abstract: A test apparatus for testing image sensor packages. The test apparatus is configured to stably vacuum-absorb an image sensor package in a surface manner, wherein when a vacuum adsorption sheet having a package adsorption hole in the shape of a wide square surface is coupled to the bottom of the floating plate at which an upper socket is seated, a vacuum line is formed by connecting the cover vacuum hole of the pusher, the board vacuum hole of the upper circuit board, the plate vacuum hole of the floating plate, and the package adsorption hole of the vacuum adsorption sheet together.

Abstract: A test apparatus for testing a mobile AP provided with an AP package and a memory package according to the disclosure is configured to include: a lower test socket mounted on a tester and connected to the AP package put on an upper side thereof; an upper test socket mounted with the memory package and connected to the AP package put on a lower side thereof; an upper mechanism configured to accommodate the memory package and mounted with the upper test socket; and a heat dissipation device disposed on the upper mechanism. Since heat generated in the AP package can be dissipated through forming of a frame of the upper test socket as an inelastic conductive housing of a metal material having high thermal conductivity, a test can be performed in a step before stacking the AP package and the memory package on each other.

Abstract: The present disclosure relates to a heterocyclic compound represented by Chemical Formula 1, an organic light emitting device including the same and a composition for an organic material layer. Each substituent of Chemical Formula 1 has the same definition as described in the description of the disclosure.

Abstract: An apparatus for testing a package-on-package (POP) type semiconductor package that includes a vacuum picker that has vacuum holes that communicate with an insulation pad hole, the vacuum picker includes a body part made of silicone or rubber, and a socket contact part and a package contact part made of any one of polyimide film, engineering plastic, and synthetic resin, and the socket contact part is attached to a mounting groove by an adhesive tape, such that the vacuum picker is coupled to an upper socket.

Abstract: According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate which is connected to the second plate by a hinge and of which the angle formed with the first plate changes according to rotation with respect to the second plate, wherein the second plate and/or the third plate includes a composite material sheet, and at least a portion of the hinge can be positioned inside the composite material sheet. Other various embodiments are possible.

Abstract: A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elasticity of the silicon pad.

Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.